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31. 发明专利

AU2014363459B2 Pretreatment of substrates that have unsaturated units 未知
公开(公告)号：AU2014363459B2
公开(公告)日：2018-08-09
申请号：AU2014363459
申请日：2014-12-11
申请人： SIKA TECH AG
发明人： HAUFE MARKUS , EGLI PATRICIA
IPC分类号： C09J4/00 , C08F220/28 , C09J5/02 , C09J11/06 , C09J175/14
摘要： The invention relates to a method for treating substrates, comprising applying a composition, which comprises at least one latent alkyl borane and is substantially free of decomplexing agents for the latent alkyl borane, to a substrate (1) that has a material having unsaturated units, applying a radically curable substance to the substrate (1) pretreated with the latent alkyl borane, and allowing the radically curable substance to cure in order to form a composite structure. The method according to the invention is suitable in particular for applying paints, coatings, or sealing materials/filling materials to substrates, such as EPDM, NBR, and SBR, and for adhesively bonding such substrates. Composite materials adhesively bonded accordingly are distinguished by especially firm adhesion of the adhesive to the substrate, wherein conventional adhesives can be used, which have optimized properties with regard to the storage stability, open time, and cure time thereof.

32. 发明专利

AU2016274431A1 Connecting of sealing strips 未知
公开(公告)号：AU2016274431A1
公开(公告)日：2017-12-21
申请号：AU2016274431
申请日：2016-06-02
申请人： SIKA TECH AG
发明人： HAUFE MARKUS , HUG MAX
IPC分类号： C09J5/02 , C09J4/00 , E04B1/68
摘要： The invention relates to a method for connecting sealing strips, comprising applying a composition, which comprises at least one latent alkyl borane and is substantially free of decomplexing agent for the latent alkyl borane, to a sealing-strip substrate (1), applying a radical-curing adhesive to the sealing-strip substrate (1) pre-treated with the latent alkyl borane, bringing the sealing-strip substrate (1) in contact with a sealing-strip substrate (2) in such a way that the radical-curing adhesive is arranged between the two substrates, and allowing the radical-curing adhesive to cure, a composite structure thus being formed. The method according to the invention is suitable in particular for adhesively bonding sealing strips based on elastic and thermoplastic substrates, such as EPDM or SBR, but also for adhesively bonding PVC sealing strips. Sealing strips adhesively bonded accordingly are charcterized by favorable resistance of the adhesive to alkaline media, wherein conventional adhesives can be used which have optimized properties with regard to the storage stability, the open time, and the curing time thereof.

33. 发明专利

ZA201604588B PRETREATMENT OF SUBSTRATES THAT HAVE UNSATURATED UNITS 未知
公开(公告)号：ZA201604588B
公开(公告)日：2017-11-29
申请号：ZA201604588
申请日：2016-07-06
申请人： SIKA TECH AG
发明人： EGLI PATRICIA , HAUFE MARKUS

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