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    • 21. 发明申请
    • EAS TAG WITH SHACKLE
    • WO2012145695A1
    • 2012-10-26
    • PCT/US2012/034547
    • 2012-04-20
    • YANG, Xiao, Hui
    • YANG, Xiao, Hui
    • G08B13/14
    • E05B73/0017E05B67/14E05B73/0052G08B13/2434
    • An EAS tag has a housing and a shackle. The shackle has a first segment with a first end and a second segment with a second end. The first segment of the shackle is slidably mounted in the housing while the second segment moves in and out of the housing in accord with the first segment. When the second segment is out of the housing, the shackle can be placed through an aperture in an object to be protected or around a portion of an object to be protected. The shackle is then slid into the housing so that the second segment inserts into the housing. A clutch within the housing prevents the shackle from being shifted until the clutch is released. The housing carries at least a passive EAS element. More advanced EAS electronic elements may also be carried in the housing.
    • EAS标签有一个外壳和一个钩环。 钩环具有带有第一端的第一段和具有第二端的第二段。 钩环的第一段可滑动地安装在壳体中,而第二段根据第一段移入和移出壳体。 当第二段离开壳体时,钩环可以通过待保护对象中的孔或围绕被保护对象的一部分放置。 然后将钩环滑入壳体中,使得第二段插入壳体。 外壳内的离合器防止卸扣移位,直到离合器释放。 外壳至少携带一个被动EAS元件。 更高级的EAS电子元件也可以在外壳中承载。
    • 22. 发明申请
    • HEAT EXCHANGE APPARATUS
    • 热交换装置
    • WO2011154366A1
    • 2011-12-15
    • PCT/EP2011/059314
    • 2011-06-06
    • THERMAL CORP.YANG, Xiao
    • YANG, Xiao
    • F28D15/04C22C23/06H01L23/427
    • F28D15/04C22C23/00C22C23/04F28D15/046H01L23/427H01L2924/0002H01L2924/00
    • A heat exchange apparatus comprising a heat pipe (2) having a body (4) containing a working fluid is disclosed. The working fluid is adapted to evaporate as a result of heating of a first part of the body and to condense as a result of cooling of a second part of the body. The container comprises a grooved wick structure (6), adapted to transport the working fluid in liquid state from the second part towards the first part; and a vapour channel (8) adapted to allow the working fluid to move in vapour state from the first location towards the second location. The wick structure is formed from at least one material containing at least one alloy including magnesium, 1% to 2.5% by weight manganese, and up to 2.5% by weight zinc.
    • 公开了一种包括具有包含工作流体的主体(4)的热管(2)的热交换装置。 工作流体适于由于身体的第一部分的加热而蒸发并且由于身体的第二部分的冷却而冷凝。 所述容器包括槽形芯结构(6),适于将处于液态的工作流体从第二部分输送到第一部分; 以及适于允许工作流体从蒸汽状态从第一位置移动到第二位置的蒸气通道(8)。 芯结构由至少一种含有至少一种合金的材料形成,包括镁,1%至2.5%重量的锰和至多2.5%重量的锌。
    • 25. 发明申请
    • ELECTRONIC ARTICLE SURVEILLANCE CARRIER AND TAG
    • 电子文章监督和标签
    • WO2010147914A1
    • 2010-12-23
    • PCT/US2010/038563
    • 2010-06-14
    • YANG, Xiao, Hui
    • YANG, Xiao, Hui
    • G08B13/14
    • G08B13/2434
    • An electronic article surveillance (EAS) apparatus is comprised of a carrier and an EAS unit. The carrier receives the EAS unit and has an adhesive element on one of its surfaces to attach to an item to be protected. The EAS unit may have several electronic components including, among others, an EAS coil, a microprocessor, communication elements, a switch, a battery, and an audible alarm generator. The EAS unit can be removed from a protected item by opening, or parting, the carrier. Once the carrier is opened the EAS unit can be retrieved for reuse. External devices can be used to communicate with and disarm the EAS unit. If an EAS unit is removed without being disarmed, a switch detects the change in status and an audible alarm is generated.
    • 电子物品监视(EAS)装置由承运人和EAS单元组成。 载体接收EAS单元,并且在其表面之一上具有粘合元件以附着到待保护的物品上。 EAS单元可以具有多个电子部件,包括EAS线圈,微处理器,通信元件,开关,电池和可听报警发生器。 EAS单元可以通过打开或分离运输工具从受保护的物品中移除。 一旦承运人被打开,可以检索EAS单元以便重新使用。 外部设备可用于与EAS单元进行通信和撤防。 如果EAS单元被卸下而不被撤防,则开关检测状态的变化并产生声音报警。
    • 28. 发明申请
    • METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USING A SCRIBE AND BREAK PROCESS
    • 使用筛选和断开过程的光学设备的波长定型包装的方法和装置
    • WO2006063044A3
    • 2006-11-09
    • PCT/US2005044249
    • 2005-12-05
    • MIRADIA INCYANG XIAO CHARLESCHEN DONGMINCHEN PHILIP
    • YANG XIAO CHARLESCHEN DONGMINCHEN PHILIP
    • H01L21/30H01L21/46
    • B81C1/00873B81B2201/047H01L24/05H01L33/483H01L2224/04042H01L2224/48463H01L2924/0002H01L2924/14H01L2924/1461H01L2924/00
    • A multilayered integrated optical and circuit device. The device has a first substrate (101) comprising at least one integrated circuit chip thereon, which has a cell region (107) and a peripheral region (106). Preferably, the peripheral region has a bonding pad region (109), which has one or more bonding pads (115) and an antistiction region (112) surrounding each of the one or more bonding pads (115). The device has a second substrate (114) with at least one or more deflection devices (103) thereon coupled to the first substrate (101). At least one or more bonding pads (115) are exposed on the first substrate (101). The device has a transparent member (201) overlying the second substrate (114) while forming a cavity region to allow the one or more deflection devices (103) to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate (101), a portion of the second substrate (114), and a portion of the transparent member (201). The one or more bonding pads (115) and the antistiction region (112) are exposed while the one or more deflection devices (103) is maintained within the portion of the cavity region.
    • 一种多层集成光电路装置。 该器件具有包括至少一个集成电路芯片的第一衬底(101),其具有单元区域(107)和外围区域(106)。 优选地,周边区域具有焊盘区域(109),其具有围绕一个或多个焊盘(115)中的每一个的一个或多个焊盘(115)和抗静电区域(112)。 该装置具有第二衬底(114),其上至少一个或多个偏转装置(103)联接到第一衬底(101)上。 至少一个或多个接合焊盘(115)暴露在第一基板(101)上。 该装置具有覆盖第二基板(114)的透明构件(201),同时形成空腔区域以允许一个或多个偏转装置(103)在空腔区域的一部分内移动以形成夹层结构,其包括至少一个 第一基板(101)的一部分,第二基板(114)的一部分和透明部件(201)的一部分。 当一个或多个偏转装置(103)保持在空腔区域的部分内时,一个或多个接合焊盘(115)和抗静电区域(112)被暴露。
    • 29. 发明申请
    • METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USING A SCRIBE AND BREAK PROCESS
    • 使用筛选和断开过程对光学设备进行水平包装的方法和装置
    • WO2006063044A2
    • 2006-06-15
    • PCT/US2005/044249
    • 2005-12-05
    • MIRADIA INC.YANG, Xiao, "charles"CHEN, DongminCHEN, Philip
    • YANG, Xiao, "charles"CHEN, DongminCHEN, Philip
    • H01L21/30H01L21/78
    • B81C1/00873B81B2201/047H01L24/05H01L33/483H01L2224/04042H01L2224/48463H01L2924/0002H01L2924/14H01L2924/1461H01L2924/00
    • A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.
    • 一种多层集成光电路装置。 该器件具有包括其上的至少一个集成电路芯片的第一衬底,其具有单元区域和外围区域。 优选地,周边区域具有焊盘区域,其具有一个或多个接合焊盘和围绕所述一个或多个焊盘中的每一个的抗静电区域。 该装置具有第二基板,其上具有至少一个或多个偏转装置,其上连接到第一基板。 至少一个或多个接合焊盘暴露在第一衬底上。 该装置具有覆盖第二基板的透明构件,同时形成空腔区域,以允许一个或多个偏转装置在空腔区域的一部分内移动以形成夹层结构,该夹层结构包括第一基板的至少一部分, 第二基板和透明部件的一部分。 一个或多个接合焊盘和抗静电区域被暴露,同时一个或多个偏转装置保持在空腔区域的部分内。