会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 97. 发明专利
    • Fine particle polishing method and device
    • 细粒抛光方法和装置
    • JP2004082316A
    • 2004-03-18
    • JP2002305761
    • 2002-10-21
    • Ind Technol Res Inst財団法人工業技術研究院
    • CHOU TA-HSINLEE WEN-YEUCHEN LEI-YI
    • B24B31/112B01J19/08B02C17/00B02C17/16B02C17/18B02C17/24B24B37/00B82B3/00B82Y40/00
    • B02C17/16B02C17/005B02C17/161B02C17/183Y10S977/888Y10S977/90
    • PROBLEM TO BE SOLVED: To provide a fine particle polishing method and device capable of allowing a polishing medium and fine particles to separate from each other by themselves without using a conventional sieve mechanism, being applied to very fine particles without restricted by a mechanical size of a screen and the like, and further dispensing with the replacement of a stirring blade caused by abrasion, as is found in a conventional device. SOLUTION: This invention applies different force fields for the polishing medium and the fine particles to allow them to collide with each other only in a polishing area, while moving the polishing medium and the fine particles in different routes. Whereby the polishing medium and the fine particles are separated from each other by themselves without using the conventional sieve mechanism such as the screen or a gap, and further a mechanical size of a component is not restricted. This invention can be applied to very fine particles. The circulation of the fine particles is not restricted even by any small gap of the sieve mechanism, accordingly the clogging of a separating machine by the fine particles can be prevented. COPYRIGHT: (C)2004,JPO
    • 解决问题:为了提供能够使抛光介质和细颗粒自身彼此分离而不使用常规筛分机构的微粒抛光方法和装置,被施加到非常细小的颗粒而不受 屏幕的机械尺寸等,并且进一步分配由磨损引起的搅拌叶片的更换,如在常规装置中所发现的那样。 解决方案:本发明对抛光介质和细颗粒施加不同的力场,使得它们仅在抛光区域中相互碰撞,同时以不同的路线移动抛光介质和细颗粒。 由此抛光介质和细颗粒彼此分离,而不使用诸如筛网或间隙的常规筛机,并且组分的机械尺寸进一步限制。 本发明可以应用于非常细小的颗粒。 即使筛子机构的任何小的间隙也不限制细颗粒的循环,因此可以防止由微粒引起的分离机的堵塞。 版权所有(C)2004,JPO