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    • 44. 发明授权
    • Method of fabricating next-to-minimum-size transistor gate using
mask-edge gate definition technique
    • 使用掩模边缘栅极定义技术制造下一个最小尺寸晶体管栅极的方法
    • US6022815A
    • 2000-02-08
    • US775412
    • 1996-12-31
    • Brian S. DoyleChunlin LiangPeng ChengQi-De Qian
    • Brian S. DoyleChunlin LiangPeng ChengQi-De Qian
    • H01L21/033H01L21/28H01L21/3213H01L21/8234H01L21/3205
    • H01L21/32139H01L21/0337H01L21/0338H01L21/28132H01L21/823456
    • A method of fabricating minimum size and next-to-minimum size electrically conductive members using a litho-less process is disclosed. A substrate is provided, and a layer of gate dielectric material is formed on the substrate. A layer of electrically conductive material is formed over the gate dielectric material. A first mask is used to form a hard mask. A layer of first spacer material is deposited over the existing structures, and the layer of first spacer material is etched back to form spacers adjacent to the hard mask. The width of the first spacers determines the minimum size gate length. A layer of second spacer material is deposited over the existing structures, including the hard mask and first spacers. The layer of second spacer material is etched back to form a second set of spacers adjacent to the first spacers. The width of the first and second spacers together determine the next-to-minimum size gate length. A second mask is used to protect the portion of the second spacers which are to be used to define next-to-minimum size gates, and the unprotected second spacers and the hard mask are removed. The exposed electrically conductive material is removed. The remaining spacers are then removed, leaving minimum size and next-to-minimum size gates.
    • 公开了使用无平滑工艺制造最小尺寸和接下来尺寸的导电构件的方法。 提供衬底,并且在衬底上形成栅极电介质材料层。 在栅极电介质材料上方形成一层导电材料。 使用第一个掩模形成硬掩模。 在现有结构上沉积第一间隔物层,并且将第一间隔物材料层回蚀刻以形成与硬掩模相邻的间隔物。 第一间隔物的宽度决定了栅极长度的最小尺寸。 在现有结构上沉积第二间隔物层,包括硬掩模和第一间隔物。 第二间隔物材料层被回蚀刻以形成邻近第一间隔物的第二组间隔物。 第一和第二间隔物的宽度一起确定下一个至最小尺寸的栅极长度。 使用第二掩模来保护用于限定下一个至最小尺寸的门的第二间隔物的部分,并且去除未受保护的第二间隔物和硬掩模。 暴露的导电材料被去除。 然后移除剩余的间隔物,留下最小尺寸和下至最小尺寸的门。
    • 47. 发明申请
    • METHOD AND APPARATUS FOR PROVIDING A MULTI-DIMENSIONAL DATA INTERFACE
    • 用于提供多维数据接口的方法和装置
    • US20120271545A1
    • 2012-10-25
    • US13089870
    • 2011-04-19
    • Peng Cheng
    • Peng Cheng
    • G01C21/36
    • G06F1/169G06F1/1692G06F3/04815G06F3/0483G06F3/0488G06F2203/0339
    • Various methods for providing a multi-dimensional data interface are provided. One example method may include receiving first data navigation instructions for navigating data in a first dimension or a second dimension via a first user interface device, causing a presentation of the data to be modified within the first dimension or the second dimension in response to at least receiving the first data navigation instructions, receiving second data navigation instructions for navigating the data in a third dimension via a second user interface device, and causing the presentation of the data to be modified within a third dimension in response to at least receiving the second data navigation instructions. Similar and related example methods, example apparatuses, and example computer program products are also provided.
    • 提供了用于提供多维数据接口的各种方法。 一个示例性方法可以包括接收用于经由第一用户界面设备导航第一维度或第二维度中的数据的第一数据导航指令,以响应于至少在第一维度或第二维度中对数据进行修改 接收第一数据导航指令,接收用于经由第二用户界面设备导航第三维度中的数据的第二数据导航指令,并且响应于至少接收第二数据使得在第三维度内修改数据的呈现 导航说明。 还提供了类似的和相关的示例性方法,示例性装置和示例性计算机程序产品。
    • 48. 发明申请
    • Thermally Driven Heat Pump for Heating and Cooling
    • 用于加热和冷却的热驱动热泵
    • US20110259039A1
    • 2011-10-27
    • US12745168
    • 2008-11-26
    • Hongbin MaJoseph A. BoswellPeng Cheng
    • Hongbin MaJoseph A. BoswellPeng Cheng
    • F25B17/00F25B41/00
    • F25B1/08F25B15/02F25B2341/0011F25B2341/0015Y02A30/277Y02B30/62
    • A thermally driven heat pump includes a low temperature evaporator for evaporating cooling fluid to remove heat A first heat exchanger located at an outlet of a converging/diverging chamber of a first ejector receives a flow of primary fluid vapor and cooling fluid vapor ejected from the first ejector for condensing a portion of the cooling fluid vapor An absorber located in the first heat exchanger absorbs cooling fluid vapor into an absorbing fluid to reduce the pressure in the first heat exchanger A second heat exchanger located at an outlet of a converging/diverging chamber of a second ejector receives primary fluid vapor and cooling fluid vapor ejected from the second ejector for condensing the cooling fluid vapor and the primary fluid vapor A separator in communication with the second ejector, the low temperature evaporator and the primary fluid evaporator separates the primary fluid from the cooling fluid.
    • 热驱动热泵包括用于蒸发冷却流体以去除热量的低温蒸发器。位于第一喷射器的会聚/发散室的出口处的第一热交换器接收从第一喷射器喷射的主流体蒸气和冷却流体蒸汽的流动 用于冷凝冷却流体蒸气的一部分的喷射器位于第一热交换器中的吸收器将冷却流体蒸气吸收到吸收流体中以降低第一热交换器中的压力位于位于会聚/发散室的出口处的第二热交换器 第二喷射器接收从第二喷射器喷射的主要流体蒸汽和冷却流体蒸气,用于冷凝冷却流体蒸气和与第二喷射器连通的主流体蒸汽A分离器,低温蒸发器和主流体蒸发器将主流体从 冷却液。