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1. 发明授权

US09855637B2 Thermographic characterization for surface finishing process development 有权
公开(公告)号：US09855637B2
公开(公告)日：2018-01-02
申请号：US14638892
申请日：2015-03-04
申请人： Apple Inc.
发明人： Lucas Allen Whipple , Simon Regis Louis Lancaster-Larocque , Collin D. Chan , Christopher R. Fagan , Vincent Yan , Ian S. Theilacker , Brian K. Miehm , Shravan Bharadwaj
IPC分类号： B24B49/14 , B24B49/12 , B24B49/16 , B24B49/00 , B24B37/015
CPC分类号： B24B49/14 , B24B5/00 , B24B7/00 , B24B29/00 , B24B37/015 , B24B41/061 , B24B49/006 , B24B49/12 , B24B49/16
摘要： A method and system for observing and monitoring thermal characteristics of a machining operation, such as a surface finishing operation, performed on a workpiece is disclosed. The surface finishing operation can be performed on the workpiece in order to remove a surface defect, e.g. a parting line, on a surface of the workpiece and/or to provide a mirror-like finish to the workpiece. In one embodiment, an emissive layer is applied to the workpiece to increase a thermal emissivity of the workpiece. In some embodiments, a finishing surface, such as a polishing or buffing wheel, and/or a lubricant used in a finishing operation is monitored. A thermal profile of the surface of the workpiece, finishing surface and/or lubricant can be obtained. The finishing operation can be modified in response to the monitored thermal characteristics to prevent the occurrence of defects and improve the efficacy of the finishing operation.

2. 发明申请

US20160302319A1 METHODS FOR ELECTRICALLY ISOLATING AREAS OF A METAL BODY 有权
标题翻译：金属体电气隔离区域的方法
公开(公告)号：US20160302319A1
公开(公告)日：2016-10-13
申请号：US14971791
申请日：2015-12-16
申请人： Apple Inc.
发明人： Francesco Ferretti , Joseph B. Marcinkowski , Collin D. Chan , Tom H. Engbersen
IPC分类号： H05K5/04 , H05K5/00 , H01Q1/42
CPC分类号： H01Q1/42 , H04M1/0202
摘要： Unitary structures having conductive portions electrically separated by non-conductive portions are described. In some embodiments, the non-conductive portions are made of metal oxide. In some embodiments, the method involves an oxidizing process adapted to convert an entire thickness at a selected portion of a metal substrate to a metal oxide, thereby creating metal portions that are electrically isolated from one another. In some embodiments, the thickness of the metal substrate is reduced at certain regions prior to oxidizing in order to provide a sufficiently thin metal for complete oxidization through the entire thickness. In some embodiments, the oxidizing process involves a plasma electrolytic oxidation process. In some embodiments, the plasma is concentrated at certain regions of the substrate for preferential oxidation. Applications for the substrate include enclosures and electrical components for electronic devices that use radio frequency communication.
摘要翻译：描述具有由非导电部分电隔离的导电部分的单一结构。在一些实施例中，非导电部分由金属氧化物制成。在一些实施例中，该方法涉及一种氧化工艺，其适用于将金属衬底的选定部分处的整个厚度转换为金属氧化物，从而产生彼此电隔离的金属部分。在一些实施例中，金属基板的厚度在氧化之前在某些区域被减小，以便提供足够薄的金属以在整个厚度上完全氧化。在一些实施方案中，氧化工艺涉及等离子体电解氧化工艺。在一些实施例中，等离子体被浓缩在衬底的某些区域以进行优先氧化。用于基板的应用包括使用射频通信的电子设备的外壳和电气部件。

3. 发明申请

US20140364043A1 CONSUMABLE ABRASIVE TOOL FOR CREATING SHINY CHAMFER 有权
标题翻译：用于创建SHINY CHAMFER的消耗性磨料工具
公开(公告)号：US20140364043A1
公开(公告)日：2014-12-11
申请号：US14167601
申请日：2014-01-29
申请人： Apple Inc.
发明人： Simon Regis Louis Lancaster-Larocque , Collin D. Chan
IPC分类号： B24B9/00 , B24B29/00 , B24B53/04 , B24D11/00
CPC分类号： B24B9/00 , B24B29/005 , B24D11/00 , B24D13/00
摘要： The disclosed embodiments relate generally to methods for creating smooth cosmetic surfaces along small features of an electronic device. The disclosed embodiments are well suited for reaching surfaces disposed in constrained spaces. More specifically a method for finishing a workpiece is described. For example, the method may be employed to finish an inlet portion of a cable connector. The method may involve the use of an abrasive brush which may include a single filament and abrasive particles coupled thereto, which can be configured to provide any number of different surface geometries during a finishing operation.
摘要翻译：所公开的实施例一般涉及沿着电子设备的小特征创建光滑的化妆品表面的方法。所公开的实施例非常适合于到达设置在约束空间中的表面。更详细地描述了一种完成工件的方法。例如，该方法可用于完成电缆连接器的入口部分。该方法可以涉及使用研磨刷，其可以包括单个细丝和与其连接的磨料颗粒，其可被配置为在整理操作期间提供任何数量的不同表面几何形状。

4. 发明授权

US09610670B2 Consumable abrasive tool for creating shiny chamfer 有权
公开(公告)号：US09610670B2
公开(公告)日：2017-04-04
申请号：US14167601
申请日：2014-01-29
申请人： Apple Inc.
发明人： Simon Regis Louis Lancaster-Larocque , Collin D. Chan
IPC分类号： B24B9/00 , B24D11/00 , B24B29/00 , B24D13/00
CPC分类号： B24B9/00 , B24B29/005 , B24D11/00 , B24D13/00
摘要： The disclosed embodiments relate generally to methods for creating smooth cosmetic surfaces along small features of an electronic device. The disclosed embodiments are well suited for reaching surfaces disposed in constrained spaces. More specifically a method for finishing a workpiece is described. For example, the method may be employed to finish an inlet portion of a cable connector. The method may involve the use of an abrasive brush which may include a single filament and abrasive particles coupled thereto, which can be configured to provide any number of different surface geometries during a finishing operation.

5. 发明申请

US20150030379A1 SOLID STATE DEPOSITION METHODS, APPARATUSES, AND PRODUCTS 有权
标题翻译：固态沉积方法，装置和产品
公开(公告)号：US20150030379A1
公开(公告)日：2015-01-29
申请号：US14340473
申请日：2014-07-24
申请人： Apple Inc.
发明人： Simon R. Lancaster-Larocque , Collin D. Chan , Kenneth A. Ross , Lindsay D. Corbet , Ari P. Miller , Thomas G. Budd
IPC分类号： B32B37/02 , B32B37/12
CPC分类号： C23C24/04 , Y10T29/4998 , Y10T403/472
摘要： The described embodiments relate generally to methods to enhance cosmetic surfaces of friction stir processed parts. More specifically a method for applying cold spray over a weld line generated by the friction stir processing is disclosed. Methods are also disclosed for blending the cold spray applied over the weld line in with a cosmetic surface portion of friction stir processed parts. In some embodiments cold spray can be used to on its own to create a cosmetic joint between various parts. Structural joints between first and second substrates may also be formed via solid state deposition. Such joints may be strengthened through use of a hidden weld, mechanical interlocking between the substrates, and/or coupling via fasteners.
摘要翻译：所描述的实施例一般涉及增强摩擦搅拌处理部件的化妆品表面的方法。更具体地说，公开了一种通过摩擦搅拌处理产生的熔接线上施加冷喷雾的方法。还公开了将焊接线上施加的冷喷涂与摩擦搅拌处理部件的化妆品表面部分混合的方法。在一些实施方案中，可以使用冷喷涂来自身以在各种部件之间形成化妆品接头。也可以通过固态沉积形成第一和第二基板之间的结构接头。可以通过使用隐藏的焊缝，基板之间的机械互锁和/或通过紧固件联接来加强这种接头。

6. 发明申请

US20140364038A1 CYLINDRICAL LAPPING 有权
标题翻译：圆柱滚子
公开(公告)号：US20140364038A1
公开(公告)日：2014-12-11
申请号：US14185074
申请日：2014-02-20
申请人： Apple Inc.
发明人： Simon Regis Louis Lancaster-Larocque , Collin D. Chan
IPC分类号： B24B37/02 , B24B37/005
CPC分类号： B24B37/02 , B24B5/042 , B24B5/045 , B24B5/047 , B24B37/005
摘要： The described embodiments relate generally to lapping operations and related systems and apparatuses. Various embodiments of lapping tables are described for applying a lapping operation to a non-planar surface of a workpiece. For example, methods and apparatus are described which allow a lapping operation to be applied to a curved outer surface portion of a cylindrical workpiece. Lapping of non-planar outer surfaces of workpieces is conducted by rotating the workpieces during the lapping operations.
摘要翻译：所描述的实施例一般涉及研磨操作和相关系统和装置。描述了研磨台的各种实施例，用于将研磨操作应用于工件的非平面表面。例如，描述了允许将研磨操作应用于圆柱形工件的弯曲外表面部分的方法和装置。通过在研磨操作期间旋转工件来进行工件的非平面外表面的研磨。

7. 发明申请

US20200221583A1 MULTI-PART ELECTRONIC DEVICE HOUSING HAVING CONTIGUOUS FILLED SURFACE 审中-公开
公开(公告)号：US20200221583A1
公开(公告)日：2020-07-09
申请号：US16820513
申请日：2020-03-16
申请人： Apple Inc.
发明人： Ming Kun Shi , Lindsay D. Corbet , Christopher Bruni , Collin D. Chan
IPC分类号： H05K5/00 , H05K5/02 , H01Q1/22 , H01Q1/42 , H05K5/06
摘要： A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.

8. 发明授权

US10617016B2 Multi-part electronic device housing having contiguous filled surface 有权
公开(公告)号：US10617016B2
公开(公告)日：2020-04-07
申请号：US16297439
申请日：2019-03-08
申请人： Apple Inc.
发明人： Ming Kun Shi , Lindsay D. Corbet , Christopher Bruni , Collin D. Chan
IPC分类号： H05K5/00 , H05K5/02 , H01Q1/22 , H01Q1/42 , H05K5/06
CPC分类号： H05K5/0004 , H01Q1/22 , H01Q1/42 , H05K5/0217 , H05K5/062
摘要： A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.

9. 发明授权

US09951425B2 Solid state deposition methods, apparatuses, and products 有权
公开(公告)号：US09951425B2
公开(公告)日：2018-04-24
申请号：US14340473
申请日：2014-07-24
申请人： Apple Inc.
发明人： Simon R. Lancaster-Larocque , Collin D. Chan , Kenneth A. Ross , Lindsay D. Corbet , Ari P. Miller , Thomas G. Budd
IPC分类号： C23C24/04
CPC分类号： C23C24/04 , Y10T29/4998 , Y10T403/472
摘要： The described embodiments relate generally to methods for enhancing cosmetic surfaces of friction stir processed parts. More specifically a method for applying cold spray over a weld line generated by friction stir processing is disclosed. Methods are also disclosed for blending the cold spray applied over the weld line with a cosmetic surface portion of the friction stir processed parts. In some embodiments cold spray can be used to create a cosmetic joint between various parts. Structural joints between first and second substrates may also be formed via solid state deposition. Such joints may be strengthened through use of a hidden weld, mechanical interlocking between the substrates, and/or coupling via fasteners.

10. 发明申请

US20170094811A1 MULTI-PART ELECTRONIC DEVICE HOUSING HAVING CONTIGUOUS FILLED SURFACE 有权
公开(公告)号：US20170094811A1
公开(公告)日：2017-03-30
申请号：US15280465
申请日：2016-09-29
申请人： Apple Inc.
发明人： Ming Kun Shi , Lindsay D. Corbet , Christopher Bruni , Collin D. Chan
IPC分类号： H05K5/00 , H01Q1/22 , H05K5/02
CPC分类号： H05K5/0004 , H01Q1/22 , H01Q1/42 , H05K5/0217 , H05K5/062
摘要： A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.

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