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31. 发明申请

US20120201316A1 Control Mode PHY for WLAN 有权
标题翻译： WLAN的控制模式PHY
公开(公告)号：US20120201316A1
公开(公告)日：2012-08-09
申请号：US13366064
申请日：2012-02-03
申请人： Hongyuan Zhang , Rohit U. Nabar , Raja Banerjea , Yong Liu , Sudhir Srinivasa , Hyukjoon Kwon
发明人： Hongyuan Zhang , Rohit U. Nabar , Raja Banerjea , Yong Liu , Sudhir Srinivasa , Hyukjoon Kwon
IPC分类号： H04L27/28
CPC分类号： H04L27/2602 , H03M13/23 , H04L1/0046 , H04L1/0065 , H04L1/0072 , H04L1/08 , H04L27/2613 , H04L27/265
摘要： In a method for generating a physical layer (PHY) data unit for transmission via a communication channel, information bits to be included in the PHY data unit are encoded using a forward error correction (FEC) encoder. The information bits are mapped to a constellation symbols. Additionally, either the information bits are encoded according to a block coding scheme, or the constellation symbols are encoded according to the block coding scheme. Orthogonal frequency division multiplexing (OFDM) symbols are generated to include the constellation symbols and the PHY data unit is generated to include the OFDM symbols.
摘要翻译：在通过通信信道生成用于发送的物理层（PHY）数据单元的方法中，使用前向纠错（FEC）编码器对要包括在PHY数据单元中的信息比特进行编码。信息位被映射到星座符号。另外，根据块编码方案对信息比特进行编码，或者根据块编码方案对星座符号进行编码。生成正交频分复用（OFDM）符号以包括星座符号，并且生成PHY数据单元以包括OFDM符号。

32. 发明授权

US08168473B2 Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same 有权
标题翻译：成型超薄半导体管芯封装，使用其的系统及其制造方法
公开(公告)号：US08168473B2
公开(公告)日：2012-05-01
申请号：US12940319
申请日：2010-11-05
申请人： Yong Liu
发明人： Yong Liu
IPC分类号： H01L21/00
CPC分类号： H01L23/49572 , H01L21/563 , H01L21/6835 , H01L23/3121 , H01L23/488 , H01L23/4952 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2225/1029 , H01L2225/1058 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/15173 , H01L2924/15192 , H01L2924/15331 , H01L2924/181 , H01L2924/18162 , H01L2924/19105 , H01L2924/00
摘要： Disclosed are molded ultra-thin semiconductor die packages, systems that incorporate such packages, and methods of making such packages. An exemplary package comprises a leadframe having an aperture formed between the leadframe's first and second surfaces, and a plurality of leads disposed adjacent to the aperture. The package further comprises a semiconductor disposed in the aperture of the leadframe with its top surface substantially flush with the leadframe's first surface, and at least one gap between at least one side surface of the semiconductor die and at least one lead of the leadframe. A body of electrically insulating material is disposed in the at least one gap. A plurality of conductive members interconnect leads of the leadframe with conductive regions on the die's top surface, with at least one conductive member having a portion disposed over at least a portion of the body of insulating material.
摘要翻译：公开了模制的超薄半导体管芯封装，并入这种封装的系统以及制造这种封装的方法。示例性封装包括具有形成在引线框架的第一和第二表面之间的孔的引线框架和邻近孔径设置的多个引线。封装还包括设置在引线框的孔中的半导体，其顶表面基本上与引线框架的第一表面齐平，以及半导体管芯的至少一个侧表面和引线框架的至少一个引线之间的至少一个间隙。电绝缘材料体设置在所述至少一个间隙中。多个导电构件将引线框架的引线与芯片顶表面上的导电区域互连，至少一个导电构件具有设置在绝缘材料主体的至少一部分上的部分。

33. 发明申请

US20120088331A1 WAFER LEVEL STACK DIE PACKAGE 有权
标题翻译： WAFER LEVEL STACK DIE包装
公开(公告)号：US20120088331A1
公开(公告)日：2012-04-12
申请号：US13323979
申请日：2011-12-13
申请人： Dan Kinzer , Yong Liu , Stephen Martin
发明人： Dan Kinzer , Yong Liu , Stephen Martin
IPC分类号： H01L21/50
CPC分类号： H01L25/16 , H01L21/76898 , H01L23/5389 , H01L24/16 , H01L2224/0401 , H01L2224/05025 , H01L2224/131 , H01L2224/17106 , H01L2924/01029 , H01L2924/01068 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/014 , H01L2924/00
摘要： This document discusses, among other things, apparatus and methods for an IC package including first and a second discrete components fabricated into a semiconductor substrate. The first and second discrete components can be adjacent to one another in the semiconductor substrate, and an integrated circuit die can be mounted on the semiconductor substrate and coupled to the first and second discrete components.
摘要翻译：本文件尤其涉及包括制造在半导体衬底中的第一和第二分立组件的IC封装的装置和方法。第一和第二分立组件可以在半导体衬底中彼此相邻，并且集成电路管芯可以安装在半导体衬底上并耦合到第一和第二分立组件。

34. 发明授权

US08120169B2 Thermally enhanced molded leadless package 有权
标题翻译：耐热增强型无铅封装
公开(公告)号：US08120169B2
公开(公告)日：2012-02-21
申请号：US12037428
申请日：2008-02-26
申请人： Yong Liu , Zhongfa Yuan
发明人： Yong Liu , Zhongfa Yuan
IPC分类号： H01L23/34
CPC分类号： H01L23/49861 , H01L21/561 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A molded leadless package (MLP) semiconductor device includes a heat spreader with a single connecting projection extending from an edge of a cap of the heat spreader to a leadframe. The heat spreader can include additional projections on its edges that act as heat collectors and help to secure the spreader in the MLP. The connecting projection is attached to a lead of the leadframe so that heat gathered by the cap can be transferred through the connecting projection to the lead and to a printed circuit board to which the lead is connected. In embodiments, the heat spreader includes a central heat collector projection from the cap toward the die, preferably in the form of a solid cylinder, that enhances heat collection and transfer to the cap. The cap can include fins projecting from its top surface to facilitate radiant and convection cooling.
摘要翻译：模制无引线封装（MLP）半导体器件包括散热器，其具有从散热器的盖的边缘延伸到引线框架的单个连接突出部。散热器可以在其边缘上包括作为集热器的附加突出部，并有助于将散热器固定在MLP中。连接突起附接到引线框的引线，使得由盖聚集的热量可以通过连接突起传递到引线和连接到引线的印刷电路板。在实施例中，散热器包括从盖朝向模具的中心集热器突出部，优选地以实心圆柱体的形式，其增强热量收集并传递到盖子。盖可以包括从其顶部表面突出的翅片，以促进辐射和对流冷却。

35. 发明申请

US20120012993A1 DIE PACKAGE INCLUDING SUBSTRATE WITH MOLDED DEVICE 有权
标题翻译： DIE包装，包括具有模制设备的基板
公开(公告)号：US20120012993A1
公开(公告)日：2012-01-19
申请号：US13246682
申请日：2011-09-27
申请人： Yong Liu , Zhongfa Yuan
发明人： Yong Liu , Zhongfa Yuan
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49861 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L25/167 , H01L33/483 , H01L33/60 , H01L2224/05553 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/456 , H01L2224/48091 , H01L2224/48247 , H01L2924/01046 , H01L2924/01079 , H01L2924/12041 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/01108 , H01L2924/00 , H01L2924/00012
摘要： A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a second device attached to the premolded substrate.
摘要翻译：公开了一个包装。该封装包括具有引线框结构的预成型基板，附接到引线框架结构的第一器件和覆盖引线框结构和第一器件的至少一部分的成型材料。它还包括连接到预成型基板的第二装置。

36. 发明申请

US20110305288A1 Method and Apparatus for Determining Channel Bandwidth 有权
标题翻译：确定通道带宽的方法和装置
公开(公告)号：US20110305288A1
公开(公告)日：2011-12-15
申请号：US13152040
申请日：2011-06-02
申请人： Yong Liu , Harish Ramamurthy , Raja Banerjea
发明人： Yong Liu , Harish Ramamurthy , Raja Banerjea
IPC分类号： H04L27/28 , H04L27/00
CPC分类号： H04L45/70 , H04L5/0007 , H04L5/001 , H04L5/0037 , H04L5/0098 , H04L25/0208 , H04L25/0224 , H04L43/0888 , H04L47/10 , H04L47/14 , H04L47/24 , H04L47/50 , H04W24/02 , H04W72/042 , H04W74/0816 , H04W84/12
摘要： In a method implemented in a communication device an available bandwidth for transmitting one or more data frames is determined, wherein the available bandwidth corresponds to a first composite communication channel comprising a plurality of communication channels. A control frame to indicate a request to transmit via the first composite communication channel is generated, wherein the control frame includes a header, and wherein a portion of the header includes information indicating the bandwidth of the first composite channel. The control frame is transmitted via the first composite communication channel, wherein at least the portion of the header is duplicated in a plurality of bandwidth portions of the first composite communication channel.
摘要翻译：在通信设备中实现的方法中，确定用于发送一个或多个数据帧的可用带宽，其中可用带宽对应于包括多个通信信道的第一复合通信信道。生成用于指示经由第一复合通信信道发送的请求的控制帧，其中控制帧包括报头，并且其中报头的一部分包括指示第一复合信道的带宽的信息。经由第一复合通信信道发送控制帧，其中报头的至少部分被复制在第一复合通信信道的多个带宽部分中。

37. 发明授权

US08030743B2 Semiconductor package with an embedded printed circuit board and stacked die 有权
标题翻译：半导体封装带有嵌入式印刷电路板和堆叠裸片
公开(公告)号：US08030743B2
公开(公告)日：2011-10-04
申请号：US11970087
申请日：2008-01-07
申请人： Yong Liu , Margie T. Rios , Hua Yang , Yumin Liu , Tiburcio A. Maldo
发明人： Yong Liu , Margie T. Rios , Hua Yang , Yumin Liu , Tiburcio A. Maldo
IPC分类号： H01L23/495
CPC分类号： H01L23/49537 , H01L23/3107 , H01L23/4951 , H01L23/4952 , H01L23/49551 , H01L23/49575 , H01L24/27 , H01L24/48 , H01L24/49 , H01L24/83 , H01L25/16 , H01L2224/27436 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/83101 , H01L2224/83191 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A two tier power module has, in one form thereof, a PC board having upper and lower traces with an opening in the insulating material that contains a power device which has upward extending solder bump connections. An upper leadframe is mounted on the solder bumps and the upper tracks of the PC board. Vias in the PC board connect selected upper and lower traces. A control device is mounted atop the leadframe and wire bonded to the leadframe, and the assembly is encapsulated leaving exposed the bottom surfaces of the lower traces of the PC board as external connections. In another form the PC board is replaced by a planar leadframe and the upper leadframe has stepped sections which make connections with the planar leadframe, the bottom surfaces of the planar leadframe forming external connections of the module.
摘要翻译：两层电源模块的一种形式是具有上和下迹线的PC板，绝缘材料中具有开口，该开口包含具有向上延伸的焊料凸点连接的功率器件。上引线框架安装在焊盘和PC板的上轨道上。 PC板上的通孔连接选定的上下轨迹。控制装置安装在引线框架顶部，引线框架连接在一起，组件被封装，从而将PC板的下部走线的底面暴露为外部连接。在另一种形式中，PC板由平面引线框架代替，并且上引线框架具有与平面引线框架连接的阶梯部分，平面引线框架的底表面形成模块的外部连接。

38. 发明授权

US08023279B2 FLMP buck converter with a molded capacitor and a method of the same 有权
标题翻译：具有模制电容器的FLMP降压转换器及其制造方法
公开(公告)号：US08023279B2
公开(公告)日：2011-09-20
申请号：US12404627
申请日：2009-03-16
申请人： Qiuxiao Qian , Yong Liu
发明人： Qiuxiao Qian , Yong Liu
IPC分类号： H05K1/18
CPC分类号： H05K7/1432 , H01L23/49524 , H01L23/49575 , H01L23/49589 , H01L24/48 , H01L24/49 , H01L2224/40245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4911 , H01L2224/49171 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/1532 , H01L2924/19041 , H01L2924/19107 , H02M3/1588 , Y02B70/1466 , H01L2924/00 , H01L2224/45099
摘要： An encapsulated buck converter module includes a low side transistor and a control integrated circuit bonded to a first section on a first side of a leadframe, a first clip between a source of the low side transistor and a second section, a source contact of a high side transistor attached to the first section on a second side of the leadframe with a gate contact of the high side transistor attached to a third section, a conductive member attached to the first and second sections on the second side of the leadframe wherein the first side of the conductive member attached to the second conductive member forms a conductive path with a portion of a second side of the conductive member while any portion of the first side of the conductive member attached to the first component attachment section is insulated from the first side of the conductive member, a first plate of a capacitor attached to a drain contact of the high side transistor and a second plate of the capacitor attached to the second side of the conductive member, and means for forming an external connection to the drain contact of the high side transistor.
摘要翻译：封装的降压转换器模块包括：低侧晶体管和与引线框架的第一侧上的第一部分结合的控制集成电路;在低侧晶体管的源极与第二部分之间的第一夹子，在所述引线框架的第二侧附接到所述第一部分的侧面晶体管，所述第一部分具有附接到第三部分的所述高侧晶体管的栅极接触;导电部件，其附接到所述引线框架的第二侧上的所述第一和第二部分，其中所述第一侧连接到第二导电构件的导电构件形成具有导电构件的第二侧的一部分的导电路径，而导电构件的附接至第一构件安装部的第一侧的任何部分与第一构件附接部的第一侧绝缘导电构件，附接到高侧晶体管的漏极接触的电容器的第一板和连接到s的电容器的第二板导电部件的漏极侧，以及用于与高侧晶体管的漏极接触形成外部连接的装置。

39. 发明授权

US08018054B2 Semiconductor die package including multiple semiconductor dice 有权
标题翻译：半导体管芯封装包括多个半导体管芯
公开(公告)号：US08018054B2
公开(公告)日：2011-09-13
申请号：US12046939
申请日：2008-03-12
申请人： Yong Liu , Qiuxiao Qian
发明人： Yong Liu , Qiuxiao Qian
IPC分类号： H01L23/34
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/49551 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/49171 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor die package. The semiconductor die package includes a leadframe structure comprising a first die attach pad, and a second die attach pad laterally spaced from the first die attach pad, a first side and a second side opposite to the first side. The semiconductor die package further includes a first semiconductor die attached the first die attach pad at the first side of the leadframe structure, and a second semiconductor die attached to the second die attach pad at the second side of the leadframe structure. The semiconductor die package further includes a housing material covering at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die.
摘要翻译：半导体管芯封装。半导体管芯封装包括引线框结构，其包括第一管芯附接焊盘和与第一管芯附接焊盘横向间隔开的第二管芯附接焊盘，第一侧和与第一侧相对的第二侧。所述半导体管芯封装还包括第一半导体管芯，所述第一半导体管芯在所述引线框架结构的第一侧附接所述第一管芯附着焊盘，以及在所述引线框架结构的第二侧附接到所述第二管芯附接焊盘的第二半导体管芯。半导体管芯封装还包括覆盖引线框结构，第一半导体管芯和第二半导体管芯的至少一部分的壳体材料。

40. 发明授权

US07970932B2 View-upload decoupled peer-to-peer video distribution systems and methods 失效
标题翻译：查看上传解耦对等视频分发系统和方法
公开(公告)号：US07970932B2
公开(公告)日：2011-06-28
申请号：US12336294
申请日：2008-12-16
申请人： Yong Liu , Keith W. Ross
发明人： Yong Liu , Keith W. Ross
IPC分类号： G06F15/173
CPC分类号： H04L65/4076 , H04L65/4084 , H04L65/602 , H04L65/605 , H04L65/80
摘要： View-upload decoupled (“VUD”) peer-to-peer (P2P) video distribution is provided, in which each peer is assigned to one or more channels to upload, with the assignments made independent of what the peer is viewing. For each assigned channel, the peer distributes (that is, uploads) the channel. This effectively creates semi-permanent distribution swarms for each channel, which are formed by peers responsible for uploading that channel. This can minimize problems associated with channel churn because peers may remain in their assigned distribution groups even if they switch channels. To minimize cross-channel overhead associated with VUD P2P video distribution, substream swarming, in which a peer in a distribution swarm only downloads a small portion of the video stream, called a substream, and uploads the substream to multiple viewers, may be provided. To minimize video streaming quality degradation that may occur during a reconfiguration transient period upon sudden and large increases in video download demands for some channel, VUD P2P video distribution may be integrated with tradition ISO P2P video distribution (which is self-adaptive to the sudden increases in channel popularity).
摘要翻译：提供了视图上传去耦（“VUD”）点对点（P2P）视频分发，其中每个对等体被分配给一个或多个信道进行上传，分配独立于对等体正在观看。对于每个分配的频道，对等体分发（即上传）频道。这有效地为每个通道（由负责上传该通道的对等体构成）形成半永久分布群。这可以最小化与通道流失相关的问题，因为即使切换通道，对等体可能保留在其分配的分配组中。为了最小化与VUD P2P视频分发相关联的跨信道开销，可以提供分散群中的对等体仅下载视频流的一小部分的称为子流的子流群集，并将子流上载到多个观看者。为了最大限度地减少在重新配置过渡期间可能发生的视频流质量下降，对于某些频道的视频下载需求突然大幅增加，VUD P2P视频分发可能与传统的ISO P2P视频分发（其自适应突发增加在渠道流行）。

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