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31. 发明授权

US1974807A Compound tool and method of making the same 失效
标题翻译：复合工具和制作方法
公开(公告)号：US1974807A
公开(公告)日：1934-09-25
申请号：US65397533
申请日：1933-01-28
申请人： CHASE COMPANIES INC
发明人： DEMPSEY MICHAEL J
IPC分类号： B21C3/00
CPC分类号： B21C3/00

33. 发明专利

JP2010131617A Method of manufacturing ultra-thin wall seamless metallic pipe using floating plug 有权
标题翻译：使用浮动插头制造超薄壁无缝金属管的方法
公开(公告)号：JP2010131617A
公开(公告)日：2010-06-17
申请号：JP2008308601
申请日：2008-12-03
申请人： Sumitomo Metal Ind Ltd , 住友金属工業株式会社
发明人： HAYASHI CHIHIRO
IPC分类号： B21C1/22 , B21C1/28 , B21C3/16
CPC分类号： B21C1/22 , B21C1/24 , B21C3/00 , B21C3/16
摘要： PROBLEM TO BE SOLVED: To propose a method of manufacturing an ultra-thin wall seamless metallic pipe by cold drawing method by which the manufacturable range on the thin-wall side of the metallic pipe can drastically be extended. SOLUTION: In this expanding/drawing method, an inlet-side solid die the diameter of which is expanded, constant or reduced toward the outlet side of finishing from the inlet side of biting and an outlet-side solid die the diameter of which is reduced at least in the vicinity of the inlet of biting are connected to each other and arranged oppositely and a taper type plug the diameter of which is expanded toward the outlet side of the finishing from the inlet side of biting is floated and, in the range of the inlet-side solid die, the wall thickness is reduced while expanding the diameter of the thickness center of a pipe stock between the solid die and the plug and, in the range of the outlet-side solid die, the taper type plug is floated by reducing the outside diameter. Since the manufacture of the ultra-thin wall seamless metallic pipe and long-size pipe making are made possible by the method and rationalization of a process is attained in the respects of yield, efficiency or the like, economical merit is remarkably large. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提出一种通过冷拉拔法制造超薄壁无缝金属管的方法，通过该方法可以显着延长金属管的薄壁侧的可制造范围。解决方案：在该膨胀/拉伸方法中，入口侧固体模具的直径从咬合入口侧朝向精加工出口侧膨胀，恒定或减小，出口侧固体模具的直径为其至少在咬入口附近被还原并且相对地布置，并且直径从咬合入口侧朝向精加工的出口侧扩大的锥形塞被浮起，并且在入口侧固体模具的范围，壁厚减小，同时扩大固体模头和塞子之间的管材的厚度中心的直径，并且在出口侧固体模具的范围内，锥形型插头通过减小外径而浮起。由于可以通过该方法制造超薄壁无缝金属管和长管制造，并且在产率，效率等方面达到了工艺的合理化，经济上的优点非常大。版权所有（C）2010，JPO＆INPIT

34. 发明申请

WO2007028410A1 FORMING TOOL 审中-公开
标题翻译：成型工具
公开(公告)号：WO2007028410A1
公开(公告)日：2007-03-15
申请号：PCT/EP2005/009629
申请日：2005-09-08
申请人： ALCAN TECHNOLOGY & MANAGEMENT LTD. , DENEUVILLE, Patrick
发明人： DENEUVILLE, Patrick
IPC分类号： B21C3/00 , B21C3/02 , B21C3/16 , B21C3/18 , B21C25/04 , B21K5/20 , B23P15/24 , H05K3/00 , C22C45/02 , B29C45/02 , B29C33/42
CPC分类号： B23P15/24 , B21C3/00 , B21C3/02 , B21C3/16 , B21C3/18 , B21C25/025 , B21C25/04 , B21J1/006 , B21K5/20 , B29C33/424 , B29C33/56 , C22C45/00 , F16D3/74
摘要： A forming tool (20) characterised in that it comprises a substrate (21) and a metallic glass layer (23) on at least the working surface (22) of the forming tool (20) whereas the forming tool is one of: a) a forming tool of an extrusion press; b) a die of a wire-drawing machine; c) a roll of a polymer processing unit.
摘要翻译：一种成形工具（20），其特征在于，其包括在成形工具（20）的至少工作表面（22）上的基底（21）和金属玻璃层（23），而成形工具是以下之一：a）挤压机的成形工具; b）拉丝机的模具; c）一卷聚合物处理单元。

35. 发明申请

WO1995028239A1 BRIGHT-ANNEALED HIGHLY SMOOTH INNER SURFACE STAINLESS STEEL PIPE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：明亮的高亮度内表面不锈钢管及其制造方法
公开(公告)号：WO1995028239A1
公开(公告)日：1995-10-26
申请号：PCT/JP1995000725
申请日：1995-04-13
申请人： SUMITOMO METAL INDUSTRIES, LTD. , SUMIKIN STAINLESS STEEL TUBE CO., LTD. , IMAMURA, Yoichi , FURUGEN, Munekatsu , CHOBA, Hajimu
发明人： SUMITOMO METAL INDUSTRIES, LTD. , SUMIKIN STAINLESS STEEL TUBE CO., LTD.
IPC分类号： B21C01/00
CPC分类号： B21C1/24 , B21C3/00 , B21C37/30 , Y10S138/11 , Y10T29/49835
摘要： A bright-annealed highly smooth inner surface stainless steel pipe characterized in that the roughness of the inner surface is not higher than 1.0 mu m in terms of Rmax, and is suitably used as a clean pipe for a semiconductor manufacturing apparatus. This pipe can be obtained in a cold-drawn and bright-heat-treated state. This enables a treatment, such as electrochemical polishing, which has been considered essential in the conventional method of this kind, to be omitted, the manufacturing cost to be reduced greatly, and the present invention to be utilized extensively in the field of production of semiconductors.
摘要翻译：光亮退火的高度光滑的内表面不锈钢管，其特征在于，内表面的粗糙度以Rmax计不高于1.0μm，并且适合用作半导体制造装置的清洁管。该管可以在冷拉和亮热处理状态下获得。这使得可以省略在常规方法中被认为是必要的诸如电化学抛光的处理，大大降低制造成本，并且广泛应用于半导体生产领域的本发明。

36. 发明公开

EP2595184A2 Silver bond wire for semiconductor devices 审中-公开
标题翻译： SilberbonddrahtfürHalbleiteranordnungen
公开(公告)号：EP2595184A2
公开(公告)日：2013-05-22
申请号：EP12007475.2
申请日：2012-11-02
申请人： Heraeus Materials Technology GmbH & Co. KG
发明人： Chung, Eun-Kyun , Ryu, Jae-Sung , Tark, Yong-Deok
IPC分类号： H01L23/49 , H01L33/62
CPC分类号： H01L33/62 , B21C3/00 , C22C5/06 , C22C5/08 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/43 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45565 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00011 , H01L2924/00015 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/12041 , H01L2924/181 , H01L2924/0103 , H01L2924/0105 , H01L2924/01078 , H01L2924/01076 , H01L2924/01079 , H01L2924/01046 , H01L2924/01004 , H01L2924/01057 , H01L2924/01039 , H01L2924/0102 , H01L2924/01056 , H01L2924/01058 , H01L2224/45147 , H01L2224/45664 , H01L2924/01204 , H01L2924/01045 , H01L2924/013 , H01L2924/00013 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01049 , H01L2924/01006
摘要： A bonding wire for semiconductor devices and a method of manufacturing the same are disclosed. The bonding wire for semiconductor devices according to the present invention includes at least one selected from the group consisting of zinc (Zn), tin (Sn), and nickel (Ni) at 5 ppm to 10 wt%, and the remainder including silver (Ag) and other inevitable impurities.
摘要翻译：公开了一种用于半导体器件的接合线及其制造方法。根据本发明的用于半导体器件的接合线包括从5ppm至10wt％的锌（Zn），锡（Sn）和镍（Ni）中选择的至少一种，其余包括银（ Ag）等不可避免的杂质。

37. 发明公开

EP2371463A1 MANUFACTURING METHOD FOR ULTRATHIN SEAMLESS METAL PIPE UTILIZING FLOATING PLUG 有权
标题翻译：法制造超薄，无缝金属管使用浮动插头
公开(公告)号：EP2371463A1
公开(公告)日：2011-10-05
申请号：EP09830290.4
申请日：2009-11-11
申请人： Sumitomo Metal Industries, Ltd.
发明人： HAYASHI Chihiro
IPC分类号： B21C1/22 , B21C1/28 , B21C3/16
CPC分类号： B21C1/22 , B21C1/24 , B21C3/00 , B21C3/16
摘要： Proposed is a method of producing an ultrathin-wall metal tube by a cold drawing method capable of drastically expanding an available size range toward much thinner side with respect to wall thickness of metal tubes. This is a diameter-expanding drawing method, in which an entry solid die, the diameter of which increases, remains constant or decreases from the engaging entry side toward the finishing exit side, and a delivery solid die, the diameter of which decreases at least in the vicinity of the engaging entry, are arranged in series and in an abutting relation on the same pass line, and a tapered plug, the diameter of which increases from the engaging entry side toward the finishing exit side, is caused to float along the pass line, whereby in the entry solid die region, the wall thickness is reduced while the mid-wall diameter of a hollow shell is being expanded between the solid die and the plug, and in the delivery solid die region, the tapered plug is caused to float by performing reduction working of the outside diameter. This method offers tremendously great economic advantages, because it is possible to produce ultrathin-wall seamless metal tubes and to make longer length tubes, and to realize the rationalization of processes in terms of yield, efficiency and the like.
摘要翻译：提议是由能够膨胀大幅度可用大小范围朝向薄得多侧相对于金属管的壁厚的冷拉方法在超薄壁金属管的制造方法。这是一个扩径绘图方法，其中条目固体，其直径其中，增加，保持不变或从接合入口侧朝向精加工出口侧下降，以及输送固体，其直径其中，减小至少在接合条目的附近，以在相同的轧制线邻接关系串联布置并且在和锥形插头，其直径从卡合入侧朝向精加工出口侧增加时，被导致沿着浮轧制线，由此在入口固体的区域中，减小壁厚而空心管坯的中间壁直径被固体中和插头之间扩展，并且在输送固体的区域中，锥形塞引起通过进行外径的减少工作浮动。这种方法提供了很大的极大的经济优势，因为它可以生产超薄壁无缝金属管和使较长的长度的管，实现的过程合理化收率，效率等方面。

38. 发明公开

EP1933995A1 FORMING TOOL 有权
标题翻译：模具
公开(公告)号：EP1933995A1
公开(公告)日：2008-06-25
申请号：EP05783795.7
申请日：2005-09-08
申请人： Alcan Technology & Management Ltd.
发明人： DENEUVILLE, Patrick
IPC分类号： B21C3/00 , B21C3/02 , B21C3/16 , B21C3/18 , B21C25/04 , B21K5/20 , B23P15/24 , H05K3/00 , C22C45/02 , B29C45/02 , B29C33/42
CPC分类号： B23P15/24 , B21C3/00 , B21C3/02 , B21C3/16 , B21C3/18 , B21C25/025 , B21C25/04 , B21J1/006 , B21K5/20 , B29C33/424 , B29C33/56 , C22C45/00 , F16D3/74
摘要： A forming tool (20) characterised in that it comprises a substrate (21) and a metallic glass layer (23) on at least the working surface (22) of the forming tool (20) whereas the forming tool is one of: a) a forming tool of an extrusion press; b) a die of a wire-drawing machine; c) a roll of a polymer processing unit.

39. 发明公开

EP0388824A3 Verfahren und Vorrichtung zum Ziehen von Rohrkörpern 失效
标题翻译：用于绘制管状体的方法和装置
公开(公告)号：EP0388824A3
公开(公告)日：1991-07-03
申请号：EP90105080.7
申请日：1990-03-17
申请人： Evertz, Egon
发明人： Evertz, Egon , Seybold, Rolf, Prof.Dr.-Ing.
IPC分类号： B21C1/24 , B21D9/12
CPC分类号： B21C3/12 , B21C1/24 , B21C3/00 , B21C37/28 , B21D9/125
摘要： Die Erfindung bezieht sich auf ein Verfahren und eine Vorrichtung zum Ziehen von Rohrkörpern 3, insbesondere von rechteckigen Rohrkörpern 3 mit bogenförmiger Achse 11, wie sie als Kokille zum Stranggießen von Stahl Verwendung finden. Bei der genannten sowie bei weiteren Anwendungen ist die Einhaltung vorgegebener Maße für die Wandstärke des Rohrkörpers 3 von großer Bedeutung. Der gradlinige Antrieb in Richtung auf eine Ziehform in Gestalt eines Druckringes 6 führt infolge der Krümmung des Rohrkörpers 3 zu einer exzentrischen Lage beim Durchgang durch den Druckring 6, so daß die Wandstärke normalerweise unterschiedlich ausfällt. Die Erfindung behebt dies dadurch, daß der Druckring 6 in Abhängigkeit seines Abstand vom hinteren Dornende in eine Schrägstellung gesteuert wird, bei welcher er zentriert durch den Druckring 6 geführt ist, so daß die Wandstärke trotz unterschiedlicher Krafteinwirkung auf den Druckring 6 gleich gehalten werden kann. Eine Steuerfunktion kann für die Lage des Druckringes auf Grund empirischer Messungen des Abstandes des Dorns 2 während seiner Einschubbewegung vom Innenrand des Druckrings 6 ermittelt werden.

40. 发明专利

JP2013110410A Bonding wire for semiconductor devices 有权
标题翻译：用于半导体器件的接合线
公开(公告)号：JP2013110410A
公开(公告)日：2013-06-06
申请号：JP2012248968
申请日：2012-11-13
申请人： Heraeus Materials Technology Gmbh & Co Kg , ヘレウスマテリアルズテクノロジーゲーエムベーハーウントカンパニーカーゲー
发明人： CHUNG EUN-KYUN , RYU JAE-SUNG , TARK YONG DEOK
IPC分类号： H01L21/60
CPC分类号： H01L33/62 , B21C3/00 , C22C5/06 , C22C5/08 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/43 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45565 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00011 , H01L2924/00015 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/12041 , H01L2924/181 , H01L2924/0103 , H01L2924/0105 , H01L2924/01078 , H01L2924/01076 , H01L2924/01079 , H01L2924/01046 , H01L2924/01004 , H01L2924/01057 , H01L2924/01039 , H01L2924/0102 , H01L2924/01056 , H01L2924/01058 , H01L2224/45147 , H01L2224/45664 , H01L2924/01204 , H01L2924/01045 , H01L2924/013 , H01L2924/00013 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01049 , H01L2924/01006
摘要： PROBLEM TO BE SOLVED: To provide a bonding wire for semiconductor devices, and an LED package using the bonding wire and containing silver (Ag) as a chief ingredient.SOLUTION: A bonding wire 50 for semiconductor devices includes at least one selected from the group consisting of zinc (Zn), tin (Sn), and nickel (Ni) at 5 ppm to 10 wt.%, and the remainder includes silver (Ag) and other inevitable impurities.

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