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41. 发明申请

US20120038036A1 Structure for Multi-Row Leadframe and Semiconductor Package Thereof and Manufacture Method Thereof 有权
标题翻译：多行引线框和半导体封装结构及其制造方法
公开(公告)号：US20120038036A1
公开(公告)日：2012-02-16
申请号：US13142172
申请日：2009-12-23
申请人： Hyun A. Chun , Jae Bong Choi , Sung Won Lee , Sung Wuk Ryu , Hyuk Soo Lee , Sai Ran Eom
发明人： Hyun A. Chun , Jae Bong Choi , Sung Won Lee , Sung Wuk Ryu , Hyuk Soo Lee , Sai Ran Eom
IPC分类号： H01L23/495 , G03F7/20 , H01L21/60
CPC分类号： H01L21/4832 , H01L23/49582 , H01L24/29 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/181 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.
摘要翻译：本发明涉及一种用于半导体封装的多列引线框，其特征在于：在引线框架材料上形成电镀图案（第一步骤）; 在电镀图案上形成保护图案（第二工序）; 并且通过使用保护图案作为掩模形成纳米图案（第三步骤），由此在电镀图案的上表面上形成保护图案，以通过防止由蚀刻溶液导致的镀层损伤而提高产品的可靠性引线框架的图案形成，从而解决了使用镀层作为蚀刻掩模的问题。

42. 发明申请

US20110227208A1 Structure and Manufacture Method For Multi-Row Lead Frame and Semiconductor Package 有权
标题翻译：多行引线框架和半导体封装的结构和制造方法
公开(公告)号：US20110227208A1
公开(公告)日：2011-09-22
申请号：US13121018
申请日：2009-09-25
申请人： Ji Yun Kim , Hyun Sub Shin , Sung Won Lee , Hyung Eui Lee , Yeong Uk Seo , Sung Wuk Ryu , Hyuk Soo Lee
发明人： Ji Yun Kim , Hyun Sub Shin , Sung Won Lee , Hyung Eui Lee , Yeong Uk Seo , Sung Wuk Ryu , Hyuk Soo Lee
IPC分类号： H01L23/495 , H01L21/64 , H05K3/00 , G03F7/20
CPC分类号： H01L21/4832 , H01L23/49503 , H01L23/49513 , H01L23/49541 , H01L23/49568 , H01L23/49582 , H01L24/48 , H01L24/73 , H01L24/95 , H01L2224/32057 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/73265 , H01L2224/83385 , H01L2224/85001 , H01L2224/85411 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85457 , H01L2224/85464 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15153 , H01L2924/15165 , H01L2924/157 , H01L2924/181 , H01L2924/19043 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.
摘要翻译：本发明涉及多排引线框架和半导体封装的结构和制造方法，其特征在于在金属材料上形成焊盘部分（第一步骤）; 在第一图案形成之后执行表面电镀工艺或有机材料涂层（第二步骤）; 在金属材料上形成第二图案（第三步骤）; 并且在第二图案形成之后封装半导体芯片（第四步骤），由此通过施加渐进蚀刻来最小化底切现象。

43. 发明申请

US20110028126A1 SYSTEM FOR MANAGING UNREGISTERED TERMINALS WITH SHARED AUTHENTICATION INFORMATION AND METHOD THEREOF 有权
标题翻译：使用共享认证信息管理未解决的终端的系统及其方法
公开(公告)号：US20110028126A1
公开(公告)日：2011-02-03
申请号：US12848555
申请日：2010-08-02
申请人： HanNa LIM , Sung Won Lee , Beom Sik Bae
发明人： HanNa LIM , Sung Won Lee , Beom Sik Bae
IPC分类号： H04W12/06
CPC分类号： H04W12/06 , H04L63/0853 , H04L63/0884 , H04W88/04
摘要： Provided are a system and method for managing unregistered devices with authentication information sharing. The method includes receiving an authentication information duplication request from the unregistered device by the registered device, obtaining authentication information from a Universal Subscriber Identity Module (USIM) by the registered device when the registered device receives the authentication information duplication request, and transmitting the obtained authentication information to the unregistered device by the registered device.
摘要翻译：提供了一种用于管理具有认证信息共享的未注册设备的系统和方法。该方法包括：由注册设备从未注册设备接收认证信息复制请求，当注册设备接收到认证信息复制请求时，由注册设备从通用用户识别模块（USIM）获取认证信息，并发送所获得的认证注册设备向未注册设备发送的信息。

44. 发明申请

US20110018715A1 RFID TAG-EMBEDDED CASINO CHIP 有权
标题翻译： RFID TAG-EMBEDDED CASINO芯片
公开(公告)号：US20110018715A1
公开(公告)日：2011-01-27
申请号：US12841765
申请日：2010-07-22
申请人： Sung Won Lee
发明人： Sung Won Lee
IPC分类号： G08B13/14
CPC分类号： G06K19/047
摘要： Disclosed is a Radio Frequency Identification (RFID) tag-embedded casino chip. The RFID tag-embedded casino chip includes an Integrated Circuit (IC) and an antennae connected to the IC. The RFID tag has a frequency which is equal to or greater than 20 MHz and is equal to or less than 25 MHz.
摘要翻译：公开了一种射频识别（RFID）标签嵌入式赌场芯片。 RFID标签嵌入式赌场芯片包括集成电路（IC）和连接到IC的天线。 RFID标签具有等于或大于20MHz并且等于或小于25MHz的频率。

45. 发明申请

US20050061300A1 Fuel pump assembly for vehicle 有权
标题翻译：车用燃油泵总成
公开(公告)号：US20050061300A1
公开(公告)日：2005-03-24
申请号：US10747914
申请日：2003-12-29
申请人： Sung Won Lee
发明人： Sung Won Lee
IPC分类号： F02M37/18 , B60K15/01 , F02M37/00 , F02M37/02 , F02M37/10 , F02M37/22 , F02M1/00
CPC分类号： F02M37/025 , F02M37/0029 , F02M37/0058 , F02M37/106 , F02M2037/228
摘要： A fuel pump assembly mounted in a fuel tank for sending fuel to a fuel injector includes a driving means for supplying a driving force for sending or returning fuel, a reservoir for temporarily reserving fuel from the fuel tank through a check valve mounted on a bottom portion thereof, a first fuel suction device for drawing fuel reserved in the reservoir, a return pipe for returning fuel from the fuel injector to the reservoir, a second fuel suction device for drawing fuel stored in the fuel tank, and a Z-nozzle portion of which an outlet is connected to a bottom portion of the reservoir. The second fuel suction device and return pipe are connected to an inlet of the Z-nozzle portion.
摘要翻译：安装在用于将燃料送到燃料喷射器的燃料箱中的燃料泵组件包括用于提供用于发送或返回燃料的驱动力的驱动装置，用于通过安装在底部上的止回阀从燃料箱临时保留燃料的储存器用于抽出储存在储存器中的燃料的第一燃料抽吸装置，用于将燃料从燃料喷射器返回到储存器的返回管，用于抽出储存在燃料箱中的燃料的第二燃料抽吸装置和Z 其出口连接到储存器的底部。第二燃料抽吸装置和回流管连接到Z喷嘴部分的入口。

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