基本信息:
- 专利标题: 印刷电路板及其制造方法
- 专利标题(英):Printed circuit board and method of manufacturing the same
- 申请号:CN201210555601.X 申请日:2012-12-19
- 公开(公告)号:CN103167728A 公开(公告)日:2013-06-19
- 发明人: 玄振杰 , 金镇求 , 权宁度 , 田亨镇
- 申请人: 三星电机株式会社
- 申请人地址: 韩国京畿道
- 专利权人: 三星电机株式会社
- 当前专利权人: 三星电机株式会社
- 当前专利权人地址: 韩国京畿道
- 代理机构: 北京润平知识产权代理有限公司
- 代理人: 王凤桐; 周建秋
- 优先权: 10-2011-0137179 2011.12.19 KR; 10-2012-0146564 2012.12.14 KR
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K3/28 ; H05K3/46
Disclosed herein is a printed circuit board, including: a base substrate; at least one circuit pattern formed on the base substrate; at least one dummy pattern formed on the base substrate; and an insulating layer formed on the circuit pattern and the dummy pattern, wherein a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns meets the following Equation 1. D <= T 2 T 1 200 1.2 [ Equation 1 ] (Where D represents a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns, T1 represents a thickness of the circuit pattern or the dummy pattern, and T2 represents a maximum thickness of the insulating layer formed on the circuit pattern or the dummy pattern.)
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K1/00 | 印刷电路 |
--------H05K1/02 | .零部件 |