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1. 发明授权

US07276841B2 Thick film electrode and multilayer ceramic electronic device 有权
标题翻译：厚膜电极和多层陶瓷电子器件
公开(公告)号：US07276841B2
公开(公告)日：2007-10-02
申请号：US11426374
申请日：2006-06-26
申请人： Hidekiyo Takaoka , Satoshi Shindou , Satoru Noda , Kunihiko Hamada
发明人： Hidekiyo Takaoka , Satoshi Shindou , Satoru Noda , Kunihiko Hamada
IPC分类号： H01L41/08
CPC分类号： H01G4/232 , H01L41/0472
摘要： A multilayer ceramic device includes an external electrode disposed on a piezoelectric ceramic body including internal electrodes. The external electrode is a sintered body in which an Ag grid is integrally embedded in a coating film primarily composed of Ag. Therefore, it is possible to obtain a multilayer ceramic device having outstanding properties, such as durability and moisture resistance, without leading to poor electrical continuity and a decrease in conductivity even when a continuous operation is performed for a prolonged period of time.
摘要翻译：多层陶瓷器件包括设置在包括内部电极的压电陶瓷体上的外部电极。外部电极是其中Ag网格整体地嵌入主要由Ag组成的涂膜中的烧结体。因此，即使长时间进行连续的动作，也可以得到耐久性和耐湿性等突出特性的多层陶瓷器件，而不会导致不良的导电性和导电性的降低。

2. 发明授权

US06911138B2 Method for plating electrodes of ceramic chip electronic components 有权
标题翻译：陶瓷芯片电子部件电极电镀方法
公开(公告)号：US06911138B2
公开(公告)日：2005-06-28
申请号：US10243183
申请日：2002-09-13
申请人： Akihiro Motoki , Shoichi Higuchi , Yoshihiko Takano , Kunihiko Hamada
发明人： Akihiro Motoki , Shoichi Higuchi , Yoshihiko Takano , Kunihiko Hamada
IPC分类号： C25D3/32 , C25D7/00 , C25D7/12 , C25D17/16 , C25D3/60 , C25D3/30
CPC分类号： C25D7/12 , C25D3/32 , C25D17/16
摘要： A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.
摘要翻译：陶瓷芯片电子部件的电极电镀方法包括在电镀液中进行电镀。电镀液含有锡（II）氨基磺酸盐，作为锡（II）盐; 包括选自柠檬酸，葡萄糖酸，焦磷酸，庚酸，丙二酸，苹果酸，这些酸的盐和葡萄糖酸内酯中的至少一种的络合剂; 以及包含HLB值为约10以上的至少一种表面活性剂的增白剂。所得到的陶瓷芯片电子部件的镀锡附着力可以限制在一定水平。

3. 发明授权

US07018864B2 Conductive paste for terminal electrodes of monolithic ceramic electronic component, method for making monolithic ceramic electronic component, and monolithic ceramic electronic component 失效
公开(公告)号：US07018864B2
公开(公告)日：2006-03-28
申请号：US10849129
申请日：2004-05-20
申请人： Satoru Noda , Takeshi Miki , Kunihiko Hamada
发明人： Satoru Noda , Takeshi Miki , Kunihiko Hamada
IPC分类号： H01L51/40
CPC分类号： H01G4/2325 , C03C8/14 , C03C8/18 , H01C1/1406 , H01C1/148 , H05K1/092
摘要： A conductive paste for forming terminal electrodes of a monolithic ceramic electronic component having nickel internal electrodes is provided. The conductive paste includes at least one of a silver powder and a silver alloy powder, a boron powder, an inorganic binder and an organic vehicle. The amount of the boron powder is at least about 0.5 percent by weight and less than about 7.0 percent by weight of the total weight of the conductive paste.

4. 发明授权

US06654227B2 Ceramic electronic parts and method for manufacturing the same 有权
标题翻译：陶瓷电子零件及其制造方法
公开(公告)号：US06654227B2
公开(公告)日：2003-11-25
申请号：US10277882
申请日：2002-10-23
申请人： Takeshi Miki , Satoru Noda , Kunihiko Hamada
发明人： Takeshi Miki , Satoru Noda , Kunihiko Hamada
IPC分类号： H01G406
CPC分类号： H01G4/232 , H01C1/1406
摘要： A ceramic electronic part includes a ceramic assemblage containing laminated plural ceramic sheets, plural inner electrodes formed between the ceramic sheets and containing Ni as a major component, and outer electrodes electrically connected to the inner electrodes. The outer electrodes contain Ag as a major component and Au and an inorganic oxide as minor components.
摘要翻译：陶瓷电子部件包括含有层叠的多个陶瓷片的陶瓷组件，形成在陶瓷片之间并且以Ni为主要成分的多个内部电极以及与内部电极电连接的外部电极。外电极含有Ag作为主要成分，Au和无机氧化物作为次要成分。

5. 发明授权

US06585916B2 Electrically conductive paste and electronic element 有权
标题翻译：导电胶和电子元件
公开(公告)号：US06585916B2
公开(公告)日：2003-07-01
申请号：US09757861
申请日：2001-01-10
申请人： Yukio Sanada , Hiromasa Takahashi , Shinichiro Kuroiwa , Masaki Fujiyama , Kunihiko Hamada , Akira Otani
发明人： Yukio Sanada , Hiromasa Takahashi , Shinichiro Kuroiwa , Masaki Fujiyama , Kunihiko Hamada , Akira Otani
IPC分类号： H01B102
CPC分类号： H01G4/0085 , H01B1/16
摘要： An electrically conductive paste which ensures formation of a dense electrode film even in a low-oxygen-concentration atmosphere without strict control of the atmosphere is described. The electrically conductive paste comprising Cu powder, glass frit and an organic binder resin, wherein the glass frit comprises Zn- and Cu-containing borosilicate glass and in the melt state has a contact angle with respect to Cu of 90° or less as measured in a nitrogen atmosphere.
摘要翻译：描述了即使在低氧浓度的气氛中即使在严格控制气氛的情况下也能形成致密电极膜的导电性糊料。包含Cu粉末，玻璃料和有机粘合剂树脂的导电糊料，其中玻璃料包含含Zn和Cu的硼硅酸盐玻璃，并且在熔融状态下，相对于Cu的接触角为90°或更小，如氮气氛围。

6. 发明授权

US06370015B2 Laminated ceramic electronic device 失效
标题翻译：层压陶瓷电子器件
公开(公告)号：US06370015B2
公开(公告)日：2002-04-09
申请号：US09800991
申请日：2001-03-07
申请人： Satoru Noda , Kunihiko Hamada
发明人： Satoru Noda , Kunihiko Hamada
IPC分类号： H01G406
CPC分类号： H01G4/232
摘要： A laminated ceramic capacitor is provided having superior elastic and bending characteristics and having a high mechanical strength withstanding the thermal shock generated when mounting is performed on a circuit substrate by soldering. The laminated ceramic capacitor is composed of a laminate and external electrodes, wherein the laminate is formed of a plurality of ceramic layers and a plurality of internal electrodes provided therebetween so that an end of each internal electrode is exposed at one of edge surfaces of the laminate, and the external electrodes are connected to the internal electrodes and contains a conductive component and a glass having a Young's modulus of about 9×109 Pa or less.
摘要翻译：提供了具有优异的弹性和弯曲特性并且具有高的机械强度的层压陶瓷电容器，其耐受通过焊接在电路基板上进行安装时产生的热冲击。层压陶瓷电容器由层压体和外部电极构成，其中层叠体由多个陶瓷层和设置在其间的多个内部电极形成，使得每个内部电极的端部暴露在层压体的一个边缘表面处并且外部电极连接到内部电极并且包含导电成分和杨氏模量为约9×10 9 Pa以下的玻璃。

7. 发明授权

US06180264B2 Soldered article 有权
标题翻译：焊接文章
公开(公告)号：US06180264B2
公开(公告)日：2001-01-30
申请号：US09396819
申请日：1999-09-14
申请人： Hidekiyo Takaoka , Kunihiko Hamada , Yu Tokuda
发明人： Hidekiyo Takaoka , Kunihiko Hamada , Yu Tokuda
IPC分类号： B32B1501
CPC分类号： C22C13/02 , B23K35/262 , Y10T428/12708 , Y10T428/12715
摘要： There is provided a soldered article comprising a component having a Cu conductor joined with a solder, wherein the solder comprises about 0.1 to 2.0% by weight of Cu, about 1.0 to 7.5% by weight of Bi, and the balance being Sn. By using the above described lead-free solder, the occurrence of leaching is suppressed during soldering, and the solderability and joining strength can be improved. Since the solder does not contain Ag, material cost can be reduced, thus enabling reductions in the cost of the entire soldered article.
摘要翻译：提供一种包含具有与焊料接合的Cu导体的部件的焊接制品，其中焊料包含约0.1至2.0重量％的Cu，约1.0至7.5重量％的Bi，余量为Sn。通过使用上述无铅焊料，在焊接时抑制浸出的发生，可以提高可焊性和接合强度。由于焊料不含有Ag，因此可以降低材料成本，从而能够降低整个焊接制品的成本。

8. 发明授权

US5840216A Electroconductive paste and laminated ceramic electric part 失效
标题翻译：导电胶和层压陶瓷电器件
公开(公告)号：US5840216A
公开(公告)日：1998-11-24
申请号：US691937
申请日：1996-08-05
申请人： Akira Ohtani , Kunihiko Hamada
发明人： Akira Ohtani , Kunihiko Hamada
IPC分类号： C03C8/16 , H01B1/16 , H01B1/22 , H01G4/12 , H01G4/232 , H01B1/02
CPC分类号： H01G4/2325 , H01B1/16
摘要： Disclosed is an electroconductive paste and a laminated ceramic electronic part produced by the use of the paste. The part exhibits improved heat-shock resistance during surface mounting thereof. The paste comprises a metal component and glass frit dispersed in an organic vehicle, and the glass frit comprises a zinc borosilicate containing CaO. The proportion of CaO to the total weight of the glass frit is preferably about 3 to 15 wt. %. The laminated ceramic electronic part comprises outer electrodes formed on the sides of the body of the part by baking the paste thereon.
摘要翻译：公开了通过使用该糊料制造的导电性糊料和层叠陶瓷电子部件。该部件在其表面安装期间表现出改善的耐热冲击性。该糊料包含分散在有机载体中的金属组分和玻璃料，玻璃料包含含有CaO的硼硅酸锌。 CaO与玻璃料的总重量的比例优选为3〜15重量％左右。％。层叠陶瓷电子部件包括通过在其上烘烤浆料而在部件的主体的侧面上形成的外部电极。

9. 发明授权

US06703113B2 Pb-free solder composition and soldered article 有权
公开(公告)号：US06703113B2
公开(公告)日：2004-03-09
申请号：US09878818
申请日：2001-06-11
申请人： Hidekiyo Takaoka , Kunihiko Hamada
发明人： Hidekiyo Takaoka , Kunihiko Hamada
IPC分类号： B32B1500
CPC分类号： C22C12/00 , B23K35/264 , Y10T428/12681 , Y10T428/24917
摘要： Provided is a Pb-free solder composition having an excellent heat resistance which does not damage a glass substrate and parts on the substrate when the soldering is carried out on to an electrode pattern formed on the substrate. The Pb-free solder composition contains, for example, not less than about 90% by weight of Bi, from about 0.1% to 9.9% by weight of Ag and from about 0.1% to 3.0% by weight of Sb, based on the whole solder composition.

10. 发明授权

US06424516B2 Conductive paste and ceramic electronic component 有权
标题翻译：导电胶和陶瓷电子元件
公开(公告)号：US06424516B2
公开(公告)日：2002-07-23
申请号：US09870552
申请日：2001-05-30
申请人： Kiyotaka Maegawa , Kunihiko Hamada
发明人： Kiyotaka Maegawa , Kunihiko Hamada
IPC分类号： H01G4008
CPC分类号： H01G4/232
摘要： A conductive paste capable of forming a terminal electrode in which sintering proceeds while the viscosity of the glass is maintained during the sintering of the conductive component, so that the softened glass is prevented from flowing into the interface between the ceramic element assembly and the terminal electrode or from flowing on the surface of the terminal electrode, and furthermore, sufficient glass remains in the cavity of the terminal electrode film, so that an excellent seal is provided against the penetration of the plating solution, and the so-called “adhesion defect” is prevented from occurring, is provided. In addition, a ceramic electronic component is provided. The conductive paste is composed of a conductive component containing at least one of Cu and Ni, a glass frit and an organic vehicle, in which the glass frit contains a crystallizable glass, and the sintering starting temperature of the conductive component is higher than the crystallization starting temperature of the crystallizable glass and lower than the remelting temperature of the crystallizable glass.
摘要翻译：一种能够形成端子电极的导电膏，其中在导电部件烧结期间保持玻璃的粘度的同时进行烧结，从而防止软化玻璃流入陶瓷元件组件和端子电极之间的界面或者在端子电极的表面上流动，此外，在端子电极膜的空腔中残留有足够的玻璃，从而对电镀液的渗透提供优异的密封，所谓的“粘附缺陷” 被防止发生。另外，提供陶瓷电子部件。导电性糊料由含有Cu和Ni中的至少一种的导电性成分，玻璃料和有机载体构成，玻璃料含有可结晶玻璃，导电性成分的烧结开始温度高于结晶化可结晶玻璃的起始温度低于可结晶玻璃的重熔温度。

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