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    • 5. 发明申请
    • ELECTRICAL CONTACTS FOR SKUTTERUDITE THERMOELECTRIC MATERIALS
    • SKUTTERUDITE热电材料的电气接触
    • US20120006376A1
    • 2012-01-12
    • US13161156
    • 2011-06-15
    • JEAN-PIERRE FLEURIALThierry CaillatSu Chih Chi
    • JEAN-PIERRE FLEURIALThierry CaillatSu Chih Chi
    • H01L35/32H01L35/34H01L35/18
    • H01L35/08H01L35/18
    • A thermally stable diffusion barrier for bonding skutterudite-based materials with metal contacts is disclosed. The diffusion barrier may be employed to inhibit solid-state diffusion between the metal contacts, e.g. titanium (Ti), nickel (Ni), copper (Cu), palladium (Pd) or other suitable metal electrical contacts, and a skutterudite thermoelectric material including a diffusible element, such as antimony (Sb), phosphorous (P) or arsenic (As), e.g. n-type CoSb3 or p-type CeFe4−xCoxSb12 where the diffusible element is Sb, to slow degradation of the mechanical and electrical characteristics of the device. The diffusion barrier may be employed to bond metal contacts to thermoelectric materials for various power generation applications operating at high temperatures (e.g. 673 K or above). Some exemplary diffusion barrier materials have been identified such as zirconium (Zr), hafnium (Hf), and yttrium (Y).
    • 公开了一种热稳定的扩散阻挡层,用于粘接具有金属触点的方钴矿基材料。 可以使用扩散阻挡层来抑制金属触点之间的固态扩散,例如, 钛(Ti),镍(Ni),铜(Cu),钯(Pd)或其它合适的金属电触点,以及包括可扩散元素如锑(Sb),磷(P)或砷 As),例如 n型CoSb3或p型CeFe4-xCoxSb12,其中可扩散元素为Sb,从而缓慢降低器件的机械和电气特性。 可以使用扩散阻挡层将金属触点接合到用于在高温(例如673K或更高)下操作的各种发电应用的热电材料。 已经鉴定了一些示例性的扩散阻挡材料,例如锆(Zr),铪(Hf)和钇(Y)。
    • 6. 发明授权
    • Micromachined thermoelectric sensors and arrays and process for producing
    • 微加工热电传感器和阵列及其制造工艺
    • US6046398A
    • 2000-04-04
    • US190416
    • 1998-11-04
    • Marc C. FooteEric W. JonesThierry Caillat
    • Marc C. FooteEric W. JonesThierry Caillat
    • G01J5/12H01L35/18H01L35/00
    • H01L35/18G01J5/12
    • Linear arrays with up to 63 micromachined thermopile infrared detectors on silicon substrates have been constructed and tested. Each detector consists of a suspended silicon nitride membrane with 11 thermocouples of sputtered Bi--Te and Bi--Sb--Te thermoelectric elements films. At room temperature and under vacuum these detectors exhibit response times of 99 ms, zero frequency D* values of 1.4.times.10.sup.9 cmHz.sup.1/2 /W and responsivity values of 1100 V/W when viewing a 1000 K blackbody source. The only measured source of noise above 20 mHz is Johnson noise from the detector resistance. These results represent the best performance reported to date for an array of thermopile detectors. The arrays are well suited for uncooled dispersive point spectrometers. In another embodiment, also with Bi--Te and Bi--Sb--Te thermoelectric materials on micromachined silicon nitride membranes, detector arrays have been produced with D* values as high as 2.2.times.10.sup.9 cmHz.sup.1/2 /W for 83 ms response times.
    • 已经构建并测试了在硅衬底上具有多达63个微加工热电堆红外探测器的线性阵列。 每个检测器由具有11个溅射Bi-Te和Bi-Sb-Te热电元件膜的11个热电偶的悬浮氮化硅膜组成。 在室温和真空下,这些检测器的响应时间为99 ms,零频率D *值为1.4x109 cmHz + E,fra 1/2 + EE / W,当查看1000 K黑体源时,响应度值为1100 V / W 。 20 mHz以上唯一测得的噪声源是来自检测器电阻的约翰逊噪声。 这些结果代表迄今为止报道的热电堆检测器阵列的最佳性能。 阵列非常适合于非冷却色散点光谱仪。 在另一个实施方案中,对于微加工氮化硅膜上的Bi-Te和Bi-Sb-Te热电材料,已经生产了具有高达2.2×10 9 cmHz + E的D *值的检测器阵列,为1/2 + EE / W 83 ms响应时间。