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41. 发明专利

JPH10190183A MANUFACTURE OF PRINTED CIRCUIT BOARD HAVING PLATED RESISTOR 失效
公开(公告)号：JPH10190183A
公开(公告)日：1998-07-21
申请号：JP34237397
申请日：1997-12-12
申请人： MACDERMID INC , HADCO CORP
发明人： BENGSTON JON , LARSON GARY B , KOLOGE DONNA , SCHWEIKHER WILLIAM , DEREGO TODD , RAABERG BRUCE S , SORENSON BRUCE
IPC分类号： H01C17/18 , H05K1/16 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To make a resistor to be printed and plated as the integrated part of the circuit of a printed circuit board by plating a resistive material to an insulating substrate existing between conductive areas so that the resistive material may connect the conductive areas to each other. SOLUTION: After exposed copper is etched off and an etch resist is removed, the exposed surface is activated and a mask for plating which substantially covers the entire exposed surface except an area where a resistor 16 is to be plated is applied to the surface. Then the exposed surface is plated with a resistive material and the mask for plating is removed. After the mask is removed, the surface of a bare dielectric substrate 10 is activated so that the surface may accept plating. Then a mask for plating is applied to the substrate 10 so that a desired circuit may be demarcated in a negative state and the area between the circuit and a position related to the resistor 16 may be demarcated in a positive state. Thereafter, the desired circuit is plated and a resist 15 is removed.

42. 发明专利

JPH10102282A PRODUCTION OF NONCONDUCTIVE SUBSTRATE FOR ELECTROPLATING 失效
公开(公告)号：JPH10102282A
公开(公告)日：1998-04-21
申请号：JP17546497
申请日：1997-07-01
申请人： MACDERMID INC
发明人： KUKANSKIS E PETER , YOCIS KATHLEEN , LARSON CHRISTOPHER
IPC分类号： C25D5/54 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To impart uniform conductivity to the surface of a conductive layer and the surface of a nonconductive layer by treating the layer of the conductive surface and the layer of the nonconductive surface by a specified compound-contg. soln., depositing carbon on the surface of the nonconductive layer and thereafter electroplating it with metal. SOLUTION: The surface composed of nonconductive substance and conductive substance on the hole of a printed wiring board or the like is treated by a soln. contg. a compound such as imidazole to form an electric corrosion protection layer insoluble in neutral and alkaline media and soluble in acid media on the surface of the conductive layer. Next, it is brought into contact with a carbon-dispersed soln. contg. carbon black to deposit carbon on the surface of the nonconductive substance layer, and thereafter, it is brought into contact with an acid medium contg. hydrochloric acid to dissolve the electric corrosion pretection layer on the surface of the conductive layer away. Finally, the surfaces of the conductive layer and the nonconductive layer deposited with carbon are electroplated with metal such as copper to form an electrically conductive layer by the metal. The metal plating layer excellent in conductivity can be formed on the inside face of the through hole of a printed wiring board composed of the conductive layer and the nonconductive substance.

43. 发明专利

JPH09102677A MANUFACTURE OF PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH09102677A
公开(公告)日：1997-04-15
申请号：JP19990796
申请日：1996-07-30
申请人： MACDERMID INC
发明人： PIITAA KUKANKISU
IPC分类号： H05K3/18 , H05K3/24 , H05K3/28 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a new semi-additive manufacturing method of a printed circuit board, in which conventional technique is improved in several points containing the reduction of treatment processes. SOLUTION: A circuit is formed to the external surface of a copper-clad laminate, a desensitization mask is given to the surface of the circuit, holes are bored to a desired array, and the holes are activated so that plating is received in the inside. The desensitization mask is removed from the surface, a mask for plating is given to the surface, and the surface not covered with the mask for plating is cleaned arbitrarily. Hole surfaces not covered with the mask for plating and other surfaces are plated with metallic coating.

44. 发明专利

JPH08269724A COMPOSITION AND METHOD FOR SELECTIVE PLATING 失效
公开(公告)号：JPH08269724A
公开(公告)日：1996-10-15
申请号：JP22500295
申请日：1995-09-01
申请人： MACDERMID INC
发明人： DONARUDO FUERIA , ERITSUKU YAKOBUSON
IPC分类号： C07D233/04 , C23C18/18 , H05K3/18

45. 发明专利

JPH08246188A PRODUCTION OF NONCONDUCTIVE SUBSTRATE FOR ELECTROPLATING 失效
公开(公告)号：JPH08246188A
公开(公告)日：1996-09-24
申请号：JP1862696
申请日：1996-02-05
申请人： MACDERMID INC
发明人： DONARUDO FUERIA , ROSA MAACHINESU , ERITSUKU YAKOBUSON
IPC分类号： C25D5/54 , C25D7/00 , C25D15/02 , C25D21/14 , H05K3/18 , H05K3/42

46. 发明专利

JPH07301919A DIRECT IMAGE-FORMATION METHOD FOR CREATION OF RESIST PATTERNON SURFACE AND ITS USAGE IN MANUFACTURE OF PRINTED-CIRCUIT BOARD 失效
公开(公告)号：JPH07301919A
公开(公告)日：1995-11-14
申请号：JP22041293
申请日：1993-07-09
申请人： MACDERMID INC
发明人： JIYON GURANWARUDO , SHIYURAMITSUTO HAASHIYU , CHIYABA GARU , YAKOBU MOOZERU
IPC分类号： G03F7/004 , B41M5/36 , C08G59/50 , G03F7/016 , G03F7/038 , G03F7/039 , G03F7/20 , H05K3/00 , H05K3/06 , H05K3/18 , H05K3/28 , H05K3/46
摘要： PURPOSE: To provide a direct image forming method for producing resist patterns with predetermined patterns without using an optical tool on the surface of a base material, such as a printed circuit board. CONSTITUTION: This process for producing the imaging patterns of the resist directly on the base material surface, like the patterns of the etching resistant org. resin material on a copper clad dielectric material in association with the process for producing the printed circuit board(PCB) by using not a photoresist but hot resist, i.e., using a compsn. to be subjected to not photoexcited chemical deformation but heat excited chemical deformation. The film of the hot resist compsn. on the base material surface is scanned by a concentrating heat source, for example, the hot laser released in the IR area, to the desired patterns without the optical tool, by which the localized heat induced chemical deformation of the compsn. is resulted. This deformation directly forms the resist patterns or forms the developable latent image of the patterns in the film.

47. 发明专利

JPH0519317B2 失效
公开(公告)号：JPH0519317B2
公开(公告)日：1993-03-16
申请号：JP50175088
申请日：1988-01-15
申请人： MACDERMID INC
发明人： FUIIRIA DONARUDO AARU
IPC分类号： G03F7/26 , B05D1/32 , B05D3/10 , G03F7/00 , H05K3/18 , H05K3/42
摘要： An additive process for making printed circuit boards utilizing aqueous alkaline strippable resists, in which a suitable insulating substrate is patterned with the resist, the resist-patterned substrate catalyzed to electroless metal deposition, the resist then stripped completely from the substrate, utilizing an aqueous alkaline solution, preferably containing a reducing agent, and the electroless metal then deposited over the areas of the substrate catalyzed in the desired pattern.

48. 发明专利

JPH04322496A MANUFACTURE OF PRINTED CIRCUIT AND COMPOSITION USED THEREFOR 失效
公开(公告)号：JPH04322496A
公开(公告)日：1992-11-12
申请号：JP35415091
申请日：1991-11-19
申请人： MACDERMID INC
发明人： JIYON JIEI GURANWAARUDO
IPC分类号： C23F1/00 , C23C18/22 , H05K3/00 , H05K3/38 , H05K3/42
摘要： PURPOSE: To provide composition and method, which eliminate cleaning operation in between processes by putting a large number of processes needed for manufacturing a printed circuit together in one process, eliminate the need to markedly spoil functions of reagent of the respective processes because of coexistence of the respective reagents, and reinforce the functions of other reagent by one of the reagents when there is the need. CONSTITUTION: The present invention provides a water composition used for the processing of a printed circuit precursor in the manufacturing process of a printed circuit and is composed containing a reducer that is effective in neutralizing an oxidizing substance left on the surface of the printed circuit precursor as a result of preliminary processing using an oxidizer, a copper oxidizer that is effective in increasing the adhesion of deposited metal plating after microetching of an exposed copper surface of the printed circuit precursor, and a water-soluble acid that is effective in forming composition soluble salt of etched copper. The present invention provides the manufacture of the printed circuit for attaining the purpose by using a composition like this.

49. 发明专利

JPH04231477A TIN-LEAD IMMERSION BATH 失效
公开(公告)号：JPH04231477A
公开(公告)日：1992-08-20
申请号：JP22661891
申请日：1991-05-30
申请人： MACDERMID INC
发明人： DONARUDO AARU FUERIA
IPC分类号： C23C18/48 , H05K3/34

50. 发明专利

JPH047117B2 失效
公开(公告)号：JPH047117B2
公开(公告)日：1992-02-07
申请号：JP50568987
申请日：1987-09-10
申请人： MACDERMID INC
发明人： FUAARIAA DONARUDO AARU , RAASON GEIRII BII
IPC分类号： C09K3/00 , C23C18/16 , C23C18/18 , G03F7/00 , G03F7/26 , G03F7/40 , H05K3/18 , H05K3/38 , H05K3/42

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