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    • 93. 发明授权
    • System and method for cutting and applying metal configurations to another metal surface
    • 用于将金属构造切割并施加到另一金属表面的系统和方法
    • US07763826B2
    • 2010-07-27
    • US10499753
    • 2002-12-18
    • Meir Chen
    • Meir Chen
    • B23K26/00
    • B23K26/1435B23K26/037B23K26/142B23K26/1476B23K26/22B23K26/244B23K26/38B23K26/702B23K37/0408
    • A method and system for rigidly connecting a first metallic plate to a second metallic plate are provided. The first plate over the second plate, and a force is applied to at least one first location of the first plate using a clamping arrangement so as to tightly couple the first plate to the second plate in a proximity of the first location. Then, the beam source is caused to generate a beam to irradiate the first plate at the first location to produce a molten material. In this manner, at least one irradiated section of the first plate is melted throughout its thickness and rigidly connected to the second plate using the molten material. During the irradiation, the first plate and the clamping arrangement are translated with respect to one another to reach at least one second location. It is also possible to provide a bonding layer or a soldering layer between the first and second layers, which can be used to rigidly connect the first and second layers to one another. Further, it is possible to simultaneously cut a section of the first layer, and weld it to the second layer.
    • 提供了一种用于将第一金属板刚性地连接到第二金属板的方法和系统。 在第二板上的第一板,并且使用夹紧装置将力施加到第一板的至少一个第一位置,以便在第一位置附近将第一板紧紧地连接到第二板。 然后,使光束源产生光束以在第一位置照射第一板以产生熔融材料。 以这种方式,第一板的至少一个照射部分在其整个厚度上熔化并且使用熔融材料刚性地连接到第二板。 在照射期间,第一板和夹持装置相对于彼此平移以到达至少一个第二位置。 还可以在第一和第二层之间提供粘合层或焊接层,其可用于将第一和第二层彼此刚性连接。 此外,可以同时切割第一层的一部分,并将其焊接到第二层。
    • 97. 发明申请
    • System and method for cutting and applying metal configurations to another metal surface
    • 用于将金属构造切割并施加到另一金属表面的系统和方法
    • US20040262271A1
    • 2004-12-30
    • US10499753
    • 2004-06-18
    • Meir Chen
    • B23K026/20
    • B23K26/1435B23K26/037B23K26/142B23K26/1476B23K26/22B23K26/244B23K26/38B23K26/702B23K37/0408
    • A method and system for rigidly connecting a first metallic plate to a second metallic plate are provided. The first plate over the second plate, and a force is applied to at least one first location of the first plate using a clamping arrangement so as to tightly couple the first plate to the second plate in a proximity of the first location. Then, the beam source is caused to generate a beam to irradiate the first plate at the first location to produce a molten material. In this manner, at least one irradiated section of the first plate is melted throughout its thickness and rigidly connected to the second plate using the molten material. During the irradiation, the first plate and the clamping arrangement are translated with respect to one another to reach at least one second location. It is also possible to provide a bonding layer or a soldering layer between the first and second layers, which can be used to rigidly connect the first and second layers to one another. Further, it is possible to simultaneously cut a section of the first layer, and weld it to the second layer.
    • 提供了一种用于将第一金属板刚性地连接到第二金属板的方法和系统。 在第二板上的第一板,并且使用夹紧装置将力施加到第一板的至少一个第一位置,以便在第一位置附近将第一板紧紧地连接到第二板。 然后,使光束源产生光束以在第一位置照射第一板以产生熔融材料。 以这种方式,第一板的至少一个照射部分在其整个厚度上熔化并且使用熔融材料刚性地连接到第二板。 在照射期间,第一板和夹持装置相对于彼此平移以到达至少一个第二位置。 还可以在第一和第二层之间提供粘合层或焊接层,其可用于将第一和第二层彼此刚性地连接。 此外,可以同时切割第一层的一部分,并将其焊接到第二层。