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    • 6. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
    • 非易失性半导体存储器件及其制造方法
    • US20080087943A1
    • 2008-04-17
    • US11873104
    • 2007-10-16
    • Minori Kajimoto
    • Minori Kajimoto
    • H01L29/792H01L21/336
    • H01L27/115H01L27/11521H01L27/11524Y10S257/90
    • A nonvolatile semiconductor memory device includes a gate insulating film formed on a semiconductor substrate, a gate electrode formed on the gate insulating film, a source/drain region formed at each side of the gate electrode in the substrate, a first silicon oxide film formed on a gate electrode sidewall so as to serve as a spacer, the first silicon oxide film having a first lower surface in contact with the source/drain region and an upper surface located lower than the substrate upper surface, a second silicon oxide film formed on the source/drain region and a side surface of the first silicon oxide film, the second silicon oxide film having a second lower surface which is in contact with the substrate and is located lower than the lower surface of the first silicon oxide film, and a silicon nitride film formed on an upper surface of the second silicon oxide film.
    • 非易失性半导体存储器件包括形成在半导体衬底上的栅极绝缘膜,形成在栅极绝缘膜上的栅电极,形成在衬底中的栅电极的每一侧的源/漏区,形成在第一氧化硅膜上的第一氧化硅膜 栅电极侧壁作为间隔物,所述第一氧化硅膜具有与所述源极/漏极区域接触的第一下表面和位于比所述基板上表面低的上表面,形成在所述第二氧化硅膜上的第二氧化硅膜 源极/漏极区域和第一氧化硅膜的侧表面,第二氧化硅膜具有与基板接触并且位于比第一氧化硅膜的下表面低的第二下表面,以及硅 形成在第二氧化硅膜的上表面上的氮化物膜。
    • 8. 发明申请
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US20060244094A1
    • 2006-11-02
    • US11412951
    • 2006-04-28
    • Minori KajimotoMitsuhiro Noguchi
    • Minori KajimotoMitsuhiro Noguchi
    • H01L29/00H01L21/4763
    • H01L27/105H01L21/76807H01L27/11526H01L27/11546H01L29/78
    • A semiconductor device including a semiconductor substrate of a first conductive type; a first semiconductor region of the first conductive type formed on the semiconductor substrate; a second semiconductor region of a second conductive type formed on the semiconductor substrate; a low-threshold low-voltage transistor formed on the semiconductor substrate; a high-threshold low-voltage transistor formed on the first semiconductor substrate; the high-threshold low-voltage transistor and the low-threshold low-voltage transistors formed on the second semiconductor substrate; an element isolation region formed on the semiconductor substrate to isolate elements; wherein a transistor forming region of the low-threshold low-voltage transistor in the semiconductor substrate is surrounded by the first semiconductor region.
    • 一种半导体器件,包括第一导电类型的半导体衬底; 形成在半导体衬底上的第一导电类型的第一半导体区域; 形成在所述半导体衬底上的第二导电类型的第二半导体区域; 形成在半导体基板上的低阈值低压晶体管; 形成在第一半导体衬底上的高阈值低压晶体管; 形成在第二半导体衬底上的高阈值低压晶体管和低阈值低压晶体管; 形成在所述半导体衬底上以隔离元件的元件隔离区; 其中半导体衬底中的低阈值低压晶体管的晶体管形成区域被第一半导体区域包围。
    • 10. 发明申请
    • Nonvolatile semiconductor memory
    • 非易失性半导体存储器
    • US20050265109A1
    • 2005-12-01
    • US11135415
    • 2005-05-24
    • Akira GodaMitsuhiro NoguchiMinori KajimotoYuji Takeuchi
    • Akira GodaMitsuhiro NoguchiMinori KajimotoYuji Takeuchi
    • H01L27/10G11C8/00G11C8/10G11C16/04G11C16/08G11C16/10H01L21/8247H01L27/115H01L29/788H01L29/792
    • G11C8/10G11C16/0483G11C16/08G11C16/10H01L27/115H01L27/11521
    • A nonvolatile semiconductor memory includes: a memory cell array constituted by word lines, bit lines, and electrically erasable/rewritable memory cell transistors, which have respective tunnel insulating films and are arranged at the intersections of the word lines and the bit lines; and a word line transfer transistor, which is separated by an element isolation region, has a source diffusion layer, a channel region, a gate insulating film on the channel region, and a drain diffusion layer, and is connected to a word line and a gate electrode formed on the gate insulating film via a word line contact plug formed in the drain diffusion layer. The channel width of the word line transfer transistor is at least six times width of the word line contact plug, and the distance in a second direction between the word line contact plug and corresponding element isolation region is greater than distance in a first direction between the word line contact plug and corresponding element isolation region where, the first direction denotes a direction from the source diffusion layer towards the drain diffusion layer, and the second direction denotes a direction perpendicular to the first direction.
    • 非易失性半导体存储器包括:由字线,位线和电可擦除/可重写存储单元晶体管构成的存储单元阵列,其具有相应的隧道绝缘膜并且布置在字线和位线的交点处; 并且由元件隔离区隔开的字线传输晶体管在沟道区上具有源极扩散层,沟道区,栅极绝缘膜和漏极扩散层,并且连接到字线和 栅极通过形成在漏极扩散层中的字线接触插塞形成在栅极绝缘膜上。 字线传输晶体管的沟道宽度是字线接触插塞的至少六倍宽度,并且字线接触插塞和对应元件隔离区域之间的第二方向上的距离大于第二方向上的距离 字线接触插塞和对应元件隔离区域,其中第一方向表示从源极扩散层朝向漏极扩散层的方向,第二方向表示与第一方向垂直的方向。