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    • 18. 发明申请
    • ASSEMBLED ELECTROMAGNETIC SHIELDING CASE
    • 组装电磁屏蔽壳
    • US20130235528A1
    • 2013-09-12
    • US13465049
    • 2012-05-07
    • WEN-HSIEN LEESHIH-PO LOCHING-FENG HSIEH
    • WEN-HSIEN LEESHIH-PO LOCHING-FENG HSIEH
    • H05K7/20
    • H05K7/20418H05K9/0032
    • An assembled electromagnetic shielding case conducive to electromagnetic interference shielding and heat dissipation of an electronic component on a printed circuit board includes a body, a shielding element, and a fixing element. The body has an opening and an engagement portion. The engagement portion connects the body and the printed circuit board. The shielding element has a bottom side and a heat-dissipating side opposing thereto. The shielding element closes the opening for effectuating electromagnetic interference shielding. The shielding element dissipates heat generated from the electronic component by transferring the heat from the bottom side to the heat-dissipating side for dissipating the heat. The fixing element couples the body and the shielding element. Accordingly, with the assembled electromagnetic shielding case, not only is the electronic component insusceptible to electromagnetic interference and easy to change, but it is feasible to provide highly efficient heat dissipation and a miniaturized heat dissipation structure.
    • 一种有助于印刷电路板上的电子部件的电磁干扰屏蔽和散热的组装的电磁屏蔽壳体包括主体,屏蔽元件和固定元件。 主体具有开口和接合部分。 接合部分连接主体和印刷电路板。 屏蔽元件具有与其相对的底侧和散热侧。 屏蔽元件封闭用于实现电磁干扰屏蔽的开口。 屏蔽元件通过将热量从底侧传递到散热侧来散发由电子元件产生的热量,以耗散热量。 固定元件连接主体和屏蔽元件。 因此,通过组装的电磁屏蔽壳体,电子部件不仅不易受到电磁干扰,易于变化,而且可以提供高效的散热和小型化的散热结构。