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    • 6. 发明申请
    • DRAIN EXTENDED MOS TRANSISTOR AND METHOD FOR FABRICATING THE SAME
    • 漏极扩展MOS晶体管及其制造方法
    • US20130168766A1
    • 2013-07-04
    • US13543252
    • 2012-07-06
    • Hee Bae LEEChoul Joo Ko
    • Hee Bae LEEChoul Joo Ko
    • H01L29/78H01L21/336
    • H01L29/1083H01L21/266H01L29/66659H01L29/7835
    • A drain extended MOS (DEMOS) transistor including at least one of: (1) A p-type epitaxial layer grown over an n-type semiconductor substrate. (2) An n-type well formed in a portion of the epitaxial layer. (3) A p-type drift region formed in another portion of the epitaxial layer. (4) A p-type source region formed in the well. (5) A p-type drain region formed in the drift region and spaced apart from the source region inside the epitaxial layer. (6) An n-type channel region extending between the drift region and the source region. (7) A gate structure formed over the channel region. (8) An n-type buried layer having a contact surface with the well and the drift region and formed in the epitaxial layer. A region of the buried layer has surface contact with the drift region and has a relatively low dopant concentration compared to other regions.
    • 一种漏极扩展MOS(DEMOS)晶体管,包括以下中的至少一个:(1)在n型半导体衬底上生长的p型外延层。 (2)在外延层的一部分中形成的n型阱。 (3)形成在外延层的另一部分中的p型漂移区。 (4)在井中形成的p型源区。 (5)形成在漂移区中并与外延层内的源极区隔开的p型漏极区。 (6)在漂移区域和源极区域之间延伸的n型沟道区域。 (7)形成在通道区域上的栅极结构。 (8)具有与阱和漂移区的接触面并形成在外延层中的n型掩埋层。 掩埋层的区域与漂移区域具有表面接触,并且与其它区域相比具有相对较低的掺杂剂浓度。
    • 10. 发明授权
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • US07687363B2
    • 2010-03-30
    • US11639928
    • 2006-12-15
    • Choul Joo Ko
    • Choul Joo Ko
    • H01L21/336
    • H01L29/6656H01L29/665H01L29/6659H01L29/7836
    • Disclosed is a method of manufacturing a semiconductor device, which includes the steps of: forming a high-voltage well region (e.g., by implanting impurity ions into a semiconductor substrate and then annealing); forming an isolation layer on the semiconductor substrate; implanting impurity ions into the high-voltage well region, thereby forming a low-voltage well region within the high-voltage well region; forming a gate electrode on the semiconductor substrate; and implanting impurity ions using the gate electrode as a mask, thereby forming source/drain regions within the low-voltage well region.
    • 公开了一种制造半导体器件的方法,其包括以下步骤:形成高电压阱区(例如,通过将杂质离子注入到半导体衬底中然后退火); 在所述半导体衬底上形成隔离层; 将杂质离子注入高电压阱区,从而在高电压阱区内形成低电压阱区; 在半导体衬底上形成栅电极; 以及使用栅极电极作为掩模注入杂质离子,从而在低电压阱区域内形成源极/漏极区域。