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    • 37. 发明申请
    • 電子機器用筐体の製造方法
    • 生产电子设备房屋的方法
    • WO2006095781A1
    • 2006-09-14
    • PCT/JP2006/304491
    • 2006-03-08
    • 日本写真印刷株式会社浜岡 弘一
    • 浜岡 弘一
    • B29C45/16B29C45/14
    • B29C45/1671B29C45/14688B29C45/1675B29C2045/14696
    • A process for producing a housing for electronic equipment, comprising the steps of with the use of injection molding dies (1) having a combination of common die (4) and exchange die (2,3) so as to be able to create primary molding cavity (11) and secondary molding cavity (12), disposing in the primary molding cavity a transfer material having a decorative layer superimposed on a base sheet, and thereafter injecting a transparent resin of = 80% visible ray transmittance pursuant to JIS-K7105 and = F pencil hardness pursuant to JIS-K5600-5-4 to thereby obtain primary molding (53) corresponding to a transparent window portion and simultaneously bringing the same into contact with the decorative layer of the transfer material; and subsequently injecting a resin of = 10 KJ/m 2 Izod impact strength pursuant to ASTM-D256 in the secondary molding cavity around the primary molding while holding the primary molding disposed to thereby form secondary molding (54) fixed to the primary molding and simultaneously bringing the same into contact with the decorative layer of the transfer material; and detaching the transfer material from the primary molding and secondary molding.
    • 一种电子设备用壳体的制造方法,其特征在于,包括使用具有共模(4)和交换模(2,3)的组合的注射成型模具(1)的步骤,以便能够产生一次成型 空腔(11)和二次成型腔(12),在初级模制腔中设置具有叠加在基片上的装饰层的转印材料,然后根据JIS-K7105注入= 80%可见光线透射率的透明树脂,以及 =根据JIS-K5600-5-4的铅笔硬度,由此获得对应于透明窗口部分的一次成型(53)并同时使其与转印材料的装饰层接触; 随后在保持一次成型设备的同时将根据ASTM-D256的= 10KJ / m 2 Izod冲击强度的树脂注射在初级模制件周围的第二模塑腔中,从而形成二次模塑(54) 固定在一次成型体上并同时使其与转印材料的装饰层接触; 并从第一次模塑和二次模塑中分离转移材料。
    • 40. 发明申请
    • Method of Manufacturing Casing for Electronic Apparatus
    • 电子设备制造套管的方法
    • US20080122137A1
    • 2008-05-29
    • US11886039
    • 2006-03-08
    • Koichi Hamaoka
    • Koichi Hamaoka
    • B29C45/16
    • B29C45/1671B29C45/14688B29C45/1675B29C2045/14696
    • A method of manufacturing a casing for an electronic apparatus, comprising the steps of with the use of injection molding die having a combination of common mold and exchangeable mold so as to be able to form primary molding cavity and secondary molding cavity, disposing in the primary molding cavity a transfer material having a decorative layer superimposed on a base sheet, and thereafter injecting a transparent resin that has a visible light transmittance of 80% or more defined in JIS-K7105 and pencil hardness of F or more defined in JIS-K5600-5-4 thereby obtain primary mold product corresponding to a transparent window portion and simultaneously bonding the decorative layer of the transfer material; and subsequently injecting a resin that has a Izod impact strength 10 KJ/m2 or more defined ASTM-D256 in the secondary molding cavity around the primary molding while holding the primary mold product disposed to thereby form secondary mold product fixed to the primary mold product and simultaneously bonding the decorative layer of the transfer material; and detaching the transfer material from the primary mold product and secondary mold product.
    • 一种制造电子设备用壳体的方法,包括以下步骤:使用具有共模和可交换模的组合的注射模具,以便能够形成初级模腔和二次模腔, 将具有装饰层的转印材料叠加在基材上,然后注入JIS-K7105中定义的可见光透射率为80%以上的透明树脂,JIS-K5600- 从而获得对应于透明窗口部分并同时粘合转印材料的装饰层的初级模具产品; 随后在保持一次模具产品的同时将初始模塑件周围注入具有艾氏冲击强度为10KJ / m 2以上的ASTM-D256的树脂,从而形成二次模具 产品固定在初级模具产品上并同时粘合转印材料的装饰层; 并从第一模具产品和二次模具产品中分离转移材料。