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    • 4. 发明授权
    • Light quantity controlling apparatus
    • 光量控制装置
    • US5459573A
    • 1995-10-17
    • US291747
    • 1994-08-17
    • Naoto AbeKoji UdaIsamu ShimodaShunichi UzawaNoriyuki Nose
    • Naoto AbeKoji UdaIsamu ShimodaShunichi UzawaNoriyuki Nose
    • G01B11/00G01D5/26G03F9/00H01L21/68H01L31/12H01L33/00H01S5/06H01S5/062H01S5/0683G01N21/86
    • G03F9/7088G03F9/7049H01L21/68H01L21/682H01S5/06835H01S5/06216
    • A position detecting apparatus usable for aligning mask and a semiconductor wafer, wherein a laser beam produced by a semiconductor laser is projected through a predetermined optical system to alignment marks formed on the mask and the wafer, and the light reflected by the marks are detected by an accumulation type sensor to produce an electrical signal, from which the relative positional relation between the mask and the wafer are detected on the basis of the electrical signal. To obtain proper mark signals, the quantity of light incident on the accumulation sensor is controlled. In this apparatus, the beam emitting strength of the semiconductor laser is made constant, and the control of thee amount of light incident on the accumulation sensor is effected by controlling the operation period of the semiconductor laser. In addition, the actuation timing of the semiconductor laser is advanced from the accumulation start of the accumulation type sensor by the time required for the semiconductor laser to be thermally stabilized after its actuation. The mark detection signal produced by the accumulation sensor is precise.
    • 一种可用于对准掩模和半导体晶片的位置检测装置,其中由半导体激光器产生的激光束通过预定的光学系统投射到形成在掩模和晶片上的对准标记,并且由标记反射的光被 用于产生电信号的累积型传感器,根据电信号检测掩模和晶片之间的相对位置关系。 为了获得适当的标记信号,控制入射在累积传感器上的光量。 在该装置中,半导体激光器的发射光强度保持恒定,并且通过控制半导体激光器的工作周期来控制入射到积聚传感器上的光量。 此外,半导体激光器的激活定时从累积型传感器的累积开始到半导体激光器在其致动之后被热稳定所需的时间前进。 由积累传感器产生的标记检测信号是精确的。
    • 8. 发明授权
    • Exposure method
    • 曝光方法
    • US5498501A
    • 1996-03-12
    • US416503
    • 1995-04-04
    • Isamu ShimodaTakao KariyaNobutoshi MizusawaKunitaka OzawaShunichi Uzawa
    • Isamu ShimodaTakao KariyaNobutoshi MizusawaKunitaka OzawaShunichi Uzawa
    • G03F7/20G03F9/00
    • G03F7/70066G03F7/2022G03F7/7045Y10S438/949
    • A method of manufacturing of semiconductor devices, includes exposing different portions of a semiconductor substrate with a first exposure apparatus having a first exposure range; placing and aligning the semiconductor substrate with respect to a second exposure range of a second exposure apparatus, which range is larger than the first exposure range of the first exposure apparatus; detecting an alignment error of each of the portions of the semiconductor substrate as covered by the second exposure range of the second exposure apparatus; calculating an overall alignment error of those portions of the semiconductor substrate with respect to the entire second exposure range of the second exposure apparatus, on the basis of the detected alignment errors; and controlling the exposure operation of the second exposure apparatus on the basis of the calculated overall alignment error.
    • 一种半导体器件的制造方法,包括用具有第一曝光范围的第一曝光装置曝光半导体衬底的不同部分; 将半导体衬底相对于第二曝光装置的第二曝光范围放置和对准,该范围大于第一曝光装置的第一曝光范围; 检测由第二曝光装置的第二曝光范围所覆盖的半导体衬底的每个部分的对准误差; 基于检测到的对准误差,计算半导体衬底的这些部分相对于第二曝光装置的整个第二曝光范围的总体对准误差; 并根据计算的整体对准误差来控制第二曝光装置的曝光操作。