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11. 发明申请

US20090189055A1 Image sensor and fabrication method thereof 审中-公开
标题翻译：图像传感器及其制造方法
公开(公告)号：US20090189055A1
公开(公告)日：2009-07-30
申请号：US12010535
申请日：2008-01-25
申请人： Chien-Pang Lin , Chung-Jung Hsu , Shiu-Fang Yen , Wu-Chieh Liu
发明人： Chien-Pang Lin , Chung-Jung Hsu , Shiu-Fang Yen , Wu-Chieh Liu
IPC分类号： H01L27/00
CPC分类号： H01L27/14629 , H01L27/14621 , H01L27/14627 , H01L27/14685
摘要： Embodiments disclose an image sensor device, comprising a substrate comprising a plurality of photosensor cells located therein or thereon, a plurality of optical guide structures corresponding to the photosensor cells respectively, and a stacked layer surrounding the optical guide structures, comprising a plurality of top portions with sharp corners adjacent to the top edges of the optical guide structures.
摘要翻译：实施方式公开了一种图像传感器装置，包括：基板，包括位于其中或其上的多个光电传感器单元，分别对应于所述光电传感器单元的多个光学引导结构和围绕所述光导结构的层叠层，所述层叠层包括多个顶部部分其具有与光导结构的顶部边缘相邻的尖角。

12. 发明申请

US20090101947A1 Image sensor device and fabrication method thereof 审中-公开
标题翻译：图像传感器装置及其制造方法
公开(公告)号：US20090101947A1
公开(公告)日：2009-04-23
申请号：US11907793
申请日：2007-10-17
申请人： Chien-Pang Lin , Chin-Poh Pang , Wu-Chieh Liu , Shiu-Fang Yen
发明人： Chien-Pang Lin , Chin-Poh Pang , Wu-Chieh Liu , Shiu-Fang Yen
IPC分类号： H01L31/062 , H01L21/00
CPC分类号： H01L27/14625 , H01L27/14621 , H01L27/14627 , H01L27/14685
摘要： An image sensor device is disclosed. The image sensor device comprises a substrate having a pixel array therein. A first transparent layer with a curved surface is disposed on the substrate. A micro lens array is conformally disposed on the curved surface of the first transparent layer and corresponds to the pixel array in the substrate. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.
摘要翻译：公开了一种图像传感器装置。图像传感器装置包括其中具有像素阵列的衬底。具有弯曲表面的第一透明层设置在基板上。微透镜阵列保形地设置在第一透明层的弯曲表面上并对应于衬底中的像素阵列。本发明还公开了一种用于图像传感器装置的电子组件及其制造方法。

13. 发明申请

US20090079461A1 Test socket and test board for wafer level semiconductor testing 有权
公开(公告)号：US20090079461A1
公开(公告)日：2009-03-26
申请号：US11902309
申请日：2007-09-20
申请人： Sheng-Feng Lu , Shih-Ming Chen , Chien-Pang Lin , Ming-Hsun Sung
发明人： Sheng-Feng Lu , Shih-Ming Chen , Chien-Pang Lin , Ming-Hsun Sung
IPC分类号： G01R1/04 , G01R31/26
CPC分类号： G01R1/0408 , G01R1/0466 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2924/15311 , H01L2924/00
摘要： A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws.

14. 发明申请

US20070267647A1 Optoelectronic device chip having a composite spacer structure and method making same 有权
标题翻译：具有复合间隔结构的光电器件芯片及其制造方法
公开(公告)号：US20070267647A1
公开(公告)日：2007-11-22
申请号：US11438128
申请日：2006-05-22
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： H01L33/00
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译：公开了一种光电器件芯片及其制造方法。芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。

15. 发明申请

US20140124519A1 HEAT INSULATING CUP SLEEVE 审中-公开
标题翻译：加热绝缘杯套筒
公开(公告)号：US20140124519A1
公开(公告)日：2014-05-08
申请号：US14070411
申请日：2013-11-01
申请人： CHIEN PANG LIN
发明人： CHIEN PANG LIN
IPC分类号： B65D25/36
CPC分类号： B65D81/3876 , B65D81/3886
摘要： This invention provides a heat insulating cup sleeve formed by folding a blank and including a first heat insulating sheet having a first holding portion, a first extending portion, and a first fold line and a second heat insulating sheet having a second holding portion, a second extending portion, and a second fold line. The second fold line is connected with the first holding portion, and the first fold line is connected with the second holding portion. The first holding portion and the second holding portion are capable of being folded downward along the second fold line and the first fold line, respectively, to form an opening. When a cup is inserted into the opening, the first holding portion and the second holding portion press against an outer surface of the cup.
摘要翻译：本发明提供一种隔热杯套筒，其通过折叠毛坯而形成，并且包括具有第一保持部分，第一延伸部分和第一折叠线的第一隔热片和具有第二保持部分的第二绝热片，延伸部分和第二折叠线。第二折线与第一保持部连接，第一折线与第二保持部连接。第一保持部分和第二保持部分能够分别沿着第二折叠线和第一折叠线向下折叠以形成开口。当杯子插入开口时，第一保持部分和第二保持部分压靠杯的外表面。

16. 发明申请

US20110235950A1 Foldable Bag 审中-公开
标题翻译：可折叠袋
公开(公告)号：US20110235950A1
公开(公告)日：2011-09-29
申请号：US13073965
申请日：2011-03-28
申请人： CHIEN-PANG LIN
发明人： CHIEN-PANG LIN
IPC分类号： B65D30/20
CPC分类号： A45C7/0077
摘要： A foldable bag, made of a flexible sheet or board like material having a plurality of fold lines, includes a bottom wall, two side walls respectively connected to two opposite sides of the bottom wall, and two connecting walls respectively connected with the side walls and the bottom wall to define a containing space therein. The side wall has a first fold line parallel to the bottom wall and is capable of being folded towards the center of the foldable bag. The connecting wall has two second fold lines respectively extended along the diagonal lines and intersected with each other, and a third fold line parallel to the bottom wall and extended through the intersection point of the two second lines, wherein the ends of the third fold line are connected to the respective ends of the first fold lines, wherein the second fold lines and the third fold lines are capable of being folded toward the center of the foldable bag.
摘要翻译：由具有多个折叠线的柔性片或类似材料制成的可折叠袋包括底壁，分别连接到底壁的两个相对侧的两个侧壁和分别与侧壁连接的两个连接壁和所述底壁在其中限定容纳空间。侧壁具有平行于底壁的第一折叠线并且能够朝向可折叠袋的中心折叠。连接壁具有分别沿着对角线延伸并彼此相交的两条第二折线，以及平行于底壁并延伸穿过两条第二线的交点的第三折线，其中第三折线的端部连接到第一折叠线的相应端部，其中第二折叠线和第三折叠线能够朝向可折叠袋的中心折叠。

17. 发明授权

US07433555B2 Optoelectronic device chip having a composite spacer structure and method making same 有权
标题翻译：具有复合间隔结构的光电器件芯片及其制造方法
公开(公告)号：US07433555B2
公开(公告)日：2008-10-07
申请号：US11438128
申请日：2006-05-22
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： G02B6/12 , G02B6/26
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译：公开了一种光电器件芯片及其制造方法。芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。

18. 发明申请

US20070279520A1 IMAGE SENSING DEVICE AND PACKAGE METHOD THEREFOR 审中-公开
标题翻译：图像感测装置及其包装方法
公开(公告)号：US20070279520A1
公开(公告)日：2007-12-06
申请号：US11676813
申请日：2007-02-20
申请人： Hsiao-Wen Lee , Chih-Kung Chang , Pai-Chun Peter Zung , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Chih-Kung Chang , Pai-Chun Peter Zung , Chien-Pang Lin
IPC分类号： H04N5/238
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H01L2224/13 , H04N5/2257
摘要： A package module for an image sensing device is provided. The package module includes a substrate having thereon a photoelectric element array, a first optical element array formed on the photoelectric element array, a package lid having thereon a second optical element array opposite to the first optical element array and having an arrangement corresponding to that of the first optical element array; and a spacer disposed on a bonding area between the package lid and the substrate for adjusting a distance between the package lid and the substrate.
摘要翻译：提供了一种用于图像感测装置的封装模块。封装模块包括其上具有光电元件阵列的基板，形成在光电元件阵列上的第一光学元件阵列，封装盖，其上具有与第一光学元件阵列相对的第二光学元件阵列，并且具有与第一光学元件阵列; 以及间隔件，设置在封装盖和基板之间的接合区域上，用于调节封装盖和基板之间的距离。

19. 发明授权

US06522321B1 Roller retainer for a third axis of a mouse 失效
标题翻译：用于鼠标第三轴的滚轮保持架
公开(公告)号：US06522321B1
公开(公告)日：2003-02-18
申请号：US09702610
申请日：2000-11-01
申请人： Le-Tien Chen , Chien Pang Lin
发明人： Le-Tien Chen , Chien Pang Lin
IPC分类号： G09G508
CPC分类号： G06F3/03543 , G06F3/0362
摘要： A roller retainer for the third axis of a mouse comprises a seat, an upper cover and a roller seat. The seat has a housing, a circuit board and other components. The circuit board is installed with a microswitch and an IR module seat. A via hole is formed at the middle portion of the roller seat. The via hole serves to place a roller seat therein. A rear end of the roller seat is buckled to the rear inner end of the upper cover, and the roller seat may be like a suspending arm. The roller seat has a function of plastic resilient and therefore, no elastic spring is necessary. The roller seat is installed with an upper cover and other components is still installed in the seat. Therefore, no space in the circuit board is occupied and thus cost is reduced and material can be prepared easily.
摘要翻译：用于鼠标的第三轴的滚子保持器包括座椅，上盖和滚子座。座椅有一个外壳，一个电路板和其他部件。电路板安装有微动开关和IR模块座。在辊座的中间部形成有通孔。通孔用于在其中放置滚子座。辊座的后端被扣住到上盖的后内端，并且辊座可以像悬臂一样。辊座具有塑性弹性的功能，因此不需要弹性弹簧。滚轮座安装有上盖，其他部件仍安装在座椅上。因此，电路板中没有空间被占用，因此成本降低，并且可以容易地制备材料。

20. 发明授权

US06056458A Computer keyboard with Z-axis input means 有权
标题翻译：带Z轴输入的电脑键盘
公开(公告)号：US06056458A
公开(公告)日：2000-05-02
申请号：US291011
申请日：1999-04-14
申请人： Chien Pang Lin
发明人： Chien Pang Lin
IPC分类号： G06F3/02 , B41J5/28
CPC分类号： G06F3/0213
摘要： A computer keyboard with Z-axis input means is characterized in that at least one scrolling means compatible with that of a mouse, a cursor moving means and at least one mouse button are integrated on a keyboard with or without multimedia hotkeys. The novel keyboard consists of a traditional key matrix, a control unit, and a mouse equivalent unit. The mouse equivalent unit further consists of scrolling means, pointing means, and mouse button means, all of which are electricaly connected to the control unit. Through the all-in-one keyboard, user not only can perform typing task, operate mouse functions, but also scroll windows client area up and down, and left and right if a second scrolling means is provided.
摘要翻译：具有Z轴输入装置的计算机键盘的特征在于，具有或不具有多媒体热键的至少一个与鼠标，滚动移动装置和至少一个鼠标按键兼容的滚动装置被集成在键盘上。新颖的键盘由传统的按键矩阵，控制单元和鼠标等效单元组成。鼠标当量单元还包括滚动装置，指示装置和鼠标按钮装置，所有这些装置都与电气连接到控制单元。通过一体式键盘，用户不仅可以执行打字任务，操作鼠标功能，还可以上下滚动Windows客户端区域，如果提供第二个滚动方式，则可以向左和向右滚动。

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