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21. 发明授权

US4220842A Method of removing material from a workpiece 失效
标题翻译：从工件上去除材料的方法
公开(公告)号：US4220842A
公开(公告)日：1980-09-02
申请号：US839812
申请日：1977-10-06
申请人： Ekkehard Sturmer , Bernhard Einstein
发明人： Ekkehard Sturmer , Bernhard Einstein
IPC分类号： B23K26/14 , B23K26/382 , B23K26/40 , B23K9/00
CPC分类号： B23K26/382 , B23K26/1423 , B23K26/40 , B23K2203/08 , B23K2203/12 , B23K2203/50
摘要： A pulsed infrared laser has an optical system for focusing the laser beam impulse, positioning a metallic workpiece to be drilled at the waist of the beam or at a spacing in the propagation direction in front of the waist of the laser beam, surrounding the portion of the workpiece from which metal is being removed with an atmosphere containing helium and/or hydrogen during the removal process, forming an expanding plasma in front of the portion of the workpiece to be drilled which absorbs the laser radiation at the start of the laser beam impulse by focusing the laser beam impulse at a large aperture angle and dimensioning the timewise intensity course of the laser beam impulse, and maintaining the expanding plasma only during a fraction of the laser beam impulse to remove material from the workpiece.
摘要翻译：脉冲红外激光器具有用于聚焦激光束脉冲的光学系统，将要在钻孔腰部处的金属工件定位在激光束的腰部前方的传播方向的间隔处，在除去过程中用含有氦气和/或氢气的气体从其中除去金属的工件，在待钻孔的工件的前面形成膨胀等离子体，该部分在激光束冲击开始时吸收激光辐射通过将激光束脉冲聚焦在大的孔径角度并对激光束脉冲的时间强度行程进行尺寸化，并且仅在激光束脉冲的一部分期间保持膨胀等离子体以从工件移除材料。

22. 发明授权

US4078165A Semi-automatic feed laser apparatus 失效
标题翻译：半自动送料激光装置
公开(公告)号：US4078165A
公开(公告)日：1978-03-07
申请号：US682501
申请日：1976-05-03
申请人： William D. Tuttle
发明人： William D. Tuttle
IPC分类号： B23K26/04 , B23K26/08 , B23K26/14 , B23K26/42 , B23K9/00
CPC分类号： B23K26/1423 , B23K26/04 , B23K26/08 , B23K26/702
摘要： A semi-automatic feed laser apparatus includes a laser beam focused on a workpiece affixed to a pattern template which is urged by the operator against rotatable guide means rotating at a predetermined rate to feed the workpiece smoothly under the laser yet permit manual override of the feeding operation to accommodate irregularities or surface non-uniformities in the workpiece. Advantageously, the guide means include a hollow cylinder-like member and drive means operably connected thereto for rotating the guide cylinder. As preferably embodied, one end of the guide cylinder is adapted to contact the template while its other end is coupled to an exhaust system for removing debris and combustion particles immediately from the work area. Moreover, the axis of the cylinder may be generally aligned with the laser beam to allow harmless defocusing of the laser radiation. According to another aspect of the invention, cooling means surrounds the guide for cooling the wall of the guide to prevent the plating or build-up of molten debris. Alternatively, the cylinder axis may be slightly askew of the laser beam to enable cooling means to be positioned immediately under the workpiece for cooling debris generated during the cutting operation.
摘要翻译：半自动进给激光装置包括聚焦在固定到图案模板上的工件上的激光束，所述激光束被操作者推压以能够以预定速率旋转的可旋转引导装置，以在激光下平稳地馈送工件，但允许手动超控进给操作以适应工件中的不规则或表面不均匀性。有利地，引导装置包括中空圆筒状构件和可操作地连接到其上的驱动装置，用于使引导筒旋转。优选地，实施例中，导向筒的一端适于接触模板，而另一端与排气系统联接，用于从工作区域立即去除碎屑和燃烧颗粒。此外，圆柱体的轴线可以大致与激光束对准，以允许激光辐射的无害散焦。根据本发明的另一方面，冷却装置包围引导件，用于冷却引导件的壁以防止熔融碎片的电镀或堆积。或者，气缸轴线可以稍微倾斜激光束，以使得冷却装置能够被立即放置在工件下面，以便冷却在切割操作期间产生的碎屑。

23. 发明公开

EP1790426A2 Verfahren und Vorrichtung zum Laserstrahlbearbeiten 审中-公开
公开(公告)号：EP1790426A2
公开(公告)日：2007-05-30
申请号：EP05028028.8
申请日：2005-12-21
申请人： Linde Aktiengesellschaft
发明人： Danzer, Wolfgang
IPC分类号： B23K26/14
CPC分类号： B23K26/1423
摘要： Die Erfindung betrifft ein Verfahren zum Laserstrahlbearbeiten, bei dem ein Laserstrahl (1) auf ein Werkstück (3) gelenkt wird, wobei im Wirkungsbereich des Laserstrahls (1) ein Plasma gebildet und wobei im Wirkungsbereich des Laserstrahls zur Beeinflussung des Plasmas ein elektrisches Feld angelegt wird. Erfindungsgemäß wird das elektrische Feld mit einer Spannung von weniger als 500 V aufgebaut.
摘要翻译：使用小于500V的电位在工作区（1）中形成电场，其中已知激光束工艺形成等离子体。该场作用于等离子体。使用较低的电压，小于300V或甚至小于100V。工件（3）是形成场的两极之一。该字段是静态的。一个极是环形（9），围绕着激光束。所用的工艺气体喷嘴（2）装有极杆。工艺气体是氩气，氦气或它们的混合物。工艺气体混合物还含有二氧化碳，氧气和/或氮气。该过程是激光束焊接或激光束切割。独立声明包括对应的设备。

24. 发明公开

EP1015165A1 VERFAHREN UND VORRICHTUNG ZUM MATERIALBEARBEITEN MIT PLASMA INDUZIERENDER HOCHENERGIESTRAHLUNG 有权
标题翻译：方法和设备材质编辑与血浆诱导高能辐射
公开(公告)号：EP1015165A1
公开(公告)日：2000-07-05
申请号：EP98952534.0
申请日：1998-09-03
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DERANGEWANDTEN FORSCHUNG E.V.
发明人： BEERSIEK, Jörg , SCHULZ, Wolfgang
IPC分类号： B23K26/02
CPC分类号： B23K26/032 , B23K26/0643 , B23K26/0665 , B23K26/1423
摘要： The invention relates to a method for treating materials with plasma-inducing high energy radiation, especially laser radiation, wherein the area of the vapor capillaries (13) of the work piece (10) is observed with a depth definition detecting device over the entire thickness of the work piece and time-dependent measurement of plasma radiation intensity is carried out. In order to accurately monitor the quality of material treatment, the method is implemented in such a way that the momentary plasma intensities are measured at no less than two measurement points which are parallel to the axis (11) of the inducing radiation (12), predetermined capillary geometric parameters are assigned to the measured plasma intensities and the control of the material treatment is conducted depending on the capillary geometric parameters.

25. 发明公开

EP0473287A1 Apparatus and method for monitoring laser material processing 失效
标题翻译： Gerätund Verfahren zurÜberwachungder Laserbearbeitung von Materialen。
公开(公告)号：EP0473287A1
公开(公告)日：1992-03-04
申请号：EP91306930.8
申请日：1991-07-29
申请人： CMB FOODCAN PLC
发明人： Steen, William Maxwell , Brookfield, David Justin , Li, Lin , Ning, Qi
IPC分类号： B23K26/02
CPC分类号： B23K26/1423 , B23K26/03
摘要： Apparatus and method for monitoring laser materials processing, such as laser welding and laser drilling, wherein an indication of the quality of the processing is obtained by monitoring the plasma generated spaced charge distribution near the melt pool. A metal electrode (14), or electrodes, is disposed near the melt pool but not in contact with the workpiece (16), nor necessarily in contact with the hot plasma. The electric charge distribution (one dimensional or multi-dimensional) is monitored between the electrode or electrodes and the workpiece or between the electrodes themselves. The existing laser processing nozzle (insulated from the workpiece) can be used for this purpose, multi-probes such as a quadrant nozzle, can identify the focused laser beam position in real time.
摘要翻译：用于监测激光材料加工（例如激光焊接和激光钻孔）的装置和方法，其中通过监测熔池附近的等离子体间隔开的电荷分布来获得处理质量的指示。金属电极（14）或电极设置在熔池附近，但不与工件（16）接触，也不一定与热等离子体接触。在电极或电极与工件之间或电极本身之间监测电荷分布（一维或多维）。现有的激光加工喷嘴（与工件绝缘）可用于此目的，诸如象限喷嘴的多探头可以实时识别聚焦的激光束位置。

26. 发明公开

EP2812149A1 A DEVICE FOR DRILLING A SUBSTRATE USING A PLURALITY OF DC VOLTAGE OUTPUT; METHOD OF DRILLING A SUBSTRATE USING SUCH DEVICE 审中-公开
标题翻译：设备钻井具有多个输出的直流电压和方法的基板用于钻井的衬底，这种装置
公开(公告)号：EP2812149A1
公开(公告)日：2014-12-17
申请号：EP13702833.8
申请日：2013-01-21
申请人： Asahi Glass Company, Limited
发明人： DITTMANN, Leander
IPC分类号： B23K26/38 , B23K26/00 , B23K26/14 , B23K26/16 , B26D7/10 , B26F1/28 , H02J1/10
CPC分类号： H01L21/2633 , B23K26/0081 , B23K26/1423 , B23K26/16 , B23K26/382 , B26D7/10 , B26F1/28 , H01L21/268 , H01L21/67115 , H02J1/10
摘要： The present invention relates to a device for drilling a substrate (5), in particular a device for generating a hole or recess or well in an electrically insulating or semiconducting substrate (5), more specifically a device for generating a plurality of holes or recesses or wells in an electrically insulating or semiconducting substrate (5). The present invention also relates to a method for drilling a substrate (5). Furthermore, the present invention relates to a use of the device for drilling a substrate (5).
摘要翻译：一种装置，用于在电钻一基材，特别是一个设备，用于产生在电的孔或凹部或孔中的绝缘或半导体基板，更具体的装置，用于产生孔或凹部或孔的多个绝缘或半导体基材，

27. 发明授权

EP0762947B1 VORRICHTUNG ZUR MATERIALBEARBEITUNG MIT EINEM LASER 失效
标题翻译：设备用于材料加工的激光
公开(公告)号：EP0762947B1
公开(公告)日：2003-03-26
申请号：EP95917453.3
申请日：1995-05-22
申请人： SYNOVA S.A.
发明人： Richerzhagen, Bernold
IPC分类号： B23K26/12 , B23K26/00
CPC分类号： G02B6/032 , B23K26/06 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/1423 , B23K26/146 , G02B1/06 , Y10T83/0591 , Y10T83/364

28. 发明公开

EP1232038A1 METHOD AND APPARATUS FOR SEPARATING NON-METALLIC MATERIALS 有权
标题翻译：方法和设备，用于分离非金属材料
公开(公告)号：EP1232038A1
公开(公告)日：2002-08-21
申请号：EP00980670.4
申请日：2000-11-22
申请人： Applied Photonics, Inc.
发明人： HOEKSTRA, Brian , FLANNIGAN, Roger , WEGERIF, David
IPC分类号： B23K26/40 , B23K26/14 , C03B33/09
CPC分类号： C03B33/093 , B23K26/0736 , B23K26/1423 , B23K26/1435 , B23K26/146 , B23K26/1462 , B23K26/1476 , B23K26/40 , B23K2203/50 , C03B33/033 , C03B33/091 , C03B33/102 , Y10T225/12 , Y10T225/304 , Y10T225/307
摘要： A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking device receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.

29. 发明公开

KR1020140052981A 기판에 고품질의 홀, 리세스 또는 웰을 생성하는 방법 无效
标题翻译：在基板中产生高质量孔或凹陷或良好的方法
公开(公告)号：KR1020140052981A
公开(公告)日：2014-05-07
申请号：KR1020137027140
申请日：2012-07-12
申请人： 아사히 가라스 가부시키가이샤
发明人： 슈미트크리스티안 , 디트만레안데어 , 셰즈아드리앙 , 호야스벤
IPC分类号： B23K26/38 , B26F1/28
CPC分类号： B23K26/382 , B23K26/0661 , B23K26/1423 , B23K26/1429 , B23K26/18 , B23K26/386 , B23K26/389 , B23K26/40 , B23K26/402 , B23K26/50 , B23K26/702 , B23K2203/42 , B23K2203/50 , B23K2203/52 , B26F1/28 , C03C23/0025 , H03K3/537 , Y10T428/24273
摘要： 본 발명은 전기 절연성 또는 반도전성 기판에 홀 또는 웰을 생성하는 방법과 이 방법에 의해 기판에 생성되는 홀 또는 웰에 관한 것이다. 본 발명은 또한 본 방법에 의해 기판에 생성되는 홀 또는 웰의 어레이에 관한 것이다.
摘要翻译：本发明涉及在电绝缘或半导体衬底中产生孔或阱的方法，以及通过该方法产生的衬底中的孔或阱的方法。本发明还涉及通过该方法产生的衬底中的孔阵列或孔。

30. 发明申请

US20170239753A1 System and Method for Depositing a Metal to Form a Three-Dimensional Part 审中-公开
公开(公告)号：US20170239753A1
公开(公告)日：2017-08-24
申请号：US15052034
申请日：2016-02-24
申请人： Mitsubishi Electric Research Laboratories, Inc.
发明人： William S. Yerazunis , John C. Barnwell, III , William T. Vetterling
IPC分类号： B23K26/346 , B23K26/08 , B23K26/342
CPC分类号： B23K26/346 , B23K26/083 , B23K26/1423 , B23K26/342 , B33Y10/00 , B33Y30/00
摘要： A system and method depositing metal to form a three-dimensional (3D) part on a substrate. A wire is moved relative to a location on the substrate while a laser heats a proximal end of the wire at the location using a laser beam. The laser causes the wire and substrate to reach a melting point of the wire to fuse the wire at the location on the substrate. The wire can be preheated by passing a current through the wire.

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