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1. 发明授权

US5598493A Method and system for forming an optical fiber microlens 失效
标题翻译：用于形成光纤微透镜的方法和系统
公开(公告)号：US5598493A
公开(公告)日：1997-01-28
申请号：US243142
申请日：1994-05-16
申请人： Harry B. Bonham, Jr. , Richard E. Lucas, Jr.
发明人： Harry B. Bonham, Jr. , Richard E. Lucas, Jr.
IPC分类号： G02B6/245 , G02B6/25 , G02B6/42 , G02B6/32
CPC分类号： G02B6/25 , G02B6/245 , G02B6/4203
摘要： A method and system for forming microlens (78) on an optical fiber (60) include optical fiber lensing device (10) having lowering mechanism (18) for inserting optical fiber (60) at a predetermined and controlled speed to a predetermined depth in oil-acid bath having oil layer (62), acid layer (64), and boundary (68) between oil layer (62) and acid layer (64). The next step is to etch optical fiber (60) at boundary (68) by forming meniscus (66) around optical fiber (60) to selectively and controllably form on optical fiber (60) a microlens (78) having a predetermined shape, preferably a hyperbolic shape. The etching includes the steps of first tapering optical fiber (60) to a shape determined by the distance that optical fiber (60) is first inserted into acid layer (64). The etch step further chemically mills microlens (78) on optical fiber (60) to the predetermined shape by controlling the etch time and position of optical fiber (60) relative to boundary (68) for etching optical fiber (60) at boundary (68).
摘要翻译：一种用于在光纤（60）上形成微透镜（78）的方法和系统包括具有用于以预定和控制的速度将光纤（60）插入油中预定深度的下降机构（18）的光纤透镜装置（10） - 含油层（62），酸层（64）和油层（62）与酸层（64）之间的边界（68）的酸浴。下一步是通过在光纤（60）周围形成弯液面（66）来在边界（68）处蚀刻光纤（60），以选择性地和可控地在光纤（60）上形成具有预定形状的微透镜（78）双曲形。蚀刻包括以下步骤：首先使光纤（60）逐渐变细，使之成为由光纤（60）首先插入酸层（64）的距离所确定的形状。蚀刻步骤通过控制光纤（60）相对于边界（68）的蚀刻时间和位置来蚀刻光纤（60）边界（68），进一步化学研磨光纤（60）上的微透镜（78）至预定形状）。

2. 发明授权

US5800666A Method and system for forming an optical fiber microlens 失效
标题翻译：用于形成光纤微透镜的方法和系统
公开(公告)号：US5800666A
公开(公告)日：1998-09-01
申请号：US726609
申请日：1996-10-07
申请人： Harry B. Bonham, Jr. , Richard E. Lucas, Jr.
发明人： Harry B. Bonham, Jr. , Richard E. Lucas, Jr.
IPC分类号： G02B6/245 , G02B6/25 , G02B6/42 , C03C25/06
CPC分类号： G02B6/25 , G02B6/245 , G02B6/4203
摘要： A method and system for forming microlens (78) on an optical fiber (60) include optical fiber lensing device (10) having lowering mechanism (18) for inserting optical fiber (60) at a predetermined and controlled speed to a predetermined depth in oil-acid bath having oil layer (62), acid layer (64), and boundary (68) between oil layer (62) and acid layer (64). The next step is to etch optical fiber (60) at boundary (68) by forming meniscus (66) around optical fiber (60) to selectively and controllably form on optical fiber (60) a microlens (78) having a predetermined shape, preferably a hyperbolic shape. The etching includes the steps of first tapering optical fiber (60) to a shape determined by the distance that optical fiber (60) is first inserted into acid layer (64). The etch step further chemically mills microlens (78) on optical fiber (60) to the predetermined shape by controlling the etch time and position of optical fiber (60) relative to boundary (68) for etching optical fiber (60) at boundary (68).
摘要翻译：一种用于在光纤（60）上形成微透镜（78）的方法和系统包括具有用于以预定和控制的速度将光纤（60）插入油中预定深度的下降机构（18）的光纤透镜装置（10） - 含油层（62），酸层（64）和油层（62）与酸层（64）之间的边界（68）的酸浴。下一步是通过在光纤（60）周围形成弯液面（66）来在边界（68）处蚀刻光纤（60），以选择性地和可控地在光纤（60）上形成具有预定形状的微透镜（78）双曲形。蚀刻包括以下步骤：首先使光纤（60）逐渐变细，使之成为由光纤（60）首先插入酸层（64）的距离所确定的形状。蚀刻步骤通过控制光纤（60）相对于边界（68）的蚀刻时间和位置来蚀刻光纤（60）边界（68），进一步化学研磨光纤（60）上的微透镜（78）至预定形状）。

3. 发明授权

US5689608A Fiber optic assembly 失效
标题翻译：光纤组件
公开(公告)号：US5689608A
公开(公告)日：1997-11-18
申请号：US485735
申请日：1995-06-07
申请人： Andrew J. Moore , David L. Ma , Robert L. Bontz , Harry B. Bonham, Jr.
发明人： Andrew J. Moore , David L. Ma , Robert L. Bontz , Harry B. Bonham, Jr.
IPC分类号： G02B6/38 , G02B6/42 , G02B6/00
CPC分类号： G02B6/4219 , G02B6/3855 , G02B6/4248
摘要： A method of increasing the attachment bond strength between a first and second object comprising respective first and second materials is disclosed. Each of the first and second materials has a respective first coefficient of thermal expansion at an assembly temperature, and a second coefficient of thermal expansion at an operational temperature. The method has various steps (FIG. 4). An attachment surface of the first material is configured to be nonplanar (FIGS. 3a, 36, 37). The second material is brought to a contact point with the attachment surface of the first material (FIGS. 3b, 46). The first and second materials are heated at the contact point to the assembly temperature whereby at least one of the materials is caused to flow in response to the heat. Finally, the first and second materials are brought to the operational temperature, wherein at least one of the first and second materials is placed in a compressive state at the contact point due to the relative change in size of at least one of the first and second materials as compared with the change in size of the other of the first and second materials.
摘要翻译：公开了一种增加包括相应的第一和第二材料的第一和第二物体之间的附着接合强度的方法。第一和第二材料中的每一个在组装温度下具有相应的第一热膨胀系数，以及在工作温度下的第二热膨胀系数。该方法具有各种步骤（图4）。第一材料的附接表面被配置为非平面的（图3a，36,37）。第二材料被带到与第一材料的附接表面的接触点（图3b，46）。第一和第二材料在接触点处被加热到组装温度，由此至少一种材料响应于热而流动。最后，使第一和第二材料达到操作温度，其中由于第一和第二材料中的至少一个的尺寸的相对变化，第一和第二材料中的至少一个在接触点处处于压缩状态材料与第一和第二材料中的另一种尺寸的变化相比。

4. 发明授权

US5509952A Method for bonding a fiber to a sleeve for fiber optic packaging applications 失效
标题翻译：用于将光纤粘合到用于光纤封装应用的套筒的方法
公开(公告)号：US5509952A
公开(公告)日：1996-04-23
申请号：US254438
申请日：1994-06-06
申请人： Andrew J. Moore , David L. Ma , Robert L. Bontz , Harry B. Bonham, Jr.
发明人： Andrew J. Moore , David L. Ma , Robert L. Bontz , Harry B. Bonham, Jr.
IPC分类号： G02B6/38 , G02B6/42 , C03B23/20
CPC分类号： G02B6/4219 , G02B6/3855 , G02B6/4248
摘要： In one embodiment, the present invention includes a method of increasing the attachment bond strength between a first and second object comprising respective first and second materials. Each of the first and second materials has a respective first coefficient of thermal expansion at an assembly temperature, and a second coefficient of thermal expansion at an operational temperature. The method has various steps (FIG. 4). An attachment surface of the first material is configured to be nonplanar (FIG. 3a, 36, 37). The second material is brought to a contact point with the attachment surface of the first material (FIG. 3b, 46). The first and second materials are heated at the contact point to the assembly temperature whereby at least one of the materials is caused to flow in response to the heat. Finally, the first and second materials are brought to the operational temperature, wherein at least one of the first and second materials is placed in a compressive state at the contact point due to the relative change in size of at least one of the first and second materials as compared with the change in size of the other of the first and second materials. In a second and third embodiment, the present invention pertains to a method of sealing an end of a sleeve having an axial channel and a fiber extending through the axial channel and outward from the sleeve end.
摘要翻译：在一个实施方案中，本发明包括增加第一和第二物体之间的附着粘合强度的方法，所述第一和第二物体包括相应的第一和第二材料。第一和第二材料中的每一个在组装温度下具有相应的第一热膨胀系数，以及在工作温度下的第二热膨胀系数。该方法具有各种步骤（图4）。第一材料的附接表面被配置为非平面的（图3a，36,37）。第二材料被带到与第一材料的附接表面的接触点（图3b，46）。第一和第二材料在接触点处被加热到组装温度，由此至少一种材料响应于热而流动。最后，使第一和第二材料达到操作温度，其中由于第一和第二材料中的至少一个的尺寸的相对变化，第一和第二材料中的至少一个在接触点处处于压缩状态材料与第一和第二材料中的另一种尺寸的变化相比。在第二和第三实施例中，本发明涉及一种密封具有轴向通道和延伸穿过轴向通道并从套筒端向外的纤维的套筒端部的方法。

5. 发明授权

US4445633A Automatic bonder for forming wire interconnections of automatically controlled configuration 失效
标题翻译：自动焊接机，用于形成自动控制配置的电线互连
公开(公告)号：US4445633A
公开(公告)日：1984-05-01
申请号：US348108
申请日：1982-02-11
申请人： Harry B. Bonham, Jr.
发明人： Harry B. Bonham, Jr.
IPC分类号： B23K20/00 , H01L21/00 , B23K31/02 , H01L21/90
CPC分类号： H01L24/85 , B23K20/005 , H01L24/48 , H01L24/78 , H01L2224/05554 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/78901 , H01L2224/851 , H01L2224/85181 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107
摘要： An automatic wire bonder for bonding at least one wire between a first predetermined location on a workpiece and a second predetermined location on a substrate on which the workpiece is carried includes a wire feeding head, and means for moving the head, in x, y, and z directions, relative to the workpiece, x and y being at least parallel to the plane of the workpiece and z being an elevation direction above the workpiece. Means are included for determining a z direction measurement between the first and second predetermined locations. The bonder is computer controlled to automatically dispense the wire and to configure it to a predetermined configuration to include a partially circular portion and an adjacent straight portion to be bonded between the first and second predetermined locations. The shape of the partially circular portion and the length of the straight portion are automatically determined by at least the z direction measurement.
摘要翻译：一种用于将工件上的第一预定位置和所述工件承载的基板上的第二预定位置之间的至少一根焊线接合的自动焊线机包括焊丝进给头，以及用于沿x，y移动所述头部的装置，和z方向，x和y至少平行于工件的平面，z是工件上方的高度方向。包括用于确定第一和第二预定位置之间的z方向测量的装置。计算机控制接合器以自动分配导线并将其配置成预定的构造，以包括部分圆形部分和相邻的待粘合在第一和第二预定位置之间的直线部分。至少z方向测量自动确定部分圆形部分的形状和直线部分的长度。

6. 发明授权

US5396032A Method and apparatus for providing electrical access to devices in a multi-chip module 失效
标题翻译：用于提供对多芯片模块中的设备的电接入的方法和装置
公开(公告)号：US5396032A
公开(公告)日：1995-03-07
申请号：US058553
申请日：1993-05-04
申请人： Harry B. Bonham, Jr. , Charles R. Pratt, III , Bryan K. Douglas
发明人： Harry B. Bonham, Jr. , Charles R. Pratt, III , Bryan K. Douglas
IPC分类号： H01L23/58 , H01L25/065 , H01L23/02
CPC分类号： H01L22/32 , H01L25/0655 , H01L2924/0002 , Y10T29/49004 , Y10T29/49121
摘要： Multi-chip module (MCM) (10) includes package body (12) having cavity (20) for accepting a plurality of devices and substrates and seal ring (26) to ensure the integrity of the package. Lead frame (18) having a plurality of individual leads (28) is coupled to the package body (12). Plurality of test points (38) or test pins (30) are located on the external surface of package body (12). A plurality of bond pads are located in cavity (20), including a first set or tier and a second set or tier of bond pads for electrically coupling the devices and substrates in the cavity (20) external to package body (12). The first set or tier of bond pads provides electrical connection between the individual devices in MCM (10) to plurality of test points (38) or test pins (30), and the second set or tier of bond pads provides electrical connection between the individual devices in MCM (10) and plurality of individual leads (28).
摘要翻译：多芯片模块（MCM）（10）包括具有腔体（20）的包装体（12），用于容纳多个装置和基板以及密封环（26），以确保包装的完整性。具有多个独立引线（28）的引线框架（18）联接到封装主体（12）。多个测试点（38）或测试销（30）位于包装体（12）的外表面上。多个接合焊盘位于空腔（20）中，包括第一组或第二组或第二组或第二组接合焊盘，用于将器件和衬底电耦合到封装主体（12）外部的空腔（20）中。第一组或多层接合焊盘提供MCM（10）中的各个器件与多个测试点（38）或测试引脚（30）之间的电连接，并且第二组或多层接合焊盘提供个体之间的电连接 MCM（10）中的设备和多个独立引线（28）。

7. 发明授权

US5301251A Method and apparatus for affixing an optic fiber tip in position with respect to a fiber communications circuit 失效
标题翻译：用于将光纤尖端相对于光纤通信电路固定在适当位置的方法和装置
公开(公告)号：US5301251A
公开(公告)日：1994-04-05
申请号：US990899
申请日：1992-12-15
申请人： Andrew J. Moore , David L. S. Ma , Robert L. Bontz , Harry B. Bonham, Jr.
发明人： Andrew J. Moore , David L. S. Ma , Robert L. Bontz , Harry B. Bonham, Jr.
IPC分类号： G02B6/255 , G02B6/36 , G02B6/42
CPC分类号： G02B6/4238 , G02B6/2551 , G02B6/4202 , G02B6/3636
摘要： The invention disclosed includes both a method and apparatus for affixing an optic fiber tip in position with respect to a fiber communications circuit. In one embodiment of the method, a glass positioning member is located proximate the tip of the optic fiber. In another step, the glass positioning member is affixed to the fiber at a first position with respect to the fiber tip. The glass positioning member is also affixed in a second position with respect to the carrier. In a more detailed embodiment, the method of the present invention includes positioning the optic fiber through a channel of the glass positioning member. Heat is applied to the glass positioning member causing it to soften such that its channel collapses around and fuses to the fiber. In still further detail, the fused positioning member/fiber are affixed to a block, and the block is fused to a carrier. Alignment steps are taken during the fusing steps to locate the tip of the fiber in the desired position relative to the fiber communications circuitry.
摘要翻译：所公开的发明包括用于将光纤尖端相对于光纤通信电路固定在适当位置的方法和装置。在该方法的一个实施例中，玻璃定位构件位于光纤末端附近。在另一步骤中，玻璃定位构件相对于纤维头在第一位置固定到纤维上。玻璃定位构件也相对于载体固定在第二位置。在更详细的实施例中，本发明的方法包括通过玻璃定位构件的通道定位光纤。将热量施加到玻璃定位构件上，导致其软化，使得其通道围绕并熔化到纤维。更进一步的细节是，熔接的定位件/纤维固定在一个块上，该块被熔合到一个载体上。在定影步骤期间采取对准步骤，以将光纤的尖端相对于光纤通信电路定位在期望的位置。

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