会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 84. 发明公开
    • Method for processing terminal in bonded substrate
    • 韦尔法罕zur Bearbeitung eines Anschlusses一个einem Verbundsubstrat
    • EP2147899A1
    • 2010-01-27
    • EP09164934.3
    • 2009-07-08
    • Mitsuboshi Diamond Industrial Co., Ltd.
    • Sunata, TomihisaShimizu, SeijiOtoda, Kenji
    • C03B33/02C03B33/07C03B33/09C03B33/03B28D5/00
    • B28D5/0011B23K26/364B23K26/40B23K2203/172B23K2203/50B65G2249/04C03B33/033C03B33/076C03B33/091H01L2924/0002H01L2924/00
    • Object To provide a method for processing a terminal through a laser breaking process according to which processing is carried out along a line, not a curve, even when the exposed width is small, so that the terminal can be processed without fail.
      Means for Achieving Object In a method for processing a terminal in a bonded substrate according to which a first divided surface B2, B3 is created in a first substrate 31 and a second substrate 34, so that the cut surfaces are in the same plane, and after that, the portion of the first substrate which covers a terminal 33 is removed from the first divided surface of the first substrate as an end piece 35 with a width of 10 mm or less, so that a second divided surface B1 is created and the terminal is exposed, a first scribe line S1, a second scribe line S2 and a third scribe line S3 are created through a laser scribing process, and then, a breaking process is carried out along the second scribe line S2 and the third scribe line S3, so that the first divided surface B2, B3 is created, and then, a laser breaking process is carried out along the first scribe line S1 and the end piece 35 is removed.
    • 对象为了提供一种通过激光断裂处理终端的方法,根据该方法,即使暴露的宽度较小,也可以沿着线而不是曲线进行处理,使得终端可以被无损处理。 实现目的的手段在用于处理键合衬底中的端子的方法中,根据该方法,在第一衬底31和第二衬底34中形成第一分割表面B2,B3,使得切割表面在同一平面中,以及 之后,将覆盖端子33的第一基板的部分作为宽度为10mm以下的端片35从第一基板的第一分割面移除,从而形成第二分割面B1, 端子被曝光,通过激光划线处理创建第一划线S1,第二划线S2和第三划线S3,然后沿着第二划线S2和第三划线S3进行断开处理 ,从而形成第一分割面B2,B3,然后沿着第一划线S1进行激光断裂处理,并且除去端片35。