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1. 发明专利

JP6113154B2 基板上に均一な金属膜を形成するための方法及び装置有权
公开(公告)号：JP6113154B2
公开(公告)日：2017-04-12
申请号：JP2014516156
申请日：2011-06-24
申请人：エーシーエムリサーチ (シャンハイ) インコーポレーテッド
发明人：ワンホイ , マーユエ , ホーチュアン , ワンシ
IPC分类号： C25D17/06 , C25D17/08 , C25D5/20
CPC分类号： C25D21/10 , C25D17/00 , C25D17/001 , C25D17/002 , C25D17/008 , C25D17/06 , C25D5/08 , C25D5/18 , C25D5/20 , C25D7/12 , C25D7/123 , H01L21/02 , H01L21/67138

2. 发明专利

JP2015062211A 接触装置审中-公开
标题翻译：联系人
公开(公告)号：JP2015062211A
公开(公告)日：2015-04-02
申请号：JP2013196306
申请日：2013-09-23
申请人：日本電産リード株式会社
发明人：中川隆 , 松川俊英
IPC分类号： H01L21/60
CPC分类号： B25B28/00 , H01L21/67132 , H01L21/67138 , H01L21/67144 , H01L24/01
摘要：【課題】可動部材(あるいは可動部材に取り付けた別の部材)が対象物に加圧力ゼロで接触する状態を実現可能な接触装置を提供する。【解決手段】接触装置1が備える接触ヘッド部11は、接触ロッド21と、ハウジング22と、推力エア経路32と、キャンセルエア経路33と、を備える。ハウジング22は、接触ロッド21を静圧エア軸受によって直線移動可能に支持し、これにより接触ロッド21は対象物3に接触することができる。推力エア経路32に圧縮空気を供給すると、対象物3に近づく方向の力が接触ロッド21に作用し、キャンセルエア経路33に圧縮空気を供給すると、反対方向の力が接触ロッド21に作用する。制御部12は、接触ロッド21が対象物3に接触した状態で、推力エア経路32の圧縮空気の圧力と、キャンセルエア経路33の圧縮空気の圧力と、を制御することで、対象物3に対する加圧力をゼロにする。【選択図】図1
摘要翻译：要解决的问题：提供一种接触器，其能够实现使可移动部件（或附接到可移动部件的其他部件）与零压力的物体接触的状态。解决方案：设置在接触器上的接触头11 1包括接触杆21，壳体22，推力空气通道32和取消空气通道33.壳体22通过静压空气轴承支撑接触杆21，以便可线性移动，从而接触杆 21可以与物体3接触。当压缩空气被供给到推力空气通道32中时，接近对象3的方向上的力被施加到接触杆21，并且当压缩空气被供给时进入取消空气通道33中，向接触杆21施加相反方向的力。控制部分12控制推力空气通道32的压缩空气的压力和压缩空气的压力空气通道33处于t 接触杆21与物体3接触，使施加于物体3的压力为零。

4. 发明专利

JP5436055B2 Connection device and connection method of lead 有权
公开(公告)号：JP5436055B2
公开(公告)日：2014-03-05
申请号：JP2009136325
申请日：2009-06-05
申请人：芝浦メカトロニクス株式会社
发明人：悦郎南浜 , 久杉沼 , 治雄森 , 光弘岡澤
IPC分类号： H01L31/042
CPC分类号： H01L31/188 , H01L21/67138 , Y02E10/50

5. 发明专利

JP2010283217A Lead wire connection apparatus and lead wire connection method 有权
标题翻译：铅线连接装置和导线连接方法
公开(公告)号：JP2010283217A
公开(公告)日：2010-12-16
申请号：JP2009136325
申请日：2009-06-05
申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： MINAMIHAMA ETSURO , SUGINUMA HISASHI , MORI HARUO , OKAZAWA MITSUHIRO
IPC分类号： H01L31/04
CPC分类号： H01L31/188 , H01L21/67138 , Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a lead wire connection apparatus capable of automatically connecting a lead wire to cells formed on a substrate.
SOLUTION: The lead wire connection apparatus includes: a conveyor 6 for transporting a substrate with one face having cells thereon up; lead wire supply units 11 through 13 arranged laterally in a direction crossing a transport direction of the substrate transported and positioned by the conveyor; feeding chucks 27, each of which pulls a lead wire out of one lead wire supply unit along the direction crossing the transport direction of the substrate; a tape attaching means of attaching multiple tape pieces, which are obtained by cutting a conductive tape made of an adhesive thermosetting resin into pieces having a predetermined length, onto the lower surface, facing the upper surface of the substrate, of the lead wire pulled out of one lead wire supply unit, at the intervals corresponding to those of the cells; and pressing tools, which are used when the lead wire having the tape pieces attached thereon by the tape attaching means is pulled out above the substrate by the feeding chuck in the direction crossing the transport direction of the substrate, for pressing and heating the upper surfaces of the portions, having the tape pieces attached thereon, of the lead wire so as to connect the lead wire to the cells through the tape pieces.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够将引线自动连接到形成在基板上的单元的引线连接装置。导线连接装置包括：输送机6，用于将具有单元的一个面的基板输送到其上; 引线供给单元11至13沿与输送机输送和定位的基板的输送方向交叉的方向横向排列; 每个馈送卡盘27沿着与基板的输送方向交叉的方向从一个引线供给单元中拉出引线; 将通过将由粘合性热固性树脂制成的导电带切割成具有预定长度的片材而获得的多个带片的带子附接装置引导到引出线的面向衬底的上表面的下表面上一个引线供应单元，以与单元格相对应的间隔; 以及当通过带附接装置附着在其上的带片的引线被馈送卡盘沿着与基板的输送方向交叉的方向从基板上方拉出时使用的按压工具，用于加压和加热上表面的导线的带状部分，以便通过带片将引线连接到电池。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2008544475A Semiconductor element joining method using the semiconductor element junction device, and this 有权
公开(公告)号：JP2008544475A
公开(公告)日：2008-12-04
申请号：JP2007554197
申请日：2006-06-07
申请人：松下電器産業株式会社
发明人：康晴上野 , 智仕田 , 浩幸内藤 , 誠森川
IPC分类号： H01L21/607 , H01L21/60
CPC分类号： B23K20/10 , H01L21/67138 , H01L21/67144 , H01L24/75 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/75 , H01L2224/75301 , H01L2224/81205 , H01L2224/81801 , H01L2924/00014 , H01L2924/01025 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/09701 , H01L2924/15787 , H01L2924/00 , H01L2224/05599
摘要：【課題】シェア強度を所定の値以上に維持することができる半導体素子接合装置及びこれを用いた半導体素子接合方法を提供する。
【解決手段】半導体素子(10)と基板(11)との間にバンプ(14)を介在させた状態で、半導体素子(10)を基板(11)側へ押込む押込み手段(15)と、半導体素子(10)及び基板(11)の少なくとも一方に超音波振動を印加することにより半導体素子(10)と基板(11)とを相対的に振動させる超音波振動印加手段(16)と、超音波振動を印加した時点から半導体素子(10)を所定量押込むまでに要する時間を計測する時間計測手段(17)と、時間計測手段(17)により計測された時間に基づいて、次回の接合時における超音波振動の出力を制御する制御手段(18)とを含む半導体素子接合装置(1)とする。
【選択図】図３

7. 发明专利

JP4143788B2 Ball mount devices and how to mount 有权
公开(公告)号：JP4143788B2
公开(公告)日：2008-09-03
申请号：JP22072999
申请日：1999-08-04
申请人：澁谷工業株式会社
发明人：智木下
IPC分类号： H01L21/60 , H05K3/34 , B23K3/06 , G01V8/10 , H01L21/00
CPC分类号： H01L21/67138 , B23K3/0607 , B23K3/0623 , B23K2201/42
摘要： Conveying path is provided along elongated direction of the workpiece (4). The projection direction of inspection light is distributed such that ball supply tray (2) and mount head (1) are arranged parallel to elongated direction of workpiece. Ball inspection apparatus (3) which performs inspection of ball adsorbed by mount head, is distributed perpendicular to elongated direction of workpiece. An independent claim is also included for ball mount procedure.

8. 发明专利

JP4071227B2 Bonding apparatus 有权
公开(公告)号：JP4071227B2
公开(公告)日：2008-04-02
申请号：JP2004282461
申请日：2004-09-28
申请人：株式会社新川
发明人：前田　　徹
IPC分类号： H01L21/60
CPC分类号： H01L21/67138 , H01L24/78 , H01L2224/78 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , Y10T156/17 , Y10T156/1702 , H01L2224/48 , H01L2224/45099 , H01L2224/05599

9. 发明专利

JP2007329491A Electric contact structure from flexible wire 审中-公开
标题翻译：电磁接触结构从柔性线
公开(公告)号：JP2007329491A
公开(公告)日：2007-12-20
申请号：JP2007189655
申请日：2007-07-20
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： KHANDROS IGOR Y , MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , GRUBE GARY W
IPC分类号： G01R1/073 , H01L21/60 , B23K1/00 , B23K20/00 , B23K31/02 , C23C18/16 , C25D5/08 , C25D5/16 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/06 , G01R1/067 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/58 , H01L21/603 , H01L21/607 , H01L21/66 , H01L21/68 , H01L23/02 , H01L23/12 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/16 , H01L25/18 , H01R9/00 , H01R12/71 , H01R13/05 , H01R13/24 , H01R29/00 , H01R33/74 , H01R33/76 , H01R107/00 , H05H1/18 , H05K1/14 , H05K1/18 , H05K3/20 , H05K3/24 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
摘要： PROBLEM TO BE SOLVED: To provide a restorable contact structure suited for temporary connection with an electronic component such as a semiconductor die, subjected to aging and functional tests. SOLUTION: The contact structure having restorable and tractable properties for various electronic components is formed by bonding a free end of a wire 502 to a substrate 508, disposing the wire to form a wire stem having an elastic form, cutting the wire stem and providing a protective film by at least one layer of a certain material on the wire stem 530. In an illustrative embodiment: the free end of the wire stem is bonded to a contact region on the substrate; the wire stem is constructed to have an elastic form; the wire stem is cut by discharge to be free-standing; and applying, by deposition, the protective film to the free-standing wire stem. Various materials are disclosed as materials to be used for the wire stem (functioning as a foothold) and the protective film (functioning as an upper structure over the foothold). COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供适于与诸如半导体管芯的电子部件临时连接的可恢复的接触结构，进行老化和功能测试。解决方案：通过将导线502的自由端接合到基板508上来形成具有用于各种电子部件的可恢复和易于处理的特性的接触结构，布置线以形成具有弹性形式的线杆，切割线杆并且通过线杆530上的某种材料的至少一层提供保护膜。在说明性实施例中：线杆的自由端结合到衬底上的接触区域; 线杆构造成具有弹性形式; 线杆由排放口切割成独立的; 并通过沉积将保护膜施加到独立的线杆上。公开了各种材料作为用于线杆（用作支脚）的材料和保护膜（用作支脚上的上部结构）。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2007173846A Semiconductor package assembly 有权
标题翻译： SEMICONDUCTOR PACKAGE ASSEMBLY
公开(公告)号：JP2007173846A
公开(公告)日：2007-07-05
申请号：JP2006355406
申请日：2006-12-28
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： KHANDROS IGOR Y , GETAN L MATTHEW
IPC分类号： H01L23/12 , H01L25/18 , C23C18/16 , C25D7/12 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/66 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/07 , H01L25/16 , H01R4/02 , H01R9/00 , H01R12/52 , H01R33/76 , H05K1/14 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10
CPC分类号： H05K7/1069 , B23K2201/40 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06761 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L21/67138 , H01L21/6715 , H01L22/20 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/06153 , H01L2224/1134 , H01L2224/13083 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/136 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85045 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49169 , Y10T29/49217 , Y10T29/49224 , H01L2924/00 , H01L2224/48 , H01L2224/81205
摘要： PROBLEM TO BE SOLVED: To make it possible to use a contact structure directly attached to active silicon equipment, and especially, an elastic contact structure. SOLUTION: In a semiconductor package assembly 611, a board 612 which comprises conductive contact pads on a first surface and a second surface and which is composed of an insulating material is contained. In addition, a plurality of semiconductor devices 621 which comprise contact pads faced with the contact pads on the first surface and the second surface of the board 612 are contained. In addition, elastic contact structures 626 by which the contact pads of the semiconductor devices 621 and contact pads held by the board 612 are electrically connected to each other, and which are used to support the semiconductor devices in positions at intervals from the surface of the board 612 in such a way that the semiconductor devices 621 exist on a first parallel plane and a second parallel plane on both sides of the board 612 are contained. In addition, contact means 616 which are held by the board 612 and which form electrical contacts with the semiconductor devices 621 via the contact structures 626 are contained. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：使得可以使用直接连接到有源硅设备的接触结构，特别是弹性接触结构。解决方案：在半导体封装组件611中，包含在第一表面和第二表面上包括由绝缘材料构成的导电接触焊盘的板612。此外，包含面对面板612的第一表面和第二表面上的接触焊盘的接触焊盘的多个半导体器件621。另外，由半导体器件621的接触焊盘和由板612保持的接触焊盘的弹性接触结构626彼此电连接，并且用于将半导体器件从位于板612，使得半导体器件621存在于第一平行平面上，并且包含在板612两侧的第二平行平面。此外，包含由板612保持并且经由接触结构626与半导体器件621形成电接触的接触装置616。版权所有（C）2007，JPO＆INPIT

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