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    • 1. 发明授权
    • Optoelectric device and method for manufacturing the same
    • 光电器件及其制造方法
    • US09537044B2
    • 2017-01-03
    • US14438188
    • 2013-10-23
    • ALEDIACOMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    • Philippe GiletXavier HugonDavid VaufreyHubert BonoBérangère Hyot
    • H01L33/00H01L31/18B82Y40/00H01L33/18H01L33/08H01L33/24B82Y20/00
    • H01L33/007B82Y20/00B82Y40/00H01L31/1804H01L31/1852H01L33/0054H01L33/08H01L33/18H01L33/24
    • A method for manufacturing an optoelectric device comprising a semiconductor substrate, pads on a surface of the substrate; semiconductor elements, each element being in contact with a pad; and a dielectric region extending in the substrate from the surface and connecting, for each pair of pads, one of the pads in the pair to the other pad in the pair, the method successively comprising the forming of the pads and the forming of the region, wherein the region is formed by nitriding of the substrate, the method comprising the successive steps of: depositing a layer on the substrate; forming portions on the layer; etching the parts of the layer which are not covered with the portions to form the pads; removing the portions; and nitriding the pads and the parts of the substrate which are not covered with the pads, wherein the nitriding step successively comprises: a first step of nitriding of the pads at a first temperature; and a second step of nitriding of the parts of the substrate which are not covered with the pads at a second temperature different from the first temperature.
    • 一种制造光电器件的方法,包括半导体衬底,衬底表面上的焊盘; 半导体元件,每个元件与焊盘接触; 以及从表面延伸到基板中的电介质区域,对于每对焊盘,将该对中的一个焊盘中的一个焊盘连接到该对焊盘中的另一焊盘,该方法依次包括形成焊盘并形成区域 其中所述区域是通过对所述衬底进行氮化而形成的,所述方法包括以下步骤:在所述衬底上沉积一层; 在层上形成部分; 蚀刻未被部分覆盖的层的部分以形成焊盘; 去除部分; 并且对所述衬垫和所述衬底的未被衬垫覆盖的部分进行氮化,其中所述氮化步骤依次包括:在第一温度下对所述焊盘进行氮化的第一步骤; 以及在不同于所述第一温度的第二温度下氮化未被所述焊盘覆盖的所述衬底部分的第二步骤。
    • 7. 发明申请
    • OPTOELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 光电装置及其制造方法
    • US20150280053A1
    • 2015-10-01
    • US14438188
    • 2013-10-23
    • ALEDIACOMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    • Philippe GiletXavier HugonDavid VaufreyHubert BonoBérangère Hyot
    • H01L33/00H01L31/18
    • H01L33/007B82Y20/00B82Y40/00H01L31/1804H01L31/1852H01L33/0054H01L33/08H01L33/18H01L33/24
    • A method for manufacturing an optoelectric device comprising a semiconductor substrate, pads on a surface of the substrate; semiconductor elements, each element being in contact with a pad; and a dielectric region extending in the substrate from the surface and connecting, for each pair of pads, one of the pads in the pair to the other pad in the pair, the method successively comprising the forming of the pads and the forming of the region, wherein the region is formed by nitriding of the substrate, the method comprising the successive steps of: depositing a layer on the substrate; forming portions on the layer; etching the parts of the layer which are not covered with the portions to form the pads; removing the portions; and nitriding the pads and the parts of the substrate which are not covered with the pads, wherein the nitriding step successively comprises: a first step of nitriding of the pads at a first temperature; and a second step of nitriding of the parts of the substrate which are not covered with the pads at a second temperature different from the first temperature.
    • 一种制造光电器件的方法,包括半导体衬底,衬底表面上的焊盘; 半导体元件,每个元件与焊盘接触; 以及从表面延伸到基板中的电介质区域,对于每对焊盘,将该对中的一个焊盘中的一个焊盘连接到该对焊盘中的另一焊盘,该方法依次包括形成焊盘并形成区域 其中所述区域是通过对所述衬底进行氮化而形成的,所述方法包括以下步骤:在所述衬底上沉积一层; 在层上形成部分; 蚀刻未被部分覆盖的层的部分以形成焊盘; 去除部分; 并且对所述衬垫和所述衬底的未被衬垫覆盖的部分进行氮化,其中所述氮化步骤依次包括:在第一温度下对所述焊盘进行氮化的第一步骤; 以及在不同于所述第一温度的第二温度下氮化未被所述焊盘覆盖的所述衬底部分的第二步骤。