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61. 发明授权

US09121585B2 Optoelectronic component and method for the production thereof 有权
标题翻译：光电元件及其制造方法
公开(公告)号：US09121585B2
公开(公告)日：2015-09-01
申请号：US13634692
申请日：2011-03-07
申请人： Gertrud Kräuter
发明人： Gertrud Kräuter
IPC分类号： F21S4/00 , F21V21/00 , F21V15/06 , H01L23/06 , H01L33/56 , F21V29/15 , H01L33/48
CPC分类号： F21V29/15 , H01L23/06 , H01L33/486 , H01L33/56 , H01L2224/48091 , H01L2933/0033 , Y10T29/49002 , H01L2924/00014
摘要： An optoelectronic component includes a housing which includes a first partial region having a first thermoplastic material crosslinked by irradiation and a second partial region having a second thermoplastic material, a recess in the housing, and a radiation-emitting device disposed in the recess.
摘要翻译：光电子部件包括壳体，其包括具有通过照射交联的第一热塑性材料的第一部分区域和具有第二热塑性材料的第二部分区域，壳体中的凹部以及设置在凹部中的辐射发射器件。

62. 发明申请

US20150187677A1 Lid for Integrated Circuit Package 审中-公开
标题翻译：集成电路封装盖
公开(公告)号：US20150187677A1
公开(公告)日：2015-07-02
申请号：US14644412
申请日：2015-03-11
申请人： Texas Instruments Incorporated
发明人： Dwayne Richard Shirley
IPC分类号： H01L23/373 , B32B37/12 , B32B37/18 , H01L23/06
CPC分类号： H01L23/3735 , B32B37/12 , B32B37/18 , B32B2457/00 , H01L23/06 , H01L23/3675 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/00
摘要： A lid has a heat conductive substrate, a crystallized amorphous silicon layer and a native silicon oxide layer formed on the crystallized amorphous silicon layer. Another embodiment has a lid with a copper substrate and a native silicon oxide layer connected to the substrate by at least one intermediate layer. A method of providing a heat path through an integrated circuit package includes providing a substrate with an exterior layer of native silicon oxide and interfacing the layer of native silicon oxide with a layer of thermal interface material.
摘要翻译：盖具有导热基板，结晶非晶硅层和形成在结晶非晶硅层上的天然氧化硅层。另一实施例具有带有铜衬底和通过至少一个中间层连接到衬底的天然氧化硅层的盖。提供通过集成电路封装件的热路径的方法包括向衬底提供天然硅氧化物的外部层并且将天然氧化硅层与热界面材料层接合。

63. 发明授权

US09023442B2 Metallization for a cavity housing and a nonmagnetic sealed cavity housing 有权
标题翻译：空腔壳体和非磁性密封腔体的金属化
公开(公告)号：US09023442B2
公开(公告)日：2015-05-05
申请号：US13173017
申请日：2011-06-30
申请人： Richard Gruenwald
发明人： Richard Gruenwald
IPC分类号： A47G19/22 , H01L23/06 , H01L23/055 , H01L23/10 , H01L23/15 , H03H9/10 , H01L23/00 , H03H9/05
CPC分类号： H01L23/06 , B81C1/00269 , B81C2203/019 , H01L23/055 , H01L23/10 , H01L23/15 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/09701 , H03H9/059 , H03H9/1071 , Y10T428/131 , Y10T428/24975 , Y10T428/265 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a metallization for a housing, for example for surface wave components, for use in strong magnetic fields as well as a nonmagnetic hermetically sealed cavity housing.
摘要翻译：本发明涉及一种用于壳体的金属化，例如用于表面波部件，用于强磁场以及非磁性密封腔体壳体。

64. 发明授权

US09013036B2 Sealing member and electronic device using the same 有权
标题翻译：密封件和使用其的电子设备
公开(公告)号：US09013036B2
公开(公告)日：2015-04-21
申请号：US14024535
申请日：2013-09-11
申请人： Wistron Corp.
发明人： Chih-Feng Yeh
IPC分类号： H01L23/06 , H05K5/06 , F15B1/00
CPC分类号： H05K5/06 , F15B1/00 , H05K5/061 , Y10T428/24612
摘要： A sealing member is disclosed, which includes a first structure and a second structure. The first structure includes a groove with an opening towards the outside of the sealing member, wherein the second structure is disposed in the groove. The first structure includes a first material, and the second structure includes a second material, wherein the water absorption rate of the second material is greater than the water absorption rate of the first material. Also, an electronic device using the sealing member is disclosed.
摘要翻译：公开了一种密封构件，其包括第一结构和第二结构。第一结构包括具有朝向密封构件的外部的开口的凹槽，其中第二结构设置在凹槽中。第一结构包括第一材料，第二结构包括第二材料，其中第二材料的吸水率大于第一材料的吸水率。另外，公开了使用该密封部件的电子装置。

65. 发明授权

US08975735B2 Redistribution board, electronic component and module 有权
标题翻译：再分配板，电子元件和模块
公开(公告)号：US08975735B2
公开(公告)日：2015-03-10
申请号：US13962622
申请日：2013-08-08
申请人： Infineon Technologies AG
发明人： Ralf Otremba , Josef Höglauer
IPC分类号： H01L23/02 , H01L23/34 , H01L23/06 , H01L21/00 , H05K7/00 , H01L23/522 , H01L29/778
CPC分类号： H01L23/5226 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49827 , H01L23/49838 , H01L29/2003 , H01L29/778 , H01L2224/48091 , H05K1/0262 , H05K1/181 , H05K2201/0761 , H05K2201/093 , H05K2201/09309 , H05K2201/09336 , H05K2201/09972 , H01L2924/00014
摘要： A redistribution board includes a first conductive layer including a redistribution structure for low voltage signals, a second conductive layer including a redistribution structure for high voltage signals, and a non-conductive layer. The second conductive layer is spaced apart from the first conductive layer by the non-conductive layer. The redistribution board further includes a conductive connector extending from a mounting surface of the redistribution board to the second conductive layer. The conductive connector is surrounded by a low voltage trace of the first conductive layer.
摘要翻译：再分配板包括：第一导电层，包括用于低电压信号的再分配结构;第二导电层，包括用于高电压信号的再分配结构;以及非导电层。第二导电层通过非导电层与第一导电层间隔开。再分配板还包括从再分布板的安装表面延伸到第二导电层的导电连接器。导电连接器被第一导电层的低电压迹线围绕。

66. 发明申请

US20140353810A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20140353810A1
公开(公告)日：2014-12-04
申请号：US14024212
申请日：2013-09-11
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Masafumi Sugimoto , Eiichi Hosomi , Atsushi Murakawa , Kazumi Takahashi , Kazuhito Higuchi , Susumu Obata
IPC分类号： H01L23/06 , H01L21/52 , H01L23/48 , H01L23/00
CPC分类号： H01L23/06 , H01L21/50 , H01L21/52 , H01L21/561 , H01L23/04 , H01L23/481 , H01L23/552 , H01L24/02 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/80 , H01L24/83 , H01L24/92 , H01L2224/02313 , H01L2224/02372 , H01L2224/0239 , H01L2224/11334 , H01L2224/11849 , H01L2224/13024 , H01L2224/131 , H01L2224/29011 , H01L2224/29022 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29294 , H01L2224/29339 , H01L2224/30051 , H01L2224/30505 , H01L2224/32225 , H01L2224/32245 , H01L2224/73253 , H01L2224/83191 , H01L2224/83447 , H01L2224/83801 , H01L2224/8385 , H01L2224/92 , H01L2924/1616 , H01L2924/16195 , H01L2924/16738 , H01L2924/16747 , H01L2924/19104 , H01L2924/0105 , H01L2924/00014 , H01L2924/014 , H01L2924/01014 , H01L2924/01005 , H01L2224/83 , H01L21/304 , H01L21/76898 , H01L2224/0231 , H01L2224/11 , H01L2924/01013 , H01L2924/01029
摘要： A semiconductor device includes a semiconductor substrate provided with a predetermined element and having wirings formed on its main surface connected to back wirings by a plurality of through silicon vias (TSVs), and a conductive cover which covers the main surface of the semiconductor substrate. The semiconductor substrate and the conductive cover are bonded to each other with a conductive bonding member. The TSV bonded to the conductive cover with the conductive bonding member is connected to an external electrode pad to which a ground potential is supplied.
摘要翻译：半导体器件包括设置有预定元件的半导体衬底，并且通过多个穿通硅通孔（TSV）在其主表面上形成连接到背布线的布线，以及覆盖半导体衬底的主表面的导电盖。半导体衬底和导电覆盖层用导电接合构件彼此接合。通过导电接合部件与导体盖接合的TSV与供给接地电位的外部电极焊盘连接。

67. 发明授权

US08841761B2 Organic light emitting diode display 有权
标题翻译：有机发光二极管显示
公开(公告)号：US08841761B2
公开(公告)日：2014-09-23
申请号：US13910042
申请日：2013-06-04
申请人： Samsung Display Co., Ltd.
发明人： Hwan-Jin Kim
IPC分类号： H01L23/18 , H01L23/053 , H01L23/06 , H01L27/32 , H01L27/30 , G02F1/1335 , H01L51/52
CPC分类号： H01L27/32 , G02F1/133608 , H01L27/307 , H01L51/0096 , H01L51/5237 , H01L51/524 , Y02E10/549
摘要： An organic light emitting diode (OLED) display according to an exemplary embodiment includes: a display substrate; an organic light emitting element on the substrate; a sealing member covering the organic light emitting element; a sealant formed between a surrounding portion of the display substrate and a surrounding portion of the sealing member; and an impact absorption layer under the display substrate, wherein an area ratio of the impact absorption agent in the impact absorption layer increases from the surrounding portion of the display substrate to a center of the display substrate such that the impact absorption ratio of the outer portion of the surrounding impact absorption layer is higher than the impact absorption ratio of the center impact absorption layer, and accordingly, damage to the surrounding portion of the display substrate that is weak against external impact may be prevented.
摘要翻译：根据示例性实施例的有机发光二极管（OLED）显示器包括：显示基板; 基板上的有机发光元件; 覆盖有机发光元件的密封构件; 形成在所述显示基板的周围部分与所述密封部件的周围部分之间的密封剂; 以及在显示基板下方的冲击吸收层，其中冲击吸收剂的冲击吸收剂的面积比从显示基板的周围部分向显示基板的中心增加，使得外部的冲击吸收率周围的冲击吸收层的冲击吸收层的冲击吸收率高于冲击吸收层的冲击吸收率，因此可以防止显示基板的周围部分对外部冲击的损坏。

68. 发明授权

US08836100B2 Slotted configuration for optimized placement of micro-components using adhesive bonding 有权
标题翻译：开槽配置，用于使用粘合剂粘合优化微组件的放置
公开(公告)号：US08836100B2
公开(公告)日：2014-09-16
申请号：US12955011
申请日：2010-11-29
申请人： Mary Nadeau , Vipulkumar Patel , Prakash Gothoskar , John Fangman , John Matthew Fangman , Mark Webster
发明人： Mary Nadeau , Vipulkumar Patel , Prakash Gothoskar , John Fangman , John Matthew Fangman , Mark Webster
IPC分类号： H01L23/06 , G02B6/38
CPC分类号： G02B7/025 , G02B6/4228 , G02B6/4239 , G02B7/003 , H01L23/345 , H01L23/544 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2223/54426 , H01L2224/26175 , H01L2224/2919 , H01L2224/32225 , H01L2224/83121 , H01L2224/83143 , H01L2224/83192 , H01L2224/83234 , H01L2224/83385 , H01L2224/83862 , H01L2924/14 , Y10T428/24479 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and “shape” of an adhesive “dot” so as to quickly and accurately attach a micro-component to the surface of a substrate. The slots are formed (preferably, etched) in the surface of the substrate in a manner that lends itself to reproducible accuracy from one substrate to another. Other slots (“channels”) may be formed in conjunction with the bonding slots so that extraneous adhesive material will flow into these channels and not spread into unwanted areas.
摘要翻译：用于改善组件中微组件的粘合附着的装置利用形成在用于支撑微组件的衬底顶表面中的多个平行布置的槽。这些槽用于控制粘合剂“点”的流动和“形状”，以便将微组件快速且精确地附着在基板的表面上。在衬底的表面中形成（优选地，蚀刻）狭槽，使其自身具有从一个衬底到另一个衬底的可再现精度。其它槽（“通道”）可以与结合槽结合形成，使得外来粘合剂材料将流入这些通道并且不会扩散到不需要的区域。

69. 发明授权

US08803312B2 Method for manufacturing semiconductor devices having a glass substrate 有权
标题翻译：具有玻璃基板的半导体器件的制造方法
公开(公告)号：US08803312B2
公开(公告)日：2014-08-12
申请号：US13966492
申请日：2013-08-14
申请人： Infineon Technologies Austria AG
发明人： Carsten von Koblinski , Gerald Lackner , Karin Schrettlinger , Markus Ottowitz
IPC分类号： H01L23/12 , H01L23/06
CPC分类号： H01L23/49811 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/78 , H01L23/3107 , H01L23/3135 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L29/7802 , H01L29/8611 , H01L2224/02122 , H01L2224/03015 , H01L2224/03019 , H01L2224/0332 , H01L2224/0345 , H01L2224/0346 , H01L2224/03462 , H01L2224/03464 , H01L2224/03848 , H01L2224/04042 , H01L2224/05124 , H01L2224/05139 , H01L2224/05166 , H01L2224/05553 , H01L2224/05554 , H01L2224/05571 , H01L2224/05647 , H01L2224/0603 , H01L2224/06181 , H01L2224/32225 , H01L2224/3223 , H01L2224/32245 , H01L2224/48227 , H01L2224/4823 , H01L2224/48247 , H01L2224/48463 , H01L2224/4903 , H01L2224/73265 , H01L2224/94 , H01L2924/00014 , H01L2924/01068 , H01L2924/01078 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10335 , H01L2924/10338 , H01L2924/10351 , H01L2924/10373 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , H01L2924/00012 , H01L2224/03 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate is provided which has at least one of cavities and openings at the bonding surface. The first glass substrate is bonded to the first surface of the semiconductor wafer such that the metal pads are arranged within respective cavities or openings of the first glass substrate. The second surface of the semiconductor wafer is machined. At least one metallization region is formed on the machined second surface of the semiconductor wafer.
摘要翻译：公开了半导体器件的制造方法。提供了具有与第一表面相对的第一表面和第二表面的半导体晶片。提供了在接合表面处具有至少一个空腔和开口的第一玻璃基板。将第一玻璃基板接合到半导体晶片的第一表面，使得金属焊盘被布置在第一玻璃基板的相应空腔或开口内。加工半导体晶片的第二表面。在半导体晶片的加工的第二表面上形成至少一个金属化区域。

70. 发明授权

US08772918B2 Semiconductor die package and embedded printed circuit board 有权
标题翻译：半导体封装和嵌入式印刷电路板
公开(公告)号：US08772918B2
公开(公告)日：2014-07-08
申请号：US12029502
申请日：2008-02-12
申请人： Shi-Yun Cho
发明人： Shi-Yun Cho
IPC分类号： H01L23/06
CPC分类号： H01L23/3677 , H01L23/3675 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor die package having an enhanced degree of heating radiation from the semiconductor, thereby reducing mechanical and electrical failure from excessive temperatures. A semiconductor die has circuit patterns formed thereon; a bump pad deposited on the semiconductor die and supporting at least one of the bumps electrically connected to the circuit patterns; and a radiating pad formed on an upper surface of the bump pad such that the radiating pad surrounds the bumps. An embedded printed circuit substrate includes a radiating pad formed on the bump pad to surround the bumps; and a core substrate has a through-hole formed in the core substrate, that extends from an upper surface of the core substrate to a lower surface thereof. The semiconductor die is deposited on the upper surface of the core substrate such that the bumps extend through the through-hole.
摘要翻译：具有来自半导体的增强的加热辐射度的半导体管芯封装，从而减少过度温度的机械和电气故障。半导体管芯具有形成在其上的电路图案; 沉积在所述半导体管芯上并且支撑电连接到所述电路图案的所述凸块中的至少一个的凸块; 以及辐射焊盘，其形成在所述凸块焊盘的上表面上，使得所述辐射焊盘围绕所述凸块。嵌入式印刷电路基板包括形成在凸块焊盘上以围绕凸块的辐射焊盘; 并且芯基板具有形成在芯基板中的通孔，其从芯基板的上表面延伸到其下表面。半导体管芯沉积在芯基板的上表面上，使得凸块延伸穿过通孔。

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