Non-contact measurement of a stress in a film on a substrate转让专利
申请号 : US15722645
文献号 : US10553623B2
文献日 : 2020-02-04
发明人 : Wojciech Jan Walecki , Oanh Nguyen
摘要 :
A method for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include measuring first topography data of a substrate having a thin-film deposited thereupon. The method may also include comparing the first topography data with second topography data of the substrate that is measured prior to thin-film deposition. The method may further include obtaining a vertical displacement of the substrate based on the comparison between the first topography data and the second topography data. The method may also include detecting a stress value in the thin-film deposited on the substrate based on a fourth-order polynomial equation and the vertical displacement.