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    • 75. 发明公开
    • 유량조정장치 및 가공장치
    • 放电调节器和处理设备
    • KR1020030015860A
    • 2003-02-25
    • KR1020020048066
    • 2002-08-14
    • 고이께 산소 고교 가부시끼가이샤
    • 후루조아키라
    • B23K37/00
    • B23K26/382B23K26/0096B23K26/0665B23K26/1435B23K26/1476B23K26/40B23K2203/04B23K2203/05B23K2203/10B23K2203/12B23K2203/42B23K2203/50
    • PURPOSE: To provide a discharge regulator which is low in a cost without being accompanied by upsizing and is capable of regulating a flow rate with high reliability and a processing equipment using this discharge regulator. CONSTITUTION: The discharge regulator A has a plurality of orifices 1a to 1f which have different calibers, respectively are previously grasped flow rates and are respectively opened and closed by opening/closing members 2a to 2f, primary piping 3 which is connected to the respective orifices 1a to 1f and supplies the gases regulated to a prescribed pressure and secondary piping 4 which is connected to the respective orifices 1a to 1f and aggregates the gas past the opened orifices. One or a plurality of the orifices 1a to 1f are selected and the corresponding opening/closing members 2a to 2f are opened so as to satisfy the previously assigned flow rates.
    • 目的:提供一种低成本的放电调节器,而不伴随增大并能够调节高可靠性的流量和使用该放电调节器的处理设备。 构成:排气调节器A具有分别具有不同口径的多个孔口1a〜1f,分别是预先掌握的流量,分别由打开/关闭部件2a至2f打开和关闭,主管道3连接到相应的孔口 1a至1f,并且将调节到规定压力的气体和连接到各个孔1a至1f的二次管道4供给,并将气体聚集通过打开的孔。 选择一个或多个孔1a至1f,并打开相应的打开/关闭部件2a至2f以满足先前分配的流量。
    • 76. 发明公开
    • 웨이퍼에 인식 부호를 마킹하는 방법 및 장치
    • 用于标记识别标记的方法和装置
    • KR1020020019649A
    • 2002-03-13
    • KR1020000052609
    • 2000-09-06
    • 삼성전자주식회사
    • 정실근박경신조희윤박병철
    • H01L21/00
    • H01L21/67282B23K26/1435B23K26/1438B23K26/147H01L2223/54493
    • PURPOSE: A method and an apparatus for marking an identification mark on a wafer are provided to remove easily particles generated from a marking process of an identification mark by using an injection device. CONSTITUTION: A support portion(12) is used for loading a wafer(10). The support portion(12) is formed with a spin chuck for receiving the wafer(10) and defining a marking region of an identification mark. A laser beam irradiation portion(14) is used for irradiating a laser beam on a predetermined portion of the wafer(10) and marking the identification mark. An Nd/YAG laser of a dot matrix mode is used in the laser beam irradiation portion(14). The identification mark of the dot type is formed on the wafer(10). An injection portion(20) is used for injecting a gas to the marking region of the identification mark. The injection portion(20) is formed with a nozzle(201), valves(207,209), a pipe(203), and an injection motor(205).
    • 目的:提供一种用于在晶片上标记识别标记的方法和装置,以通过使用注射装置容易地除去由识别标记的标记过程产生的颗粒。 构成:支撑部分(12)用于装载晶片(10)。 支撑部分(12)形成有用于接收晶片(10)并限定识别标记的标记区域的旋转卡盘。 激光束照射部分(14)用于将激光束照射在晶片(10)的预定部分上并标记识别标记。 在激光束照射部分(14)中使用点阵模式的Nd / YAG激光器。 点状的识别标记形成在晶片(10)上。 注射部分(20)用于将气体注入识别标记的标记区域。 注射部分(20)形成有喷嘴(201),阀(207,209),管(203)和注射马达(205)。