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    • 91. 发明公开
    • Method for processing terminal in bonded substrate
    • 韦尔法罕zur Bearbeitung eines Anschlusses一个einem Verbundsubstrat
    • EP2147899A1
    • 2010-01-27
    • EP09164934.3
    • 2009-07-08
    • Mitsuboshi Diamond Industrial Co., Ltd.
    • Sunata, TomihisaShimizu, SeijiOtoda, Kenji
    • C03B33/02C03B33/07C03B33/09C03B33/03B28D5/00
    • B28D5/0011B23K26/364B23K26/40B23K2203/172B23K2203/50B65G2249/04C03B33/033C03B33/076C03B33/091H01L2924/0002H01L2924/00
    • Object To provide a method for processing a terminal through a laser breaking process according to which processing is carried out along a line, not a curve, even when the exposed width is small, so that the terminal can be processed without fail.
      Means for Achieving Object In a method for processing a terminal in a bonded substrate according to which a first divided surface B2, B3 is created in a first substrate 31 and a second substrate 34, so that the cut surfaces are in the same plane, and after that, the portion of the first substrate which covers a terminal 33 is removed from the first divided surface of the first substrate as an end piece 35 with a width of 10 mm or less, so that a second divided surface B1 is created and the terminal is exposed, a first scribe line S1, a second scribe line S2 and a third scribe line S3 are created through a laser scribing process, and then, a breaking process is carried out along the second scribe line S2 and the third scribe line S3, so that the first divided surface B2, B3 is created, and then, a laser breaking process is carried out along the first scribe line S1 and the end piece 35 is removed.
    • 对象为了提供一种通过激光断裂处理终端的方法,根据该方法,即使暴露的宽度较小,也可以沿着线而不是曲线进行处理,使得终端可以被无损处理。 实现目的的手段在用于处理键合衬底中的端子的方法中,根据该方法,在第一衬底31和第二衬底34中形成第一分割表面B2,B3,使得切割表面在同一平面中,以及 之后,将覆盖端子33的第一基板的部分作为宽度为10mm以下的端片35从第一基板的第一分割面移除,从而形成第二分割面B1, 端子被曝光,通过激光划线处理创建第一划线S1,第二划线S2和第三划线S3,然后沿着第二划线S2和第三划线S3进行断开处理 ,从而形成第一分割面B2,B3,然后沿着第一划线S1进行激光断裂处理,并且除去端片35。
    • 97. 发明申请
    • LASER PROCESSING METHOD
    • 激光加工方法
    • US20160039044A1
    • 2016-02-11
    • US14779652
    • 2014-03-18
    • HAMAMATSU PHOTONICS K.K.
    • Daisuke KAWAGUCHI
    • B23K26/00B23K26/57B23K26/364
    • B23K26/0063B23K26/00B23K26/0006B23K26/364B23K26/38B23K26/40B23K26/53B23K26/57B23K2103/56C03B33/0222C03B33/076
    • It comprises a first step of preparing an object; a second step of forming a modified region in a first member along a line by irradiating the first member with laser light while using a front face of the object as a laser light entrance surface; a third step of forming a processing scar in a bonding layer along the line by irradiating the bonding layer with laser light while using the front face as a laser light entrance surface; and a fourth step, after the first to third steps, of forming a modified region in a second member along the line by irradiating the second member with laser light while using a rear face of the object as a laser light entrance surface; the fourth step uses the processing scar as a reference for alignment of a laser light irradiation position with respect to the second member.
    • 它包括准备物体的第一步骤; 第二步骤,当使用所述物体的前表面作为激光入射表面时,通过用激光照射所述第一构件,沿着线形成修改区域; 第三步骤,当使用所述前面作为激光入射面时,通过用激光照射所述接合层,沿着所述接合层形成加工痕迹; 以及第四步骤,在第一至第三步骤之后,在使用物体的后表面作为激光入射表面的同时,用激光照射第二部件,沿着第二部件形成改质区域; 第四步骤使用加工疤痕作为激光照射位置相对于第二构件的对准的参考。
    • 99. 发明授权
    • Method for cutting liquid crystal panel and method for manufacturing liquid crystal panel using the same
    • 液晶面板的切割方法及使用其制造液晶面板的方法
    • US08905807B2
    • 2014-12-09
    • US13377674
    • 2010-06-09
    • Yong beom KimDong hyun Kim
    • Yong beom KimDong hyun Kim
    • H01J1/46G02F1/1333C03B33/07
    • C03B33/076G02F1/133351
    • The present invention relates to a method for cutting a liquid crystal display panel and a method for manufacturing a liquid crystal display panel having a desired size using the same. In a method for cutting a liquid crystal display panel which includes an upper panel to which a color filter is formed and a lower filter on which a thin film transistor is formed, the upper panel and the lower panel are respectively cut in such a way that a cut edge of the upper panel is outwardly protruded from a cut edge of the lower panel so that a step is formed at a cut surface between the upper panel and the lower panel. Since the cut edge of the upper panel is upwardly protruded from the cut edge of the lower panel, electrodes, signal lines, thin film transistors of the lower panel can be prevented from being damaged by the contact with the dispenser or by the pressure of the sprayed sealant while the sealant is formed after the cutting.
    • 本发明涉及一种液晶显示面板的切割方法及使用该液晶显示面板的期望尺寸的液晶显示面板的制造方法。 在一种用于切割液晶显示面板的方法中,该液晶显示面板包括形成滤色器的上面板和形成有薄膜晶体管的下部滤光器,上面板和下面板分别被切割成 上板的切割边缘从下板的切割边缘向外突出,使得在上板和下板之间的切割表面处形成台阶。 由于上板的切割边缘从下板的切割边缘向上突出,因此可以防止下面板​​的电极,信号线,薄膜晶体管因与分配器的接触而受到损坏, 在切割后形成密封剂时喷涂密封剂。