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    • 1. 发明申请
    • STAIN-RESISTANT ARTICLE AND USE THEREOF
    • 抗菌品及其用途
    • US20140179866A1
    • 2014-06-26
    • US13861820
    • 2013-04-12
    • Mark PFLEGHAREtienne AEPLIHeinz HOFFBotho HOFFMANN
    • Mark PFLEGHAREtienne AEPLIHeinz HOFFBotho HOFFMANN
    • C08L77/06
    • C08L77/06C08K3/013C08K3/30C08K2003/2241C08K2003/3036C08L2205/02C08K3/0033
    • What is described is the use of a polyamide moulding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at most 15. Here, the composition contains 30-100% by weight of a polyamide mixture, consisting of more than 50 and up to 98% by weight of at least one semi-aromatic polyamide comprising 2 to up to 50% by weight of amorphous and/or microcrystalline polyamides having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms. In addition, 0-70% by weight of fibrous additives (B1) and/or particulate additives (B2), 0-30% by weight of impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant, and 0-3% by weight of additives may also be contained.
    • 所描述的是使用聚酰胺模塑组合物来生产耐污渍制品,制品的染色趋势(ST)最多为15.这里,组合物含有30-100重量%的聚酰胺混合物 包含至少一种含有至多50重量%的玻璃化转变温度至少为100℃的无定形和/或微晶聚酰胺的至少一种半芳族聚酰胺的50重量%和至多98重量% 基于:20-100摩尔%的至少一种脂环族二胺; 和0-80摩尔%的至少一种其它脂族和/或芳族二胺; 以及包含至少6个碳原子的芳族和/或脂族二羧酸。 此外,0-70重量%的纤维添加剂(B1)和/或颗粒添加剂(B2),0-30重量%的冲击韧性改性剂和/或不同于(A)的聚合物,0-25重量% 的阻燃剂,并且还可以含有0-3重量%的添加剂。
    • 2. 发明申请
    • STAIN-RESISTANT ARTICLE AND USE THEREOF
    • 抗菌品及其用途
    • US20140179849A1
    • 2014-06-26
    • US13861529
    • 2013-04-12
    • Etienne AEPLIMark PFLEGHARBotho HOFFMANNHeinz HOFF
    • Etienne AEPLIMark PFLEGHARBotho HOFFMANNHeinz HOFF
    • C08L77/06C08K7/14C08G69/26C08K3/30C08G69/14
    • C08L77/06C08G69/14C08G69/26C08K3/22C08K3/30C08K7/14C08K2003/2241C08K2003/3036C08L2205/02
    • What is described is the use of a polyamide moulding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at least 2. Here, the composition contains 30-100% by weight of a polyamide or a polyamide mixture, consisting of 50-100% by weight of at least one amorphous and/or microcrystalline polyamide having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms, and 0-50% by weight of at least one semi-aromatic polyamide. In addition, 0-70% by weight of fibrous fillers (B1) and/or particulate fillers (B2), 0-30% by weight of impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant, and 0-3% by weight of additives may also be contained.
    • 描述的是使用聚酰胺模塑组合物来生产耐污渍制品,制品的染色趋势(ST)至少为2.这里,组合物含有30-100重量%的聚酰胺或 至少一种玻璃化转变温度至少为100℃的至少一种无定形和/或微晶聚酰胺组成的聚酰胺混合物,基于:20-100摩尔%的至少一种脂环族二胺; 和0-80摩尔%的至少一种其它脂族和/或芳族二胺; 以及包含至少6个碳原子的芳族和/或脂族二羧酸和0-50重量%的至少一种半芳族聚酰胺。 此外,0-70重量%的纤维填料(B1)和/或颗粒填料(B2),0-30重量%的冲击韧性改性剂和/或不同于(A)的聚合物,0-25重量% 的阻燃剂,并且还可以含有0-3重量%的添加剂。
    • 5. 发明授权
    • Optical waveguide plug adhesive consisting of at least components and
method of using same
    • 至少组成的光波导插头粘合剂及其使用方法
    • US5790762A
    • 1998-08-04
    • US922183
    • 1997-09-02
    • Etienne AepliKurt Stephan
    • Etienne AepliKurt Stephan
    • C09J4/02C09J4/06C09J163/10C09J167/06G02B6/38
    • G02B6/3861C09J163/10C09J167/06C09J4/06G02B6/3801G02B6/3874
    • An adhesive is to be provided of which one component can be stored virtually with exclusion of air, in anaerobicform, for a prolonged period, and can thus be introduced into the sleeve of an optical connector in a production operation, and the second component of which can be introduced into the first component with the fiber at the assembly site. This is achieved by an adhesive consisting of at least two components, in which the reaction is initiated by interface contact of the two components. For this purpose the two components each comprise unsaturated compounds which are dissolved in mono- and/or polyfunctional acrylates. One component of the adhesive comprises an organometallic compound and the other component an unsaturated dicarboxylic acid and peroxide. The two components are stable on storage and can be stored for a prolonged period without crosslinking, so that one component can be inserted into a ferrule for an optical plug connection and, as required, the optical waveguide, which can be wetted with the second component, brings about polymerization within minutes by interface reaction when inserted into the ferrule.
    • 要提供一种粘合剂,其中一种组分可以在厌氧形式中实际排除空气,并且可以在厌氧形式中长时间地存储,并且因此可以在生产操作中被引入到光学连接器的套筒中,并且其中的第二组分 可以在装配现场用纤维引入第一部件。 这通过由至少两种组分组成的粘合剂来实现,其中通过两种组分的界面接触引发反应。 为此目的,两种组分各自包含溶解在单官能和/或多官能丙烯酸酯中的不饱和化合物。 粘合剂的一个组分包含有机金属化合物,另一组分是不饱和二羧酸和过氧化物。 这两个组分在储存时是稳定的,并且可以长时间保存而不会交联,从而可以将一个组分插入用于光学插塞连接的套圈中,并且根据需要可以将光学波导与第二组分 当插入到套圈中时,通过界面反应在几分钟内产生聚合。
    • 6. 发明申请
    • POLYAMIDE MOULDING MATERIALS CONTAINING COPOLYAMIDES FOR PRODUCING TRANSPARENT MOULDING PARTS WITH LOW DISTORSION IN CLIMATIC TESTING
    • 包含用于生产在气候测试中具有低失真的透明模塑部件的共聚酰胺的聚酰胺模塑材料
    • US20110040023A1
    • 2011-02-17
    • US12989531
    • 2009-04-21
    • Friedrich Severin BuhlerEtienne AepliSepp Bass
    • Friedrich Severin BuhlerEtienne AepliSepp Bass
    • C08L77/06B29C47/78
    • C08L77/06B29C47/0011B29C47/0014B29C47/8895C08G69/265C08L77/00C08L77/12C08L2205/02C08L2666/20
    • The invention discloses novel polyamide moulding materials which are characterized by a significantly improved processability, in particular in injection-moulding, an acceptable deformation in climatic testing, a very high transparency, low haze and even an increased biobased content. The polyamide moulding materials on the basis of transparent copolyamides for producing transparent moulding parts having a high tenacity, low water absorption and low distorsion in climatic testing contain: (A) 40 to 100 percent by weight of at least one transparent copolyamide with a glass transition temperature (Tg) of at least 80 ° C. and not more than 150 ° C., composed of at least two diamines that are different from each other, selected from a mixture of (a) 50 to 90 mol % bis-(4-amino-3-methylcyclohexyl)methane (MACM) and/or bis-(4-amino-3-ethylcyclohexyl)methane (EACM) and/or bis-(4-amino-3,5-dimethylcyclohexyl)methane (TMACM) and b) 10 to 50 mol% aliphatic diamine having 9 to 14 carbon atoms, in particular decandiamine, particularly preferably at least 20 mol % decandiamine, each relative to the total amount of diamines, and of one or more aliphatic dicarboxylic acids, having in particular 6 to 36 carbon atoms, (B) 0 to 60 percent by weight of at least one further polymer, (C) 0 to 10 percent by weight of usual additives, the sum of the components (A), (B) and (C) totaling 100 percent by weight.
    • 本发明公开了新颖的聚酰胺成型材料,其特征在于显着提高加工性能,特别是注射成型,气候试验中可接受的变形,非常高的透明度,低雾度,甚至增加的生物基含量。 基于透明共聚酰胺的聚酰胺成型材料,用于生产在气候试验中具有高强度,低吸水性和低变形性的透明模塑部件,其包含:(A)40至100重量%的至少一种具有玻璃化转变的透明共聚酰胺 温度(Tg)为至少80℃且不超过150℃,由至少两种彼此不同的二胺组成,选自(a)50至90mol%的双 - (4 (4-氨基-3-甲基环己基)甲烷(MACM)和/或双 - (4-氨基-3-乙基环己基)甲烷(EACM)和/或双 - (4-氨基-3,5-二甲基环己基)甲烷(TMACM)和 b)10至50mol%具有9至14个碳原子的脂族二胺,特别是十二胺,特别优选至少20mol%十二胺,各自相对于二胺的总量,以及一种或多种脂族二羧酸,特别是 6至36个碳原子,(B)0至60重量%的至少一种其它聚合物, (C)0〜10重量%的通常的添加剂,成分(A),(B)和(C)的总和为100重量%。
    • 7. 发明申请
    • Polyamide moulding compound for varnish-free, tough casings with a high-gloss surface
    • 聚酰胺模塑料,无清漆,坚韧的外壳具有高光泽表面
    • US20090247699A1
    • 2009-10-01
    • US12385087
    • 2009-03-30
    • Friedrich Severin BuehlerEtienne AepliSepp BassRalf Hala
    • Friedrich Severin BuehlerEtienne AepliSepp BassRalf Hala
    • C08L77/00C08L51/00
    • C08L77/06C08L23/0815C08L23/0869C08L55/00C08L77/02C08L2205/02C08L2205/03C08L2666/02C08L2666/04C08L2666/20C08L2666/24
    • The invention relates to a polyamide moulding compound, containing a) 95 to 5% by weight of an amorphous copolyamide of the formula PA MACMI/MACMT/12  with a MACMI proportion in the copolyamide in the range of 5 to 95% by weight, MACMT proportion in the range of 0 to 90% by weight and LC12 proportion in the range of 5 to 60% by weight, the sum of these three proportions in the copolyamide a) being 100% by weight, b) 5 to 95% by weight of an amorphous or microcrystalline or partially crystalline polyamide of the formula PA(MACMX)x/(PACMY)y/(MXDU)u/(LCZ)z  the proportions x, y, u and z of the four monomer groups being respectively between 0 and 100% by weight, the sum of these four proportions in polyamide b) being 100% by weight; X, Y and U meaning dicarboxylic acids, selected from the group comprising DC4, DC6, DC9, DC10, DC11, DC12, DC13, DC14, DC15 to DC36, and LCZ lactams or corresponding amino carboxylic acids selected from the group comprising LC4, LC6, LC11 and LC12, c) 1 to 30% by weight at least of one impact modifier, and also d) 0 to 80% by weight at least of one additive, the sum of components a), b), c) and d) being 100% by weight, for the production of unvarnished moulded articles with a high-gloss surface and outstanding toughness.
    • 本发明涉及一种聚酰胺模塑料,其包含a)95至5重量%的下式的无定形共聚酰胺:“线内公式”=“在线公式”末端=“铅”→PA MACMI / MACMT / 12 <?in-line-formula description =“在线公式”end =“tail”?>在共聚酰胺中的MACMI比例在5至95重量%的范围内,MACMT比例在0 至90重量%,LC 12比例在5至60重量%的范围内,共聚酰胺a)中的这三个比例之和a)为100重量%,b)5至95重量%的无定形或微晶或 PA(MACMX)x /(PACMY)y /(MXDU)u /(LCZ)z <α的部分结晶的聚酰胺<?in-line-formula description =“In-line Formulas”end =“lead” 在线公式描述=“在线公式”end =“tail”?>四个单体组的比例x,y,u和z分别在0和100重量%之间,这四个比例的总和 聚酰胺b)为100重量% X,Y和U表示选自DC4,DC6,DC9,DC10,DC11,DC12,DC13,DC14,DC15至DC36和LCZ内酰胺或选自LC4,LC6的相应氨基羧酸的二羧酸 ,LC11和LC12,c)至少一种抗冲改性剂为1至30重量%,以及d)至少一种添加剂为0至80重量%,a),b),c)和d )为100重量%,用于生产具有高光泽表面和优异韧性的未成色模制品。
    • 8. 发明申请
    • FILLED POLYAMIDE MOLDING MATERIALS SHOWING A REDUCED WATER ABSORPTION
    • 填充的聚酰胺模塑材料显示减少水分吸收
    • US20080194751A1
    • 2008-08-14
    • US12027581
    • 2008-02-07
    • Ornulf REXINEtienne Aepli
    • Ornulf REXINEtienne Aepli
    • C08K3/00B29C51/00C08K3/34C08K3/26C08K3/22C08K3/30C08K3/40
    • C08L77/06C08L77/02C08L77/04C08L77/10C08L2205/02C08L2666/20C08L77/00
    • The present invention relates to filled polyamide molding materials, in particular polyamide molding materials with medium filler content, which are producible from a polyamide blend and for example by compounding with chopped or endless fibers on two-screw extruders, and have a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part, such as an antenna housings of stationary or mobile communication devices.The thermoplastic polyamide molding materials according to the present invention are suitable for manufacturing molded parts and other semi-finished or finished parts, for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.
    • 本发明涉及填充的聚酰胺成型材料,特别是具有中等填料含量的聚酰胺成型材料,其可由聚酰胺共混物生产,例如通过在双螺杆挤出机上与短切纤维或环状纤维复合,并且具有还原水 吸收和良好的机械性能,这导致非常好的尺寸稳定性和减少所制造的模制部件(例如固定或移动通信装置的天线外壳)的电气特性的变化。 根据本发明的热塑性聚酰胺成型材料分别适用于例如通过挤出,注射成型,压制,直接加工或直接混合来制造模制零件和其它半成品或成品,其中复合的聚酰胺成型材料是 通过注射成型或其他成型方法直接加工。
    • 9. 发明授权
    • Stain-resistant article and use thereof
    • 耐污渍制品及其用途
    • US09346952B2
    • 2016-05-24
    • US13861529
    • 2013-04-12
    • Etienne AepliMark PflegharBotho HoffmannHeinz Hoff
    • Etienne AepliMark PflegharBotho HoffmannHeinz Hoff
    • C08L77/06C08K3/30C08G69/14C08G69/26C08K7/14C08K3/22
    • C08L77/06C08G69/14C08G69/26C08K3/22C08K3/30C08K7/14C08K2003/2241C08K2003/3036C08L2205/02
    • What is described is the use of a polyamide moulding composition for the production of a stain-resistant article, the staining tendency (ST) of the article being at least 2. Here, the composition contains 30-100% by weight of a polyamide or a polyamide mixture, consisting of 50-100% by weight of at least one amorphous and/or microcrystalline polyamide having a glass transition temperature of at least 100° C., based on: 20-100 mol % of at least one cycloaliphatic diamine; and 0-80 mol % of at least one other aliphatic and/or aromatic diamine; and also aromatic and/or aliphatic dicarboxylic acids comprising at least 6 carbon atoms, and 0-50% by weight of at least one semi-aromatic polyamide. In addition, 0-70% by weight of fibrous fillers (B1) and/or particulate fillers (B2), 0-30% by weight of impact toughness modifier and/or polymers different from (A), 0-25% by weight of a flame retardant, and 0-3% by weight of additives may also be contained.
    • 描述的是使用聚酰胺模塑组合物来生产耐污渍制品,制品的染色趋势(ST)至少为2.这里,组合物含有30-100重量%的聚酰胺或 至少一种玻璃化转变温度至少为100℃的至少一种无定形和/或微晶聚酰胺组成的聚酰胺混合物,基于:20-100摩尔%的至少一种脂环族二胺; 和0-80摩尔%的至少一种其它脂族和/或芳族二胺; 以及包含至少6个碳原子的芳族和/或脂族二羧酸和0-50重量%的至少一种半芳族聚酰胺。 此外,0-70重量%的纤维填料(B1)和/或颗粒填料(B2),0-30重量%的冲击韧性改性剂和/或不同于(A)的聚合物,0-25重量% 的阻燃剂,并且还可以含有0-3重量%的添加剂。
    • 10. 发明授权
    • Filled polyamide molding materials showing a reduced water absorption
    • 填充的聚酰胺成型材料显示出减少的吸水性
    • US08552103B2
    • 2013-10-08
    • US12914143
    • 2010-10-28
    • Ornulf RexinEtienne Aepli
    • Ornulf RexinEtienne Aepli
    • C08K3/04C08K3/10C08K3/22C08K3/34C08L77/06
    • C08L77/06C08L77/02C08L77/04C08L77/10C08L2205/02C08L2666/20C08L77/00
    • Filled polyamide molding materials, in particular polyamide molding materials with medium filler content, are producible from a polyamide blend and for example by compounding with chopped or endless fibers on two-screw extruders, and have a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part, such as an antenna housings of stationary or mobile communication devices. These thermoplastic polyamide molding materials are suitable for manufacturing molded parts and other semi-finished or finished parts, for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.
    • 填充的聚酰胺成型材料,特别是具有中等填料含量的聚酰胺成型材料可以由聚酰胺共混物生产,例如通过在双螺杆挤出机上与短切纤维或环状纤维复合,并且具有减少的吸水性和良好的机械性能的组合, 这导致非常好的尺寸稳定性和减少所制造的模制部件(例如固定或移动通信装置的天线壳体)的电气特性的变化。 这些热塑性聚酰胺成型材料分别适用于制造模制件和其他半成品或成品,例如通过挤出,注射成型,压制,直接加工或直接混合,其中复合的聚酰胺成型材料通过注塑直接加工 或其他成形方法。