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1. 发明授权

US08433183B2 Recording device and recording method 失效
标题翻译：记录装置和记录方法
公开(公告)号：US08433183B2
公开(公告)日：2013-04-30
申请号：US10504994
申请日：2003-10-29
申请人： Yasuhiro Hidaka , Masaaki Kojima , Shingo Yoshioka , Hidehiko Okumura , Kaname Ogawa , Hiroki Shiina
发明人： Yasuhiro Hidaka , Masaaki Kojima , Shingo Yoshioka , Hidehiko Okumura , Kaname Ogawa , Hiroki Shiina
IPC分类号： H04N5/783
CPC分类号： H04N9/8042 , G11B27/034 , G11B27/105 , G11B27/326 , G11B2220/2562 , H04N5/772 , H04N5/85 , H04N9/7921 , H04N9/8047
摘要： A recording apparatus and a recording method that can record both moving picture data and still picture data in a form reproducible by various reproducing apparatus. The moving picture data is compressed by an MPEG system by an MPEG encoder, formed into data for recording corresponding to a predetermined recording format by a format forming unit, and then recorded on a DVD. The still picture data is compressed by a JPEG system by a JPEG encoder, and recorded on the DVD separately from the moving picture data. In predetermined timing, the still picture data compressed by the JPEG system and recorded on the DVD is read, the still picture data is converted into I-pictures of the MPEG system by a format converting unit, and then the I-pictures of the MPEG system are recorded onto the DVD in the predetermined format via the format forming unit.
摘要翻译：一种记录装置和记录方法，其可以以各种再现装置可再现的形式记录运动图像数据和静止图像数据。运动图像数据由MPEG编码器由MPEG系统压缩，通过格式形成单元形成为与预定记录格式相对应的用于记录的数据，然后记录在DVD上。静止图像数据由JPEG编码器由JPEG系统压缩，并与动态图像数据分开记录在DVD上。在预定的定时中，读取由JPEG系统压缩并记录在DVD上的静止图像数据，静止图像数据由格式转换单元转换成MPEG系统的I图像，然后将MPEG的I图像系统经由格式形成单元以预定格式记录在DVD上。

2. 发明授权

US08272126B2 Method of producing circuit board 有权
标题翻译：电路板生产方法
公开(公告)号：US08272126B2
公开(公告)日：2012-09-25
申请号：US12431950
申请日：2009-04-29
申请人： Shingo Yoshioka , Hiroaki Fujiwara
发明人： Shingo Yoshioka , Hiroaki Fujiwara
IPC分类号： H05K3/02
CPC分类号： H05K3/184 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/15173 , H01L2924/15311 , H05K1/0206 , H05K1/023 , H05K1/0269 , H05K1/0284 , H05K1/11 , H05K1/162 , H05K3/0014 , H05K3/0032 , H05K3/107 , H05K3/381 , H05K3/4069 , H05K3/4647 , H05K3/4661 , H05K2201/09381 , H05K2201/096 , H05K2201/09736 , H05K2201/2072 , H05K2203/0108 , H05K2203/0565 , H05K2203/161 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00014 , H01L2924/00
摘要： An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process.The method of producing a multilayer circuit board in an aspect of the present invention includes a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the swellable resin film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the swellable resin film.
摘要翻译：本发明的一个方面的目的是提供一种电路板的制造方法，其能够高精度地保存电路剖面，并且通过加法处理给出具有所需深度的电路以准备精细电路。在本发明的一个方面中，制造多层电路板的方法包括：在绝缘性基板的表面上形成可溶胀树脂膜的成膜工序;形成电路槽的电路槽形成工序，其深度等于或大于可溶胀树脂膜的外表面上的可溶胀树脂膜的厚度，在电路槽的表面和可溶胀树脂膜的表面上沉积电镀催化剂或其前体的催化剂沉积步骤，使用特定液体使溶胀性树脂膜溶胀，然后将所述溶胀树脂膜与所述绝缘性基板表面分离的膜分离工序，以及仅在所述镀催化剂或所述镀层的区域形成无电镀膜的电镀处理工序在可溶胀树脂膜分离之后，由电镀催化剂前体形成的催化剂保持未分离。

3. 发明申请

US20120206891A1 CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON CIRCUIT BOARD 有权
标题翻译：电路板和具有安装在电路板上的组件的半导体器件
公开(公告)号：US20120206891A1
公开(公告)日：2012-08-16
申请号：US13504281
申请日：2010-10-28
申请人： Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda
发明人： Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda
IPC分类号： H05K7/06 , H05K1/02
CPC分类号： H05K1/111 , H01L21/4846 , H01L23/49811 , H01L24/16 , H01L24/81 , H01L2224/16237 , H01L2224/81191 , H01L2224/81385 , H01L2224/82385 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K3/107 , H05K3/184 , H05K3/38 , H05K2201/0373 , H05K2201/0391 , H05K2201/09736 , H05K2201/2072 , H05K2203/0307 , H05K2203/0565 , Y02P70/611 , Y10T29/49155 , H01L2924/00
摘要： A circuit board H10 according to the present invention is a circuit board H10 in which an electric circuit H6 including a wiring section H6a and a pad section H6b is provided in the surface of an insulating base substrate H1. The electric circuit H6 is configured such that a conductor H5 is embedded in a circuit recess H3 formed in the surface of the insulating base substrate H1, and the surface roughness of the conductor H5 is different in the wiring section H6a and the pad section H6b of the electric circuit H6. In this case, it is preferable that the surface roughness of the conductor H5 in the pad section H6b is greater than the surface roughness of the conductor H5 in the wiring section H6a.
摘要翻译：根据本发明的电路板H10是电路板H10，其中包括布线部分H6a和焊盘部分H6b的电路H6设置在绝缘基板H1的表面中。电路H6被配置为使得导体H5嵌入在形成在绝缘性基板H1的表面上的电路凹部H3中，并且导体H5的表面粗糙度在布线部H6a和焊盘部H6b中不同电路H6。在这种情况下，优选的是，焊盘部H6b中的导体H5的表面粗糙度大于布线部H6a中的导体H5的表面粗糙度。

4. 发明授权

US07233736B2 Recording method and apparatus, and recording medium 失效
标题翻译：记录方法和装置以及记录介质
公开(公告)号：US07233736B2
公开(公告)日：2007-06-19
申请号：US10431877
申请日：2003-05-07
申请人： Kenichiro Aridome , Katsumi Matsuno , Shingo Yoshioka , Akinobu Sugino
发明人： Kenichiro Aridome , Katsumi Matsuno , Shingo Yoshioka , Akinobu Sugino
IPC分类号： H04N5/91
CPC分类号： G11B20/1251 , G11B20/1254 , G11B27/034 , G11B27/105 , G11B27/329 , G11B2020/10861 , G11B2020/10944 , G11B2020/1241 , G11B2220/213 , G11B2220/216 , G11B2220/218 , G11B2220/2562 , G11B2220/2575 , H04N5/85 , H04N9/7921 , H04N9/8042 , H04N9/8047
摘要： In a ROW-based DVD-RW, a DVD video file is managed according to provisional VMGI (TMP_VMGI) and an extension file other than the DVD video file, such as a JPEG file or the like is managed according to intermediate management information (TMP_EXTI), and temporary space bitmap (TMP_SBM) used in UDF and the like is added to provisional VMGI (TMP_VMGI to record a combination of the DVD video file and extension file such as JPEG file and manage the temporary space. Thereby, the temporary space can be known from TMP_SBM, and even when the extension file has been deleted, the DVD-RW is made interchangeable with a read-only optical disk through finalization. Thus, the present invention allows to record a file of still pictures other than moving pictures and also pad information in a temporary space resulted from deletion of any recorded area.
摘要翻译：在基于ROW的DVD-RW中，根据临时VMGI（TMP_VMGI）管理DVD视频文件，并且根据中间管理信息（TMP_EXTI）来管理诸如JPEG文件之类的DVD视频文件之外的扩展文件）和在UDF等中使用的临时空间位图（TMP_SBM）等添加到临时VMGI（TMP_VMGI）以记录DVD视频文件和诸如JPEG文件的扩展文件的组合，并管理临时空间，由此临时空间可以从TMP_SBM可以知道，即使扩展文件已被删除，DVD-RW也可以通过最终确定与只读光盘互换，因此本发明允许记录静态图像的文件，而不是运动图像，还可以在删除任何记录区域时产生临时空间中的信息。

5. 发明申请

US20060062111A1 Recording apparatus 失效
标题翻译：记录装置
公开(公告)号：US20060062111A1
公开(公告)日：2006-03-23
申请号：US11261377
申请日：2005-10-28
申请人： Shingo Yoshioka
发明人： Shingo Yoshioka
IPC分类号： G11B19/02 , G11B20/10
CPC分类号： H04N5/772 , G11B19/02 , G11B20/10 , G11B27/034 , G11B27/11 , G11B2220/2562 , G11B2220/65 , H04N5/85 , H04N9/8042
摘要： The present invention relates to a recording apparatus for improving operability of a DVD camcorder that performs recording in a video format. When an instruction for starting recording is given at a time T11 and then an instruction for stopping the recording is given at a time T12, a DVD camcorder is brought into a pause state at the time T12. An address and the like of an optical disk at that time are stored in a recording RAM. When an instruction for resuming recording is given at a time T13, the address stored in the recording RAM is read, and rerecording is started at a position on the optical disk which position corresponds to the address. The present invention is applicable to DVD camcorders.
摘要翻译：本发明涉及一种用于改善以视频格式进行记录的DVD摄像机的可操作性的记录装置。当在时间T 11给出开始记录的指令，然后在时间T 12给出停止记录的指令时，DVD摄像机在时间T 12处于暂停状态。地址等此时的光盘被存储在记录RAM中。当在时间T 13给出用于恢复记录的指令时，读取存储在记录RAM中的地址，并且在光盘上与位置对应的位置处开始再记录。本发明适用于DVD摄像机。

6. 发明授权

US09480148B2 Metal-clad laminate and printed wiring board 有权
标题翻译：覆金属层压板和印刷线路板
公开(公告)号：US09480148B2
公开(公告)日：2016-10-25
申请号：US14000834
申请日：2012-02-15
申请人： Hiroharu Inoue , Shingo Yoshioka , Koji Kishino , Takatoshi Abe
发明人： Hiroharu Inoue , Shingo Yoshioka , Koji Kishino , Takatoshi Abe
IPC分类号： H05K1/02 , B32B15/08 , H05K1/03 , B32B15/14 , H05K3/02
CPC分类号： H05K1/0271 , B32B15/08 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2457/08 , H05K1/036 , H05K1/0366 , H05K3/022 , H05K2201/0209 , H05K2201/029 , Y10T428/24942 , Y10T428/2495 , Y10T428/24967 , Y10T428/24975
摘要： A metal-clad laminate of the present invention comprises an insulating layer, and a metal layer that is present at least on one surface side of the insulating layer. The insulating layer is a laminate of at least three layers: a center layer, a first resin layer that is present on one surface side of the center layer, and a second resin layer that is present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a respective resin composition. The elastic modulus of the cured product of the resin composition contained in the center layer is lower than the elastic moduli of both the cured product of the resin composition contained in the first resin layer and the cured product of the resin composition contained in the second resin layer.
摘要翻译：本发明的覆金属层压板包括绝缘层和存在于绝缘层的至少一个表面侧上的金属层。绝缘层是至少三层的层叠体：中心层，存在于中心层的一个表面侧的第一树脂层和存在于中心层的另一个表面侧的第二树脂层。中心层，第一树脂层和第二树脂层各自含有各自的树脂组合物的固化产物。包含在中心层中的树脂组合物的固化产物的弹性模量低于包含在第一树脂层中的树脂组合物的固化产物和包含在第二树脂中的树脂组合物的固化产物的弹性模量层。

7. 发明授权

US09332650B2 Method of producing multilayer circuit board 有权
标题翻译：生产多层电路板的方法
公开(公告)号：US09332650B2
公开(公告)日：2016-05-03
申请号：US13494417
申请日：2012-06-12
申请人： Shingo Yoshioka , Hiroaki Fujiwara
发明人： Shingo Yoshioka , Hiroaki Fujiwara
IPC分类号： H05K3/02 , H05K3/18 , H05K1/16 , H05K3/10 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/38 , H05K3/40 , H05K3/46
CPC分类号： H05K3/184 , H01L2224/48091 , H01L2224/48227 , H01L2924/15173 , H01L2924/15311 , H05K1/0206 , H05K1/023 , H05K1/0284 , H05K1/11 , H05K1/162 , H05K3/0014 , H05K3/0032 , H05K3/107 , H05K3/381 , H05K3/4069 , H05K3/4647 , H05K3/4661 , H05K2201/09381 , H05K2201/096 , H05K2201/09736 , H05K2203/0108 , H05K2203/0565 , Y10T29/49114 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014
摘要： The present invention relates to a method of producing a multilayer circuit board including: a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the film.
摘要翻译：本发明涉及一种制造多层电路板的方法，包括：在绝缘基板的表面上形成可溶胀树脂膜的成膜步骤，形成电路槽的电路槽形成步骤，该电路槽的深度等于或等于大于膜的外表面上的可溶胀树脂膜的厚度，在电路槽的表面和可溶胀树脂膜的表面上沉积电镀催化剂或其前体的催化剂沉积步骤，分离步骤，用特定的液体使溶胀性树脂膜溶胀，然后从膨胀的基材表面分离溶胀的树脂膜;以及电镀处理步骤，仅在由镀催化剂或电镀催化剂形成的镀层催化剂的区域形成无电镀膜电镀催化剂前体在分离膜后保持未分离。

8. 发明申请

US20130337188A1 RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD 有权
标题翻译：用于生产电路板的树脂组合物和方法
公开(公告)号：US20130337188A1
公开(公告)日：2013-12-19
申请号：US14002970
申请日：2011-11-28
申请人： Yuko Konno , Hiromitsu Takashita , Tsuyoshi Takeda , Hiroaki Fujiwara , Shingo Yoshioka
发明人： Yuko Konno , Hiromitsu Takashita , Tsuyoshi Takeda , Hiroaki Fujiwara , Shingo Yoshioka
IPC分类号： H05K1/03 , H05K3/00
CPC分类号： C08K5/3475 , C08K5/005 , C08L33/02 , C09D125/08 , C09D133/08 , H05K1/0353 , H05K3/0014 , H05K3/0026 , H05K3/0032 , H05K3/107 , H05K3/184 , H05K2201/0112 , H05K2201/0209 , H05K2201/0239 , H05K2203/0264 , H05K2203/0565 , H05K2203/0571
摘要： The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).
摘要翻译：本发明涉及一种树脂组合物，其包含由含有至少一个羧基的单体单元的第一单体和可与第一单体共聚的第二单体组成的共聚物，并且还包括紫外线吸收剂。所使用的树脂组合物是当通过在溶剂中溶解通过将树脂组合物作为液体形成的树脂膜2溶解而制备的溶液中的E1表示树脂膜2的每单位重量的吸光度系数的树脂组合物在要照射树脂膜2的光波长处的E1为至少0.01（L /（g·cm））。

9. 发明申请

US20130056247A1 WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICONDUCTOR DEVICE, WIRING BOARD, MEMORY CARD, ELECTRIC DEVICE, MODULE AND MULTILAYER CIRCUIT BOARD 有权
标题翻译：布线方式，表面布线结构，半导体器件，接线板，存储卡，电气设备，模块和多层电路板
公开(公告)号：US20130056247A1
公开(公告)日：2013-03-07
申请号：US13698975
申请日：2011-05-11
申请人： Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda , Yuko Konno
发明人： Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda , Yuko Konno
IPC分类号： H05K1/02 , H05K3/10
CPC分类号： H05K3/184 , C23C18/1608 , C23C18/1653 , C23C18/1893 , C25D7/0607 , H01L21/4832 , H01L21/6835 , H01L23/3121 , H01L23/49541 , H01L23/49582 , H01L23/49827 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2221/68359 , H01L2221/68377 , H01L2224/24051 , H01L2224/24137 , H01L2224/24145 , H01L2224/24146 , H01L2224/24225 , H01L2224/24226 , H01L2224/24998 , H01L2224/32145 , H01L2224/82001 , H01L2224/82039 , H01L2224/82101 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06568 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H05K1/185 , H05K3/10 , H05K3/284 , H05K3/4644 , H05K2201/10636 , H05K2201/10674 , H05K2203/0264 , H05K2203/072 , H05K2203/0723 , H05K2203/0769 , H05K2203/1407 , H05K2203/1469 , Y02P70/611 , H05K3/4661 , H01L2924/00
摘要： A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.
摘要翻译：提供一种布线方法，其中绝缘层形成在半导体器件1的暴露多个连接端子的表面上，树脂膜形成在绝缘层的表面上，深度等于或超过树脂膜的厚度由树脂膜的表面侧形成，使得沟槽在要连接的连接端子附近通过，此外，连通孔将从该部分到达要连接的连接端子形成沟槽附近的沟槽。

10. 发明申请

US20120292083A1 METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD 审中-公开
标题翻译：通过添加方法生产电路板的方法，以及由方法获得的电路板和多层电路板
公开(公告)号：US20120292083A1
公开(公告)日：2012-11-22
申请号：US13562500
申请日：2012-07-31
申请人： Shingo YOSHIOKA , Hiroaki FUJIWARA
发明人： Shingo YOSHIOKA , Hiroaki FUJIWARA
IPC分类号： H05K3/46 , H05K1/02 , H05K3/10
CPC分类号： H05K3/184 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/15173 , H01L2924/15311 , H05K1/0206 , H05K1/023 , H05K1/0269 , H05K1/0284 , H05K1/11 , H05K1/162 , H05K3/0014 , H05K3/0032 , H05K3/107 , H05K3/381 , H05K3/4069 , H05K3/4647 , H05K3/4661 , H05K2201/09381 , H05K2201/096 , H05K2201/09736 , H05K2201/2072 , H05K2203/0108 , H05K2203/0565 , H05K2203/161 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a method of producing a circuit board, comprising: a film-forming step of forming a resin film on the surface of an insulative substrate; a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the resin film on the external surface of the resin film; a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves on the insulative substrate and the surface of the resin film; a film-removing step of removing the resin film; and a plating processing step of electroless-plating the insulative substrate after removal of the resin film, wherein a partial reinforcing structure is formed in a region of the circuit groove in the circuit groove-forming step.
摘要翻译：本发明涉及电路板的制造方法，其特征在于，包括：在绝缘性基板的表面上形成树脂膜的成膜工序; 电路槽形成步骤，形成深度等于或大于树脂膜的外表面上的树脂膜的厚度的电路槽; 催化剂沉积步骤，在绝缘基板和树脂膜的表面上的电路槽的表面上沉积电镀催化剂或其前体; 除去树脂膜的除膜工序; 以及电镀处理步骤，在去除所述树脂膜之后对所述绝缘基板进行无电镀，其中在所述电路槽形成步骤中在所述电路槽的区域中形成部分增强结构。

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