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    • 4. 发明授权
    • Method and apparatus for scrubbing accumulated data errors from a memory system
    • 用于从存储器系统中擦除累积的数据错误的方法和装置
    • US09170879B2
    • 2015-10-27
    • US12456923
    • 2009-06-24
    • Hsu Kai Yang
    • Hsu Kai Yang
    • G06F11/10G11C16/34G11C29/46
    • G06F11/106G06F11/1096G11C16/3418G11C16/349G11C29/46
    • A data scrubbing apparatus corrects disturb data errors occurring in an array of memory cells such as SMT MRAM cells. The data scrubbing apparatus receives an error indication that an error has occurred during a read operation of a grouping of memory cells within the array of memory cells. The data scrubbing apparatus may generate an address describing the location of the memory cells to be scrubbed. The data scrubbing apparatus then commands the array of memory cells to write back the corrected data. Based on a scrub threshold value, the data scrubbing apparatus writes the corrected data back after a specific number of errors. The data scrubbing apparatus may further suspend writing back during a writing of data. The data scrubbing apparatus provides a busy indicator externally during a write back of corrected data.
    • 数据擦除装置校正在诸如SMT MRAM单元的存储单元阵列中发生的干扰数据错误。 数据擦除装置接收在存储器单元阵列内的一组存储器单元的读取操作期间发生错误的错误指示。 数据擦除装置可以生成描述要擦除的存储器单元的位置的地址。 然后,数据擦除装置命令存储器单元阵列回写校正的数据。 基于擦除阈值,数据擦除装置在经过特定数量的错误之后写入校正后的数据。 数据擦除装置可以在写入数据期间进一步中止写回。 在校正数据的回写期间,数据擦除装置在外部提供忙指示符。
    • 6. 发明授权
    • Method for testing heat pipes
    • 热管测试方法
    • US08641271B2
    • 2014-02-04
    • US12772540
    • 2010-05-03
    • Feng-Ku WangYi-Lun ChengChih-Kai Yang
    • Feng-Ku WangYi-Lun ChengChih-Kai Yang
    • G01K1/16
    • G01M99/002G01K17/00
    • A method for testing heat pipes includes the following steps. A plurality of bar-shaped heat pipes having the same size is provided, and the heat pipes are deformed. The deformed heat pipes are placed in a temperature regulator, such that a temperature of the heat pipes is periodically changed between a first temperature and a second temperature. The heat pipes are then taken out of the temperature regulator. One end of each heat pipe is maintained at a third temperature by a thermostatic device, and a heat pipe temperature difference of two opposite ends of the heat pipe is measured. The heat pipes having the heat pipe temperature difference greater than a standard temperature difference in the heat pipes are marked.
    • 热管测试方法包括以下步骤。 提供了多个具有相同尺寸的棒状热管,并且热管变形。 变形的热管被放置在温度调节器中,使得热管的温度在第一温度和第二温度之间周期性地变化。 然后将热管从温度调节器中取出。 每个热管的一端通过恒温装置保持在第三温度,并且测量热管的两个相对端的热管温度差。 具有热管温度差大于热管中的标准温差的热管被标记。
    • 7. 发明授权
    • Hard mask removal for semiconductor devices
    • 半导体器件的硬掩模去除
    • US08372719B2
    • 2013-02-12
    • US12724157
    • 2010-03-15
    • Sheng-Hsiung WangFu-Kai YangYuan-Ching PengChi-Cheng Hung
    • Sheng-Hsiung WangFu-Kai YangYuan-Ching PengChi-Cheng Hung
    • H01L21/461H01L21/027
    • H01L21/31144H01L21/28017H01L21/31116H01L29/66795
    • A method of removing a hard mask during fabrication of semiconductor devices is provided. A protective layer, such as a bottom anti-reflective coating (BARC) layer or other dielectric layer, is formed over structures formed on a substrate, wherein spacers are formed alongside the structures. In an embodiment, the structures are gate electrodes having a hard mask formed thereon and the spacers are spacers formed alongside the gate electrodes. A photoresist layer is formed over the protective layer, and the photoresist layer may be patterned to remove a portion of the photoresist layer over portions of the protective layer. Thereafter, an etch-back process is performed, such that the protective layer adjacent to the spacers remains to substantially protect the spacers. The hard mask is then removed while the protective layer protects the spacers.
    • 提供了在制造半导体器件期间去除硬掩模的方法。 在衬底上形成的结构上形成诸如底部抗反射涂层(BARC)层或其它电介质层的保护层,其中间隔物沿着结构形成。 在一个实施例中,结构是具有形成在其上的硬掩模的栅电极,并且间隔物是与栅电极一起形成的间隔物。 在保护层上形成光致抗蚀剂层,并且可以对光致抗蚀剂层进行图案化以在保护层的部分上去除光致抗蚀剂层的一部分。 此后,执行回蚀处理,使得与间隔物相邻的保护层保持基本上保护间隔物。 然后去除硬掩模,同时保护层保护间隔物。
    • 9. 发明授权
    • Methods and systems for evaluating checker quality of a verification environment
    • 用于评估验证环境的检验质量的方法和系统
    • US08359559B2
    • 2013-01-22
    • US12977376
    • 2010-12-23
    • Kai YangMichael LyonsKuo-Ching LinWei-Ting TuChih-Wen ChangTein-Chun Wei
    • Kai YangMichael LyonsKuo-Ching LinWei-Ting TuChih-Wen ChangTein-Chun Wei
    • G06F17/50G06F9/455
    • G06F17/5022G06F17/504G06F2217/10
    • Methods and systems for evaluating checker quality of a verification environment are provided. In some embodiments, an overall sensitivity for the verification environment and an individual sensitivity for a respective checker are calculated. The overall sensitivity is a probability that a plurality of problematic design behaviors, which are propagated to a checker system including at least one checker, can be detected by the verification environment. The individual sensitivity is a probability that a plurality of problematic design behaviors, which are propagated to at least one specific probe among a plurality of probes of a design, can be detected by the checker corresponding to the specific probe. The overall checker sensitivity numbers can show the robustness of the check system. The individual checker sensitivity can guide the user which individual checker or checkers to improve.
    • 提供了用于评估验证环境的检查器质量的方法和系统。 在一些实施例中,计算验证环境的总体灵敏度和相应检查器的个体灵敏度。 总体灵敏度是通过验证环境可以检测到传播到包括至少一个检验器的检查系统的多个有问题的设计行为的概率。 个体敏感度是通过与特定探针对应的检查器可以检测到在设计的多个探针中传播到至少一个特定探针的多个有问题的设计行为的概率。 整体检查灵敏度数字可以显示检查系统的稳健性。 单独的检查灵敏度可以指导用户哪个单独的检查器或检查器改进。