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    • 81. 发明授权
    • Process ESD protection devices for use with antifuses
    • 处理用于反熔丝的ESD保护装置
    • US5498895A
    • 1996-03-12
    • US290029
    • 1994-08-12
    • Wenn-Jei Chen
    • Wenn-Jei Chen
    • H01L23/525H01L23/60H01L27/01H01L29/00
    • H01L23/5252H01L23/60H01L2924/0002H01L2924/3011
    • A process electrostatic discharge ("ESD") protection device is incorporated on a chip with the antifuses that it is designed to protect and is formed as close in time as possible to the deposition of the antifuse material layer (the layer being protected) so that ESD protection is available at all practical stages of processing. According to a first aspect of the invention, an ESD protection device is formed by exposing edges of an antifuse bottom electrode during the antifuse cell open mask/etch step, It is biased on during processing. A sharp corner of the electrode and a deep aspect ratio provide degrade antifuse performance for the protection cell (resulting in reduced breakdown voltage and increased leakage current) and, as designed, the protection cell will rupture before other cells because it has a lower breakdown voltage. Once the protection cell ruptures, it will continue to conduct and protect other antifuses from ESD damage. When processing is complete, the protection cell is biased off and has no effect on the remaining antifuses. According to a second aspect of the present invention, a deep valley topography is created under a bottom electrode of the protection cell. Because the cell is deeper than the other antifuse cells while retaining the same cell opening size, the step coverage within the protection cell will be reduced and the protection cell will have a lower breakdown voltage than the regular antifuse cells formed with it. In all other respects, it operates as set forth regarding the first aspect of the invention.
    • 过程静电放电(“ESD”)保护器件被集成在芯片上,其抗反熔丝被设计成保护,并且尽可能接近于反熔丝材料层(被保护层)的沉积,以使得 在所有实际处理阶段均可提供ESD保护。 根据本发明的第一方面,通过在反熔丝电极开放掩模/蚀刻步骤期间暴露反熔丝底部电极的边缘来形成ESD保护器件,在处理期间偏置ESD保护器件。 电极的尖角和深的纵横比为保护电池提供降低的反熔丝性能(导致降低的击穿电压和增加的漏电流),并且根据设计,保护电池将在其他电池之前破裂,因为其具有较低的击穿电压 。 一旦保护电池破裂,它将继续导电并保护其他反熔丝免受ESD损坏。 当处理完成时,保护单元被偏置,并且对剩余的反熔丝没有影响。 根据本发明的第二方面,在保护电池的底部电极下形成深谷形状。 因为电池在保持相同的电池开口尺寸的同时比其他反熔丝电池更深,所以保护电池内的台阶覆盖将被降低,并且保护电池具有比与其形成的常规反熔丝电池相比更低的击穿电压。 在所有其他方面,其操作如关于本发明的第一方面所述。
    • 85. 发明授权
    • Circuits for ESD protection of metal-to-metal antifuses during processing
    • 加工过程中金属对金属反熔丝的ESD保护电路
    • US5369054A
    • 1994-11-29
    • US87942
    • 1993-07-07
    • Yeouchung YenWenn-Jei ChenSteve S. ChiangAbdul R. Forouhi
    • Yeouchung YenWenn-Jei ChenSteve S. ChiangAbdul R. Forouhi
    • H01L23/525H01L23/60H01L21/44H01L21/48
    • H01L23/5252H01L23/60H01L2924/0002
    • A static-charge protection device for an antifuse includes an additional second-sized aperture smaller in area than the antifuse apertures disposed in the same inter-electrode dielectric layer. Antifuse material is disposed in the second-sized aperture, and the upper electrode extends over the second aperture as well as the first aperture. A preferred process for fabricating the protection device utilizes the step of forming the smaller apertures and forming their antifuse material layers simultaneously with forming the antifuse apertures.A static-charge protection device for an antifuse device includes an additional second-sized aperture larger in area than the first-sized antifuse apertures. Metal plug material is deposited and etched back. A layer of amorphous silicon antifuse material is formed and defined over the first and second sized apertures, the portion formed over the larger partially filled antifuse protection device cell being thinner.
    • 用于反熔丝的静电保护装置包括比设置在相同的电极间介电层中的反熔丝孔小的面积小的附加的第二尺寸孔。 防污材料设置在第二尺寸的孔中,并且上电极在第二孔和第一孔上延伸。 用于制造保护装置的优选方法利用形成较小孔径并与形成反熔丝孔同时形成其反熔丝材料层的步骤。 用于反熔丝装置的静电保护装置包括具有比第一尺寸的反熔丝孔大的面积的额外的第二尺寸孔。 将金属塞材料沉积并回蚀刻。 在第一和第二尺寸的孔上形成并限定一层非晶硅反熔丝材料,形成在较大部分填充的反熔丝保护器件单元上的部分较薄。
    • 86. 发明授权
    • Testability architecture and techniques for programmable interconnect
architecture
    • 可测试架构和可编程互连架构技术
    • US5365165A
    • 1994-11-15
    • US889839
    • 1992-05-26
    • Khaled A. El-AyatJia-Hwang Chang
    • Khaled A. El-AyatJia-Hwang Chang
    • G01R31/28G01R31/3185H03K19/177G01R31/02
    • H03K19/17764G01R31/2884G01R31/318516H03K19/17704H03K19/17736H03K19/17744
    • An integrated circuit having a plurality of input/output modules, each of which has input/output modules including an input module section having an input node connected to a unique input/output pin on the integrated circuit and an output node communicating with a unique first internal node in the integrated circuit, and an output module section having an input node communicating with a unique second internal node in the integrated circuit and an output node communicating with the unique input/output pin. Each input/output module is programmable by a user such that its function may be defined as an input module, an output module, or a bi-directional module. The integrated circuit further has two states, a first unprogrammed state where none of the functions of the input/output modules have been defined, and a second, programmed state in which the functions of the input/output modules have been defined by either enabling or disabling the output section of the input/output module. Circuitry for testing the input module section of one of the input/output modules in the unprogrammed state comprises means for temporarily disabling the output section of a unique one of the input/output modules, means for temporarily connecting the output node of the input module section to a test node on said integrated circuit, and means for communicating the state of the test node to a test input/output pin on the integrated circuit.
    • 一种具有多个输入/输出模块的集成电路,每个输入/输出模块具有输入/输出模块,该输入/输出模块包括具有连接到集成电路上的唯一输入/输出引脚的输入节点的输入模块部分和与唯一的第一 集成电路中的内部节点以及具有与集成电路中唯一的第二内部节点通信的输入节点的输出模块部分和与唯一输入/输出引脚通信的输出节点。 每个输入/输出模块可由用户编程,使得其功能可被定义为输入模块,输出模块或双向模块。 集成电路还具有两个状态,即未定义输入/输出模块的功能的第一未编程状态,以及第二编程状态,其中输入/输出模块的功能已被定义为启用或 禁用输入/输出模块的输出部分。 用于在未编程状态下测试其中一个输入/输出模块的输入模块部分的电路包括用于临时禁用输入/输出模块中唯一一个的输出部分的装置,用于临时连接输入模块部分的输出节点的装置 到所述集成电路上的测试节点,以及用于将所述测试节点的状态传送到所述集成电路上的测试输入/输出引脚的装置。
    • 88. 发明授权
    • Testability architecture and techniques for programmable interconnect
architecture
    • 可测试架构和可编程互连架构技术
    • US5309091A
    • 1994-05-03
    • US822490
    • 1992-01-14
    • Khaled A. El-AyatJia-Hwang Chang
    • Khaled A. El-AyatJia-Hwang Chang
    • G01R31/28G01R31/3185H03K19/177G01R31/02
    • G01R31/2884G01R31/318516H03K19/17704
    • In a user-configurable integrated circuit including a plurality of uncommitted conductors which may be programmably connected to one another and to functional circuit blocks by a user to form electronic circuits, apparatus for testing for defects in the form of breaks in the electrical continuity of individual ones of the conductors prior to formation of the electronic circuits by a user, including circuitry responsive to external signals for temporarily connecting together selected ones of the uncommitted conductors to form a series circuit having a first end conductor and a second end conductor, circuitry for placing an electrical charge on the first end conductor such that a selected dynamic voltage is placed on the first end conductor, circuitry for driving the second end conductor to a voltage different from the selected dynamic voltage, circuitry for sensing the voltage on the first end conductor at a predetermined time after the driving voltage has been removed, circuitry for storing a signal related to the sensed voltage on the first end conductor, and circuitry for communicating the signal to an input/output pad of the integrated circuit.
    • 在用户可配置的集成电路中,包括可以可编程地彼此连接的多个未提交的导体和由用户形成电子电路的功能电路块,用于测试个体电连续性中的断裂形式的缺陷的装置 由用户形成电子电路之前的导​​体中的一个,包括响应于外部信号的电路,用于将未提交的导体临时连接在一起以形成具有第一端导体和第二端导体的串联电路,用于放置的电路 在第一端部导体上的电荷,使得选择的动态电压被放置在第一端部导体上,用于将第二端部导体驱动到与选择的动态电压不同的电压的电路,用于感测第一端部导体上的电压的电路 在驱动电压被去除之后的预定时间, 将与第一端部导体上的检测到的电压相关的信号,以及用于将该信号传送到集成电路的输入/输出焊盘的电路。
    • 89. 发明授权
    • Above via metal-to-metal antifuse
    • 以上通过金属对金属反熔丝
    • US5308795A
    • 1994-05-03
    • US971734
    • 1992-11-04
    • Frank W. HawleyYen Yeouchung
    • Frank W. HawleyYen Yeouchung
    • H01L23/525H01L21/44
    • H01L23/5252H01L2924/0002Y10S148/055
    • A method for fabricating a metal-to-metal antifuse comprises the steps of (1) forming and defining a first metal interconnect layer; (2) forming an interlayer dielectric layer; (3) forming an antifuse via in the interlayer dielectric layer to expose the first metal interconnect layer; (4) depositing a via metal layer into a portion of the volume defining the antifuse via; (5) forming a planarizing layer of an insulating material in the antifuse via sufficient to fill a remaining portion of the volume defining the antifuse via; (6) etching the planarizing layer to expose an upper surface of the via metal layer and an upper surface of the interlayer dielectric layer so as to form a substantially planar surface comprising the upper surface of the interlayer dielectric layer, the planarizing layer, and the upper surface of the via metal layer; (7) forming an antifuse material layer over the substantially planar surface; (8) forming a metal capping layer over the antifuse material layer; and (9) defining the antifuse material layer and the metal capping layer.
    • 制造金属对金属反熔丝的方法包括以下步骤:(1)形成和限定第一金属互连层; (2)形成层间电介质层; (3)在所述层间电介质层中形成反熔丝通孔以暴露所述第一金属互连层; (4)将通孔金属层沉积到限定反熔丝通孔的体积的一部分中; (5)在所述反熔丝中形成绝缘材料的平坦化层,以足以填充限定所述反熔丝通孔的所述体积的剩余部分; (6)蚀刻平坦化层以暴露通孔金属层的上表面和层间电介质层的上表面,以便形成基本平坦的表面,该表面包括层间电介质层的上表面,平坦化层和 通孔金属层的上表面; (7)在所述基本上平坦的表面上形成反熔丝材料层; (8)在所述反熔丝材料层上形成金属覆盖层; 和(9)限定反熔丝材料层和金属覆盖层。