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    • 27. 发明申请
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US20050285217A1
    • 2005-12-29
    • US11006665
    • 2004-12-08
    • Yasutoshi OkunoMasaru Yamada
    • Yasutoshi OkunoMasaru Yamada
    • H01L21/3105H01L21/76H01L21/762H01L27/02H01L29/00
    • H01L21/31053H01L21/76229H01L27/0207
    • A semiconductor device includes a circuit formation region which is formed in a semiconductor substrate and includes a plurality of element formation regions surrounded by isolation regions, respectively. A stress effect relief region of a predetermined width is formed around the circuit formation region to relieve a stress effect of the isolation regions on the operation characteristics of elements formed in the element formation regions and a plurality of dummy features are formed in the stress effect relief region and other part of the circuit formation region than the element formation regions at predetermined distances, the dummy features having the same composition as the element formation regions and predetermined planar dimensions. The predetermined planar dimensions of the dummy features are defined by longitudinal and transverse dimensions most frequently found in the plurality of element formation regions formed in the circuit formation region or selected dimensions of the element formation regions. The predetermined distances between the dummy features are specified as the minimum allowable value in respect of the manufacture of the elements.
    • 半导体器件包括电路形成区域,其形成在半导体衬底中并且包括被隔离区包围的多个元件形成区域。 在电路形成区域的周围形成预定宽度的应力作用缓和区域,以减轻隔离区域对形成在元件形成区域中的元件的操作特性的应力作用,并且在应力效应释放中形成多个虚拟特征 区域和电路形成区域的其他部分比元件形成区域预定距离,虚拟特征具有与元件形成区域相同的组成和预定的平面尺寸。 虚拟特征的预定平面尺寸由在电路形成区域中形成的多个元件形成区域或元件形成区域的选定尺寸中最常见的纵向和横向尺寸限定。 虚拟特征之间的预定距离被指定为关于元件的制造的最小允许值。
    • 29. 发明授权
    • Gas sensor for vehicle engine having a double-pipe cover
    • 具有双管盖的车用发动机气体传感器
    • US06279376B1
    • 2001-08-28
    • US09405837
    • 1999-09-27
    • Masaru YamadaKengo ToguchiHidetaka HayashiSatoshi NakamuraHiroo ImamuraDaisuke Makino
    • Masaru YamadaKengo ToguchiHidetaka HayashiSatoshi NakamuraHiroo ImamuraDaisuke Makino
    • G01N27407
    • G01N27/4077
    • A gas sensor has a housing, a gas sensing element held by the housing and having a gas contact portion and an element cover for covering the gas contact portion. The element cover has a double pipe structure formed by layering an outer pipe and an inner pipe. The outer pipe has an outer bottom portion having an outer bottom hole and an outer side portion having plural outer side holes. The inner pipe has an inner bottom portion having an inner bottom hole and an inner side portion having plural inner side holes disposed not to overlap the outer side holes. A spacing D of 0.2-1.0 mm is formed between the outer bottom portion and the inner bottom portion. As a result, flow resistance in the spacing D is relatively high, and the sample gas sufficiently and more smoothly flows toward the gas sensing element. Therefore, the element cover prevents condensed water from entering the inside of the gas sensor and improves response of the gas sensor.
    • 气体传感器具有壳体,由壳体保持的气体感测元件,并具有气体接触部分和用于覆盖气体接触部分的元件盖。 元件盖具有通过分层外管和内管形成的双管结构。 外管具有外底部的外底部和具有多个外侧孔的外侧部。 内管具有内底部底部和内侧部分,内侧部分具有多个设置成不与外侧孔重叠的内侧孔。 在外底部和内底部之间形成间距D为0.2-1.0mm。 结果,间隔D中的流动阻力相对较高,并且样品气体充分且更平稳地流向气体感测元件。 因此,元件盖防止冷凝水进入气体传感器的内部并改善气体传感器的响应。