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1. 发明申请

US20140003015A1 MOUNT BOARD AND ELECTRONIC DEVICE 有权
标题翻译：安装板和电子设备
公开(公告)号：US20140003015A1
公开(公告)日：2014-01-02
申请号：US14016707
申请日：2013-09-03
申请人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
发明人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
IPC分类号： H05K1/18
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

2. 发明申请

US20110242780A1 MOUNT BOARD AND ELECTRONIC DEVICE 有权
标题翻译：安装板和电子设备
公开(公告)号：US20110242780A1
公开(公告)日：2011-10-06
申请号：US13158037
申请日：2011-06-10
申请人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
发明人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
IPC分类号： H05K7/14 , H05K7/00
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

3. 发明申请

US20090107703A1 WIRING BOARD, PACKAGING BOARD AND ELECTRONIC DEVICE 失效
标题翻译：接线板，包装板和电子设备
公开(公告)号：US20090107703A1
公开(公告)日：2009-04-30
申请号：US12295286
申请日：2007-03-30
申请人： Katsumi Abe , Kenichiro Fujii , Atsumasa Sawada
发明人： Katsumi Abe , Kenichiro Fujii , Atsumasa Sawada
IPC分类号： H05K1/00
CPC分类号： H05K1/0271 , H01L23/49822 , H01L23/4985 , H01L23/562 , H01L2224/05022 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/15311 , H01L2924/16152 , H01L2924/3511 , H05K1/0281 , H05K1/189 , H05K3/4614 , H05K3/4691 , H05K2201/0187 , H05K2201/10674 , H05K2201/2009 , H05K2203/302 , Y10T428/24777 , H01L2924/00 , H01L2224/05599
摘要： To restrain the stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion even when the electronic component is mounted on the curved board. A flexible wiring board in which a plurality of insulation layers (11, 13) and wiring layers (12, 15) are piled up alternately and the wiring layers (12, 15) are connected each other by a via conductor (14), and the board comprises a reinforced area (10a) being reinforced against an external stress, a bending area (10c) bending easier than the reinforced area (10a) by the external stress, and a stress relaxation area (10b) being provided in an area between the reinforced area (10a) and the bending area (10c), bending easier than the reinforced area (10a) by the external stress and not easier than the bending area (10c) by the external stress, and relaxing the stress carried from the bending area (10c) to the reinforced area (10a). The electronic component (20) is connected electrically and mechanically via solder balls (30) with a pad portion (15a) arranged inside an area surrounded by an outer circumferential boundary line of the reinforced area (10a).
摘要翻译：为了抑制电子部件和弯曲板的连接部分处的应力集中以及连接部分周围的区域，即使电子部件安装在弯曲板上也是如此。一种柔性布线板，其中多个绝缘层（11,13）和布线层（12,15）交替堆叠并且布线层（12,15）通过通孔导体（14）彼此连接，并且所述板包括抵抗外部应力加强的加强区域（10a），由外部应力而比所述加强区域（10a）弯曲的弯曲区域（10c）以及应力松弛区域（10b），其设置在加强区域（10a）和弯曲区域（10c），通过外部应力比加强区域（10a）弯曲得更容易，并且由于外部应力而不易弯曲区域（10c），并且松弛由弯曲所承受的应力区域（10c）到加强区域（10a）。电子部件（20）通过焊球（30）电连接和机械连接，焊盘部分（15a）布置在由加强区域（10a）的外周边界线包围的区域内。

4. 发明申请

US20090002973A1 Mount Board and Electronic Device 审中-公开
标题翻译：安装板和电子设备
公开(公告)号：US20090002973A1
公开(公告)日：2009-01-01
申请号：US12093496
申请日：2006-11-08
申请人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
发明人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
IPC分类号： H05K7/00
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

5. 发明授权

US08913398B2 Mount board and electronic device 有权
标题翻译：安装板和电子设备
公开(公告)号：US08913398B2
公开(公告)日：2014-12-16
申请号：US14016707
申请日：2013-09-03
申请人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
发明人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
IPC分类号： H05K7/00 , H05K3/00 , H01L23/00 , H05K1/02 , H05K1/18 , H05K3/46 , H05K3/32
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

6. 发明授权

US08119924B2 Wiring board, packaging board and electronic device 失效
标题翻译：接线板，包装板和电子设备
公开(公告)号：US08119924B2
公开(公告)日：2012-02-21
申请号：US12295286
申请日：2007-03-30
申请人： Katsumi Abe , Kenichiro Fujii , Atsumasa Sawada
发明人： Katsumi Abe , Kenichiro Fujii , Atsumasa Sawada
IPC分类号： H05K1/00
CPC分类号： H05K1/0271 , H01L23/49822 , H01L23/4985 , H01L23/562 , H01L2224/05022 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/15311 , H01L2924/16152 , H01L2924/3511 , H05K1/0281 , H05K1/189 , H05K3/4614 , H05K3/4691 , H05K2201/0187 , H05K2201/10674 , H05K2201/2009 , H05K2203/302 , Y10T428/24777 , H01L2924/00 , H01L2224/05599
摘要： Stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion is suppressed. In a flexible wiring board, insulation layers (11, 13) and wiring layers (12, 15) are piled up alternately and wiring layers (12, 15) are via-connected each other. The board comprises reinforced area (10a) reinforced against external stress, bending area (10c) bending easier than the reinforced area (10a) by external stress, and a stress relaxation area (10b) provided in area between the reinforced area (10a) and the bending area (10c), bending easier than the reinforced area (10a) but not easier than the bending area (10c) by the external stress, and relaxing the stress carried from the bending area (10c) to the reinforced area (10a).
摘要翻译：电子部件和弯曲板的连接部的应力集中以及连接部周围的区域被抑制。在柔性布线板中，绝缘层（11,13）和布线层（12,15）交替堆叠，并且布线层（12,15）彼此通孔连接。所述板包括加强区域（10a），抵抗外部应力增强，弯曲区域（10c）比外部应力比加强区域（10a）弯曲得更容易;以及应力松弛区域（10b），设置在加强区域（10a）和所述弯曲区域（10c）比所述加强区域（10a）弯曲变得容易，但是通过外部应力不易弯曲区域（10c），并且缓和从所述弯曲区域（10c）向所述加强区域（10a）承受的应力，。

7. 发明授权

US08625296B2 Mount board and electronic device 有权
公开(公告)号：US08625296B2
公开(公告)日：2014-01-07
申请号：US13158037
申请日：2011-06-10
申请人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
发明人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
IPC分类号： H05K7/00
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

8. 发明申请

US20110002213A1 HOLDER OF MAGNETIC STORAGE APPARATUS, MAGNETIC STORAGE APPARATUS AND ELECTRIC DEVICE INCLUDING THE SAME 有权
标题翻译：磁储存装置，磁存储装置和包括其的电子装置
公开(公告)号：US20110002213A1
公开(公告)日：2011-01-06
申请号：US12735979
申请日：2009-01-21
申请人： Toshinobu Ogatsu , Kenichiro Fujii
发明人： Toshinobu Ogatsu , Kenichiro Fujii
IPC分类号： G11B33/02 , H05K5/00
CPC分类号： G11B33/08 , G11B25/043 , G11B33/124
摘要： A holder of a magnetic storage apparatus is suggested that can efficiently absorb the shock when a vibration or shock is applied to the magnetic storage apparatus. A plurality of holding members (first shock absorbing material foam rubber 340 and second shock absorbing material foam rubber 350) that hold at least two corner parts of the magnetic storage apparatus 320 is included. The holding members are configured in a way that a total sum of holding power to hold one of opposite angles of the magnetic storage apparatus 320 and a total sum of holding power to hold the other of opposite angles are different. The first shock absorbing material foam rubber 340 is disposed on one of opposite angles, and the second shock absorbing material foam rubber 350 is disposed on the other of the opposite angles. The first shock absorbing material foam rubber 340 has greater hardness than the hardness of the second shock absorbing material foam rubber 350.
摘要翻译：提出了一种磁存储装置的保持器，当对磁存储装置施加振动或冲击时，可以有效地吸收冲击。包括保持磁存储装置320的至少两个角部的多个保持构件（第一减震材料泡沫橡胶340和第二减震材料泡沫橡胶350）。保持构件被配置为使得保持磁存储装置320的相反角度的保持力的总和与保持另一个相反角度的保持力的总和不同。第一吸震材料发泡橡胶340设置在相反的角度之一上，第二吸震材料泡沫橡胶350设置在相反的角度的另一个上。第一冲击吸收材料发泡橡胶340具有比第二冲击吸收材料泡沫橡胶350的硬度更大的硬度。

9. 发明授权

US08300401B2 Holder of magnetic storage apparatus, magnetic storage apparatus and electric device including the same 有权
标题翻译：磁存储装置的保持器，磁存储装置和包括该磁存储装置的电气装置
公开(公告)号：US08300401B2
公开(公告)日：2012-10-30
申请号：US12735979
申请日：2009-01-21
申请人： Toshinobu Ogatsu , Kenichiro Fujii
发明人： Toshinobu Ogatsu , Kenichiro Fujii
IPC分类号： G06F1/16
CPC分类号： G11B33/08 , G11B25/043 , G11B33/124
摘要： A holder of a magnetic storage apparatus is suggested that can efficiently absorb the shock when a vibration or shock is applied to the magnetic storage apparatus. A plurality of holding members (first shock absorbing material foam rubber 340 and second shock absorbing material foam rubber 350) that hold at least two corner parts of the magnetic storage apparatus 320 is included. The holding members are configured in a way that a total sum of holding power to hold one of opposite angles of the magnetic storage apparatus 320 and a total sum of holding power to hold the other of opposite angles are different. The first shock absorbing material foam rubber 340 is disposed on one of opposite angles, and the second shock absorbing material foam rubber 350 is disposed on the other of the opposite angles. The first shock absorbing material foam rubber 340 has greater hardness than the hardness of the second shock absorbing material foam rubber 350.
摘要翻译：提出了一种磁存储装置的保持器，当对磁存储装置施加振动或冲击时，可以有效地吸收冲击。包括保持磁存储装置320的至少两个角部的多个保持构件（第一减震材料泡沫橡胶340和第二减震材料泡沫橡胶350）。保持构件被配置为使得保持磁存储装置320的相反角度的保持力的总和与保持另一个相反角度的保持力的总和不同。第一吸震材料发泡橡胶340设置在相反的角度之一上，第二吸震材料泡沫橡胶350设置在相反的角度的另一个上。第一冲击吸收材料发泡橡胶340具有比第二冲击吸收材料泡沫橡胶350的硬度更大的硬度。

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