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    • 43. 发明授权
    • Method of making circuitized substrate
    • 制造电路化基板的方法
    • US07381587B2
    • 2008-06-03
    • US11324432
    • 2006-01-04
    • Robert M. JappJohn M. LaufferVoya R. MarkovichWilliam E. Wilson
    • Robert M. JappJohn M. LaufferVoya R. MarkovichWilliam E. Wilson
    • H01L21/00
    • H05K3/4641H05K3/429H05K2203/068
    • A method of making a circuitized substrate and an electrical assembly utilizing same in which the substrate is comprised of at least two sub-composites in which the dielectric material of at least one of these sub-composites is heated during bonding (e.g., lamination) to the other sufficiently to cause the dielectric material to flow into and substantially fill openings in a conductive layer for the bonded structure. Conductive thru-holes are formed within the bonded structure to couple selected ones of the structure's conductive layers. Formation of an electrical assembly is possible by positioning one or more electrical components (e.g., semiconductor chips or chip carriers) on the final structure and electrically coupling these to the structure's external circuitry.
    • 一种制造电路化基板的方法和使用其的电气组件,其中基板由至少两个亚复合材料构成,其中这些亚复合材料中的至少一个的介电材料在粘合(例如,层压)期间被加热到 另一个足以使电介质材料流入并基本上填充用于接合结构的导电层中的开口。 导电通孔形成在接合结构内,以耦合所选择的结构导电层。 通过将一个或多个电气部件(例如,半导体芯片或芯片载体)定位在最终结构上并将其电耦合到结构的外部电路,可以形成电组件。