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1. 发明授权

US11894285B2 Back plate assembly and electronic device 有权
公开(公告)号：US11894285B2
公开(公告)日：2024-02-06
申请号：US17090969
申请日：2020-11-06
申请人： Tyco Electronics (Shanghai) Co. Ltd.
发明人： Jiefeng Zhang , Zhiqiang Li , Biaobing Lv , Guoxiao Shen , Wei Zhao , Jinqiang Wang
IPC分类号： H01L23/40 , H01L23/367 , H05K7/10
CPC分类号： H01L23/4006 , H01L23/367 , H05K7/1061 , H01L2023/4037 , H01L2023/4087
摘要： A back plate assembly includes a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction, and an arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction. A pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove.

2. 发明申请

US20180301839A1 ELECTRICAL CONNECTOR 审中-公开
公开(公告)号：US20180301839A1
公开(公告)日：2018-10-18
申请号：US15916441
申请日：2018-03-09
申请人： LOTES CO., LTD
发明人： Chin Chi Lin , Zuo Feng Jin
IPC分类号： H01R13/24 , H01R12/52 , H01R13/405 , H01R13/03 , H05K7/10
CPC分类号： H01R13/2414 , H01R12/52 , H01R12/714 , H01R12/732 , H01R13/03 , H01R13/405 , H01R43/0256 , H01R2107/00 , H05K7/1061
摘要： An electrical connector includes a reinforcing plate, which is encapsulated by an insulating body by injection molding. Positioning structures are provided in terminal slots of the insulating body. The insulating body is made of an elastic insulating material. Multiple terminals are mounted on the positioning structures. Each metal terminal is provided with an upper contact portion and a lower contact portion. When the upper contact portions is in contact with a chip module, and the lower contact portions is in contact with a circuit board, each of the metal terminals interferes with an inner wall of the corresponding terminal slot, so as to solve the metal fatigue of the metal terminals and to ensure the strength of the metal terminals.

3. 发明授权

US09947634B1 Robust mezzanine BGA connector 有权
公开(公告)号：US09947634B1
公开(公告)日：2018-04-17
申请号：US15621726
申请日：2017-06-13
申请人： NORTHROP GRUMMAN SYSTEMS CORPORATION
发明人： Ge Wang
IPC分类号： H01R13/24 , H01L23/00
CPC分类号： H01L24/14 , H01R12/52 , H01R12/712 , H01R13/24 , H05K7/1061
摘要： A ball grid array (BGA) connector including an outer housing, an insert mounted within the outer housing having a first side and a second side, and a plurality of electrical contacts provided within the insert. The BGA connector also includes a plurality of connector balls electrically coupled to the electrical contacts at the first side of the insert, where some of the connector balls have a low Young's modulus and some of the connector balls have a high Young's modulus such that the high Young's modulus connector balls carry more of a separation load than the low Young's modulus connector balls. In one embodiment, the high Young's modulus connector balls are located around an outer periphery of the BGA. Also, the high modulus connector balls are soldered to larger solder pads than the low modulus connector balls.

4. 发明申请

US20180068867A1 METHOD AND STRUCTURE FOR A 3D WIRE BLOCK 审中-公开
公开(公告)号：US20180068867A1
公开(公告)日：2018-03-08
申请号：US15688238
申请日：2017-08-28
申请人： R&D CIRCUITS, INC.
发明人： Donald Thompson , Cosimo Cantatore
IPC分类号： H01L21/48 , H01R12/70 , H01R12/52 , H01R13/11 , H01R13/24
CPC分类号： H01L21/486 , B33Y80/00 , G01R1/0483 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L2224/16227 , H01L2224/1623 , H01L2224/16235 , H01L2924/15311 , H01L2924/15313 , H01R12/52 , H01R12/7082 , H01R13/112 , H01R13/2414 , H05K1/092 , H05K3/4069 , H05K7/1061 , H05K2203/107 , H05K2203/1131
摘要： The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.

5. 发明申请

US20170325349A1 ON BOARD TRANSCEIVER ASSEMBLY HAVING HOLD DOWN MEMBER 审中-公开
公开(公告)号：US20170325349A1
公开(公告)日：2017-11-09
申请号：US15526469
申请日：2015-11-12
申请人： FCI USA LLC
发明人： John P. Thompson
IPC分类号： H05K7/10 , H05K1/18 , H05K1/11 , H05K1/14 , H05K7/12 , H05K3/42
CPC分类号： H05K7/1061 , H05K1/114 , H05K1/14 , H05K1/181 , H05K3/429 , H05K7/12
摘要： A hold down member can be surface mounted to a substrate, such that a post of the hold down member extends at least into an interposer. Accordingly, when an on board transceiver is placed in electrical communication with the interposer, a fastener can be inserted at least into the on board transceiver so as to attach to the post, thereby securing the on board transceiver to the interposer and the substrate.

6. 发明申请

US20170273207A1 ELECTRICAL CONNECTOR 有权
公开(公告)号：US20170273207A1
公开(公告)日：2017-09-21
申请号：US15617439
申请日：2017-06-08
申请人： LOTES CO., LTD.
发明人： Hao Zhang , Yin Liang He
IPC分类号： H05K7/00 , G06F1/00 , H05K7/10
CPC分类号： H05K7/00 , G06F1/00 , H05K7/1007 , H05K7/1061
摘要： An electrical connector and the buckle assembly thereof. The buckle assembly includes a stiffener for receiving a socket, a load plate for pressing the chip module, and a guide frame pivoted to the stiffener. A rear end of the load plate is pivoted to the stiffener. The guide frame has an opening for receiving the chip module, and two side arms located on two opposite sides of the opening and a rear arm connected to the two side arms. Each of the side arms is provided with a sliding rail for carrying a side plate of a clamping member. The side plate is slidable along the sliding rail. The clamping member is used for fixing the chip module. A protruding portion is formed by protruding upward from the sliding rail, making the protruding portion higher than the sliding rail.

7. 发明授权

US09717156B2 Electrical socket connector with guide frame IC chip placement 有权
公开(公告)号：US09717156B2
公开(公告)日：2017-07-25
申请号：US15157815
申请日：2016-05-18
申请人： LOTES CO., LTD
发明人： Hao Zhang , Yin Liang He
IPC分类号： H01R13/62 , H05K7/00 , G06F1/00
CPC分类号： H05K7/00 , G06F1/00 , H05K7/1007 , H05K7/1061
摘要： An electrical connector for electrically connecting a chip module, including an insulating body, multiple terminals fixed to the insulating body, a stiffener surrounding the periphery of the insulating body, a carrier for carrying the chip module onto the insulating body, and a load plate for pressing the chip module. The terminals are used for electrically connecting the chip module. The stiffener has a first pivoting portion and a second pivoting portion. The first pivoting portion is located in front of the second pivoting portion, and the first pivoting portion and the second pivoting portion are located on the same side of the insulating body. A rear end of the carrier is pivoted to the first pivoting portion, and a rear end of the load plate is pivoted to the second pivoting portion.

8. 发明申请

US20170125922A1 PACKAGED DEVICE ADAPTER WITH FORCE APPLIED USING BEARING APPARATUS 有权
公开(公告)号：US20170125922A1
公开(公告)日：2017-05-04
申请号：US14930726
申请日：2015-11-03
申请人： IRONWOOD ELECTRONICS, INC.
发明人： ILAVARASAN M. PALANIAPPA , MICKIEL P. FEDDE , VINAYAK REDDY PANAVALA , JACOB RAY VAVRA
IPC分类号： H01R4/38 , H01R12/70 , H01R27/02
CPC分类号： H01R4/5066 , H01R4/38 , H01R12/727 , H01R12/89 , H01R23/6893 , H05K7/1007 , H05K7/1061
摘要： An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a torque applicator configured to apply an axial force. A bearing structure positioned between the torque applicator and a packaged device may be used to transfer a force (e.g., an axial force) applied using the torque applicator to the packaged device.

9. 发明申请

US20160372861A1 ELECTRICAL CONNECTION ASSEMBLY 审中-公开
标题翻译：电气连接总成
公开(公告)号：US20160372861A1
公开(公告)日：2016-12-22
申请号：US14841103
申请日：2015-08-31
申请人： LOTES CO., LTD.
发明人： Ted Ju
IPC分类号： H01R13/629 , H01R13/62 , H01R12/70
CPC分类号： H01R12/7076 , H05K7/1061
摘要： An electrical connection assembly for electrically connecting a chip module having a mask and a circuit board, includes a socket, a load plate, and a clamping apparatus. The socket is located between and electrically conducting the chip module and the circuit board. The load plate is located at an outer side of the socket, and having a pressing member and an installing member fixed to the circuit board. The pressing member has an open and a close position relative to the installing member. The installing member has a first identifier. The clamping apparatus has a second identifier corresponding to the mark. At the open position, the clamping apparatus clamps the chip module, and aligns with the first identifier by the second identifier, thereby placing the chip module on the socket. At the close position, the pressing member fixes the clamping apparatus with the chip module to the circuit board.
摘要翻译：一种用于电连接具有掩模和电路板的芯片模块的电连接组件，包括插座，负载板和夹紧装置。插座位于芯片模块和电路板之间并导电。负载板位于插座的外侧，并且具有固定到电路板的按压部件和安装部件。按压构件相对于安装构件具有打开和关闭位置。安装构件具有第一标识符。夹紧装置具有对应于该标记的第二标识符。在打开位置，夹紧装置夹住芯片模块，并与第一标识符对准第二标识符，从而将芯片模块放置在插座上。在关闭位置，按压构件将具有芯片模块的夹紧装置固定到电路板。

10. 发明授权

US09521757B2 Systems and methods for loading of a component 有权
标题翻译：用于加载组件的系统和方法
公开(公告)号：US09521757B2
公开(公告)日：2016-12-13
申请号：US14595987
申请日：2015-01-13
申请人： Dell Products L.P.
发明人： Lawrence A. Kyle , Robert Johnson
IPC分类号： H05K1/02 , H05K3/30 , H05K7/12
CPC分类号： H05K3/301 , H01L23/4006 , H01L23/4093 , H01L2023/405 , H01L2023/4062 , H01L2023/4068 , H01L2023/4087 , H05K1/0201 , H05K1/0204 , H05K7/1061 , H05K7/12
摘要： In a component loading system, a circuit board may include a socket, a first plurality of holes, and a second plurality of holes. A frame may include two opposing sidewalls each substantially perpendicular to a surface of the circuit board and coupled to one another via a plate, a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls, and a third plurality of holes. A backing plate may include a plurality of heat dissipater mounting posts and a fourth plurality of holes. A plurality of second fasteners may each be mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board.
摘要翻译：在部件加载系统中，电路板可以包括插座，第一多个孔和第二多个孔。框架可以包括两个相对的侧壁，每个侧壁基本上垂直于电路板的表面并且经由板，多个螺纹通道彼此耦合，每个通道与两个相对的侧壁之一相邻并且位于两个相对的侧壁之间，和第三多个孔。背板可以包括多个散热器安装柱和第四多个孔。多个第二紧固件可以各自机械地接合到多个螺纹通道中的相应一个，并穿过第二多个孔中的相应一个，以将框架和背板机械地固定在电路板的相对侧上。

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