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1. 发明授权

US09231012B2 Image sensor package 有权
标题翻译：图像传感器封装
公开(公告)号：US09231012B2
公开(公告)日：2016-01-05
申请号：US11882441
申请日：2007-08-01
申请人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
发明人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
IPC分类号： H01L31/0203 , H01L31/0232 , H01L31/062 , H01L27/146
CPC分类号： H01L27/14683 , H01L21/304 , H01L21/76898 , H01L24/06 , H01L24/11 , H01L24/17 , H01L24/81 , H01L25/50 , H01L27/14618 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14636 , H01L27/1464 , H01L27/14685 , H01L27/14687 , H01L27/1469 , H01L2224/10
摘要： An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.
摘要翻译：提供了一种图像传感器封装及其制造方法。图像传感器封装包括其中包括通孔的第一基板，驱动电路和其上的第一导电焊盘。包括其上的光敏器件和第二导电焊盘的第二衬底被结合到第一衬底，使得形成在第一衬底上的驱动电路可以电连接到并进一步控制形成在第二衬底上的光敏器件。在第一基板的背面上形成焊球，并电连接到用于传输来自驱动电路的信号的通路。由于感光装置和驱动电路分别制造在不同的基板上，所以其制造和设计更灵活。此外，图像传感器封装相对较薄，因此其尺寸减小。

2. 发明授权

US08500344B2 Compact camera module and method for fabricating the same 有权
标题翻译：紧凑型相机模块及其制造方法
公开(公告)号：US08500344B2
公开(公告)日：2013-08-06
申请号：US13189899
申请日：2011-07-25
申请人： Pai-Chun Peter Zung , Jau-Jan Deng , Wei-Ping Chen
发明人： Pai-Chun Peter Zung , Jau-Jan Deng , Wei-Ping Chen
IPC分类号： G03B17/00 , G02B7/02
CPC分类号： G02B7/021 , H01L27/14618 , H01L27/14623 , H01L27/14625 , H01L27/14683 , H01L2224/13 , H04N5/2251 , H04N5/2257 , Y10T29/49826
摘要： The invention provides a compact camera module and a method for fabricating the same. A compact camera module includes an image sensor device package. A back spacer ring is disposed on the image sensor device package. A first edge of the back spacer ring is aligned to a second edge of the image sensor device package. An optical lens plate disposed over the back spacer ring. A front spacer ring is sandwiched between the back spacer ring and the optical lens plate. A third edge of the front spacer ring is aligned to a fourth edge of the optical lens plate.
摘要翻译：本发明提供一种紧凑型相机模块及其制造方法。小型相机模块包括图像传感器装置包装。后隔离环设置在图像传感器装置封装上。后间隔环的第一边缘对准图像传感器装置包装的第二边缘。设置在后隔离环上的光学透镜板。前间隔环夹在后间隔环和光学透镜板之间。前间隔环的第三边缘与光学透镜板的第四边缘对准。

3. 发明授权

US07898070B2 Image sensor package and fabrication method thereof 有权
标题翻译：图像传感器封装及其制造方法
公开(公告)号：US07898070B2
公开(公告)日：2011-03-01
申请号：US12543804
申请日：2009-08-19
申请人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
发明人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
IPC分类号： H01L23/02 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/10
摘要： The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.
摘要翻译：本发明提供一种图像传感器封装及其制造方法。图像传感器封装包括其上包括传感器装置的第一基板和其中的孔。包括第一开口的焊盘形成在第一基板的上表面上。包括其中具有第二开口的间隔元件的第二基板设置在第一基板上。导电插塞形成在孔中，并通过第一和第二开口到第二基板，以与接合焊盘电接触。导电层形成在第一基板的下表面上并电连接到导电插塞。在导电层上形成焊球，并通过导电插塞与焊盘电连接。图像传感器封装还包括与第一基板结合的第二基板。图像传感器封装相对较薄，因此其尺寸相对减小。

4. 发明授权

US07703997B2 Image sensor module having precise image-projection control 有权
标题翻译：图像传感器模块具有精确的图像投影控制
公开(公告)号：US07703997B2
公开(公告)日：2010-04-27
申请号：US11653297
申请日：2007-01-16
申请人： Hsiao-Wen Lee , Tzu-Han Lin , Pai-Chun Peter Zung , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Tzu-Han Lin , Pai-Chun Peter Zung , Chien-Pang Lin
IPC分类号： G03B17/00 , H04N5/335 , H04N5/225 , G02B7/02
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/1469 , H01L2924/16195 , H04N5/2257
摘要： An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.
摘要翻译：图像传感器模块包括图像传感器芯片，至少一个透镜层和至少一个结合层。图像传感器芯片具有由图像捕获元件制造的图像捕获区域和围绕图像捕获区域的分隔区域。至少一个透镜层堆叠在图像传感器芯片上，具有透明基板和安装在透明基板上的透镜，并且适于将投影图像聚焦到图像传感器芯片的图像捕获区域上。所述至少一个接合层被布置成对应于图像传感器芯片的分隔区并且结合在图像传感器芯片和至少一个透镜层之间，胶粘剂与多个间隔元件的混合，每个间隔元件被确定为接合层的高度。

5. 发明申请

US20070070511A1 Wafer level image module 有权
标题翻译：晶圆级图像模块
公开(公告)号：US20070070511A1
公开(公告)日：2007-03-29
申请号：US11528461
申请日：2006-09-28
申请人： Hsiao-Wen Lee , Pai-Chun Peter Zung , Tzu-Han Lin
发明人： Hsiao-Wen Lee , Pai-Chun Peter Zung , Tzu-Han Lin
IPC分类号： G02B21/02
CPC分类号： H04N5/2254 , H04N5/2257
摘要： A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.
摘要翻译：晶片级图像模块包括用于在接收光时输出电信号的光传感器，用于将入射光聚焦到光传感器上的透镜组以及设置在光传感器和透镜组之间的调节构件，用于控制照片之间的距离传感器和透镜设置以补偿光传感器的聚焦偏移，以使透镜组能够以聚焦方式精确地将入射光聚焦到光传感器上，从而提供高图像质量。

6. 发明授权

US07826148B2 Aspheric lens structures and fabrication methods thereof 有权
标题翻译：非球面透镜结构及其制造方法
公开(公告)号：US07826148B2
公开(公告)日：2010-11-02
申请号：US11706192
申请日：2007-02-15
申请人： Pai-Chun Peter Zung , Shin-Chang Shiung , Wei-Ko Wang , Chia-Yang Chang , Chien-Pang Lin
发明人： Pai-Chun Peter Zung , Shin-Chang Shiung , Wei-Ko Wang , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： G02B13/18 , G02B3/02 , G02B3/00 , G02B9/00
CPC分类号： B29D11/00019 , B29D11/00375
摘要： Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
摘要翻译：公开了具有双非球面表面的非球面透镜结构及其制造方法。非球面透镜结构包括具有设置在第二透镜部件上的非球面顶表面的第一透镜部件，其中第一透镜部件和第二透镜部件之间的界面是球形的。第二透镜部件包括非球面后表面，其中第一透镜部件的非球面上表面的曲率半径不同于第二透镜部件的非球面后表面的曲率半径。第二透镜部件还可以包括平面后表面，其中第三透镜部件设置在第二部件的平面后表面上。第三透镜部件包括非球面后表面，其中第一透镜部件的非球面顶表面的曲率半径不同于第三透镜部件的非球面后表面的曲率半径。

7. 发明授权

US07679167B2 Electronic assembly for image sensor device and fabrication method thereof 有权
标题翻译：图像传感器装置用电子装配及其制造方法
公开(公告)号：US07679167B2
公开(公告)日：2010-03-16
申请号：US11707110
申请日：2007-02-16
申请人： Teng-Sheng Chen , Pai-Chun Peter Zung , Tzu-Han Lin , Shin-Chang Shiung
发明人： Teng-Sheng Chen , Pai-Chun Peter Zung , Tzu-Han Lin , Shin-Chang Shiung
IPC分类号： H01L23/552
CPC分类号： H04N5/335 , H01L27/14618 , H01L27/14683 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05569 , H01L2224/10 , H01L2924/00014 , H04N5/2254 , H04N5/2257 , H01L2224/05599 , H01L2224/05099
摘要： A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.
摘要翻译：公开了一种用于图像传感器装置的封装模块。封装模块包括设置在下基板和上基板之间的器件芯片。第一导电层在下基板的第一侧壁上方并且与器件芯片绝缘。第一保护层在第一导电层上，并且将第一导电层的一部分暴露在下基板的第一侧壁上。第一焊盘在下基板的底表面上并且电连接到第一导电层。本发明还公开了一种用于图像传感器装置的电子组件及其制造方法。

8. 发明申请

US20090309178A1 IMAGE SENSOR PACKAGE AND FABRICATION METHOD THEREOF 有权
标题翻译：图像传感器封装及其制造方法
公开(公告)号：US20090309178A1
公开(公告)日：2009-12-17
申请号：US12543804
申请日：2009-08-19
申请人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
发明人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
IPC分类号： H01L31/02
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/10
摘要： The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.
摘要翻译：本发明提供一种图像传感器封装及其制造方法。图像传感器封装包括其上包括传感器装置的第一基板和其中的孔。包括第一开口的焊盘形成在第一基板的上表面上。包括其中具有第二开口的间隔元件的第二基板设置在第一基板上。导电插塞形成在孔中，并通过第一和第二开口到第二基板，以与接合焊盘电接触。导电层形成在第一基板的下表面上并电连接到导电插塞。在导电层上形成焊球，并通过导电插塞与焊盘电连接。图像传感器封装还包括与第一基板结合的第二基板。图像传感器封装相对较薄，因此其尺寸相对减小。

9. 发明授权

US07528420B2 Image sensing devices and methods for fabricating the same 有权
标题翻译：图像感测装置及其制造方法
公开(公告)号：US07528420B2
公开(公告)日：2009-05-05
申请号：US11752427
申请日：2007-05-23
申请人： Jui-Peng Weng , Tzu-Han Lin , Pai-Chun Peter Zung
发明人： Jui-Peng Weng , Tzu-Han Lin , Pai-Chun Peter Zung
IPC分类号： H01L29/22 , H01L29/227 , H01L33/00 , H01L27/15 , H01L29/267 , H01L31/12 , H01L29/417 , H01L29/74 , H01L31/111 , H01L27/148 , H01L29/768 , H01L31/0203 , H01L31/00
CPC分类号： H01L27/14687 , H01L27/14618 , H01L2224/05001 , H01L2224/05009 , H01L2224/05147 , H01L2224/05184 , H01L2224/05548 , H01L2224/0557 , H01L2224/10 , H01L2924/00014 , Y10S257/911 , H01L2224/05599
摘要： Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device includes a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.
摘要翻译：提供了图像感测装置及其制造方法。示例性的图像感测装置包括具有相对的第一侧和第二侧的第一基板。在第一侧的第一基板中形成多个图像感测元件。通过第一基板形成导电通孔，其具有在第一侧被第一基板暴露的第一表面和在第二侧被第一基板暴露的第二表面。导电焊盘在第一侧覆盖导电通孔并且电连接图像感测元件。导电层位于第二侧的导电通孔上，并与导电焊盘电连接。在导电层的一部分上形成导电凸块。第二衬底在第一侧与第一衬底结合。

10. 发明授权

US08153458B2 Image sensing devices and methods for fabricating the same 有权
标题翻译：图像感测装置及其制造方法
公开(公告)号：US08153458B2
公开(公告)日：2012-04-10
申请号：US12407115
申请日：2009-03-19
申请人： Jui-Ping Weng , Tzu-Han Lin , Pai-Chun Peter Zung
发明人： Jui-Ping Weng , Tzu-Han Lin , Pai-Chun Peter Zung
IPC分类号： H01L21/70 , H01L31/0232 , H01L31/14
CPC分类号： H01L27/14687 , H01L27/14618 , H01L2224/05001 , H01L2224/05009 , H01L2224/05147 , H01L2224/05184 , H01L2224/05548 , H01L2224/0557 , H01L2224/10 , H01L2924/00014 , Y10S257/911 , H01L2224/05599
摘要： Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.
摘要翻译：提供了图像感测装置及其制造方法。示例性图像感测装置包括具有彼此相对的第一侧和第二侧的第一基板。在第一侧的第一基板中形成多个图像感测元件。通过第一基板形成导电通孔，其具有在第一侧被第一基板暴露的第一表面和在第二侧被第一基板暴露的第二表面。导电焊盘在第一侧覆盖导电通孔并且电连接图像感测元件。导电层位于第二侧的导电通孔上，并与导电焊盘电连接。在导电层的一部分上形成导电凸块。第二衬底在第一侧与第一衬底结合。

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