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51. 发明申请

US20100193803A1 Stacked Micro Optocouplers and Methods of Making the Same 有权
标题翻译：堆叠式微光电耦合器及其制作方法
公开(公告)号：US20100193803A1
公开(公告)日：2010-08-05
申请号：US12365793
申请日：2009-02-04
申请人： Yong Liu , Yumin Liu
发明人： Yong Liu , Yumin Liu
IPC分类号： H01L25/16 , H01L21/98
CPC分类号： H01L31/167 , H01L31/0203 , H01L31/18 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49171 , H01L2924/10253 , H01L2924/00
摘要： Disclosed are packages for optocouplers and methods of making the same. An exemplary optocoupler comprises a substrate having a first surface and a second surface, a plurality of optoelectronic dice for one or more optocouplers disposed on the substrate's first surface, and a plurality of optoelectronic dice for one or more optocouplers disposed on the substrate's second surface. The substrate may comprise a pre-molded leadframe, and electrical connections between optoelectronic dice on opposite surfaces of the substrate may be made via one or more leads of the leadframe.
摘要翻译：公开了用于光耦合器的封装及其制造方法。示例性光耦合器包括具有第一表面和第二表面的衬底，用于设置在衬底第一表面上的一个或多个光耦合器的多个光电子管芯，以及用于设置在衬底第二表面上的一个或多个光耦合器的多个光电子管芯。衬底可以包括预成型的引线框架，并且可以通过引线框架的一个或多个引线来在衬底的相对表面上的光电子管芯之间的电连接。

52. 发明授权

US07768123B2 Stacked dual-die packages, methods of making, and systems incorporating said packages 有权
标题翻译：堆叠的双管芯封装，制造方法和结合所述封装的系统
公开(公告)号：US07768123B2
公开(公告)日：2010-08-03
申请号：US11861967
申请日：2007-09-26
申请人： Yong Liu , Howard Allen , Qiuxiao Qian , Jianhong Ju
发明人： Yong Liu , Howard Allen , Qiuxiao Qian , Jianhong Ju
IPC分类号： H01L23/34
CPC分类号： H01L24/06 , H01L23/3121 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/39 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/16145 , H01L2224/16225 , H01L2224/16245 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/37599 , H01L2224/45014 , H01L2224/45139 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83801 , H01L2224/8385 , H01L2224/83855 , H01L2224/85399 , H01L2224/92247 , H01L2225/0651 , H01L2225/06513 , H01L2225/06527 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H01L2924/0665 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2924/01049 , H01L2224/37099
摘要： A semiconductor die package. It includes a substrate having a first surface and a second surface, a first semiconductor die having its front surface facing the first surface of the substrate, a conductive adhesive disposed between the first semiconductor die and the first surface of the substrate, and a second semiconductor die located on the first semiconductor die. The front surface of second semiconductor die faces away from the first semiconductor die, and the back surface faces toward the first semiconductor die. A plurality of conductive structures electrically couple regions at the front surface of the second semiconductor die to conductive regions at the first surface of the substrate.
摘要翻译：半导体管芯封装。它包括具有第一表面和第二表面的衬底，第一半导体管芯，其前表面面向衬底的第一表面，设置在第一半导体管芯和衬底的第一表面之间的导电粘合剂，以及第二半导体位于第一半导体管芯上。第二半导体管芯的前表面远离第一半导体管芯，并且后表面朝向第一半导体管芯。多个导电结构将第二半导体管芯的前表面处的区域电耦合到衬底的第一表面处的导电区域。

53. 发明授权

US07750445B2 Stacked synchronous buck converter 有权
标题翻译：堆叠同步降压转换器
公开(公告)号：US07750445B2
公开(公告)日：2010-07-06
申请号：US11857199
申请日：2007-09-18
申请人： Yong Liu , Qiuxiao Qian , Honorio T. Granada, Jr.
发明人： Yong Liu , Qiuxiao Qian , Honorio T. Granada, Jr.
IPC分类号： H01L23/495
CPC分类号： H02M7/003 , H01L2224/73253 , H01L2924/13091 , H01L2924/00
摘要： A multichip module buck converter 10 has a high side power mosfet 12, a low side power mosfet 22 and a pre-molded leadframe 40 between the two mosfets for connecting the source of mosfet 12 to the drain of mosfet 22. Clips 14, 16, 18 and 26 carry the source, gate and drain terminals of the mosfet from planes parallel but spaced apart to a common plane.
摘要翻译：多片模块降压转换器10具有在两个mosfet之间的高侧功率MOSFET 12，低侧功率mosfet 22和预成型引线框40，用于将mosfet源12连接到mosfet 22的漏极。 18和26从平行但间隔开的平面的平面上携带mosfet的源极，栅极和漏极端子。

54. 发明申请

US20100109129A1 WAFER LEVEL BUCK CONVERTER 有权
标题翻译： WAFER LEVEL BUCK转换器
公开(公告)号：US20100109129A1
公开(公告)日：2010-05-06
申请号：US12262570
申请日：2008-10-31
申请人： Yong Liu , Qi Wang
发明人： Yong Liu , Qi Wang
IPC分类号： H01L23/50 , H01L21/60
CPC分类号： H01L23/481 , H01L21/6836 , H01L21/76898 , H01L24/83 , H01L25/074 , H01L2221/68327 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/00011 , H01L2924/01079 , H01L2924/13091 , H02M3/155 , H01L2224/29075 , H01L2924/00014
摘要： A buck converter module includes a high side (HS) die having source, drain, and gate bonding pads on a front side of the HS die, a low side (LS) die having a first section thereof with a plurality of through silicon vias (TSVs) extending from a back side to a front side of the LS die, the LS die having source, drain, and gate bonding pads located on a front side of a second section separate from the first section, the drain bonding pad electrically connected to the back side of the LS die in the second section. The HS die and the LS die are bonded together such that the source bonding pad of the HS die is electrically connected to the back side of the LS die, and each of the drain and gate bonding pads are electrically connected to separate TSVs in the LS die.
摘要翻译：降压转换器模块包括在HS模头的正面上具有源极，漏极和栅极接合焊盘的高侧（HS）裸片，具有第一部分的多个通孔硅通孔的低侧（LS）裸片 TSV），所述LS模具具有位于与所述第一部分分离的第二部分的前侧上的源极，漏极和栅极接合焊盘，所述漏极接合焊盘电连接到第二部分LS模具的背面。 HS管芯和LS管芯结合在一起，使得HS管芯的源极焊盘电连接到LS管芯的背面，并且漏极和栅极焊盘中的每一个电连接到LS中的分离TSV 死。

55. 发明授权

US07681799B2 Method of reading code symbols using a digital image capturing and processing system employing a micro-computing platform with an event-driven multi-tier software architecture 有权
标题翻译：使用采用具有事件驱动的多层软件架构的微计算平台的数字图像采集和处理系统来读取代码符号的方法
公开(公告)号：US07681799B2
公开(公告)日：2010-03-23
申请号：US11821739
申请日：2007-06-25
申请人： Xiaoxun Zhu , Yong Liu , Ka Man Au , Rui Hou , Hongpeng Yu , Xi Tao , Liang Liu , Wenhua Zhang , Anatoly Kotlarsky
发明人： Xiaoxun Zhu , Yong Liu , Ka Man Au , Rui Hou , Hongpeng Yu , Xi Tao , Liang Liu , Wenhua Zhang , Anatoly Kotlarsky
IPC分类号： G06K7/10
CPC分类号： G06F9/44526 , G06K7/10712 , G06K7/10732 , G06K7/10831 , G06K7/10851 , G06K7/10881 , G06K7/14 , G06K2207/1012
摘要： A method of reading code symbols using a digital image capture and processing system which includes: an image formation and detection subsystem; an illumination subsystem; an illumination control subsystem; a digital image processing subsystem; and an input/output subsystem; and a system control subsystem. In the illustrative embodiment, a micro-computing platform implements the digital image processing subsystem, the input/output subsystem and the system control subsystem. The micro-computing platform includes a microprocessor, a memory architecture, and a multi-tier modular software architecture responsive to the generation of a triggering event within the system. Triggering events can be generated by an automatic object detector or by a manually actuated trigger switch.
摘要翻译：一种使用数字图像捕获和处理系统读取码元的方法，包括：图像形成和检测子系统; 照明子系统; 照明控制子系统; 数字图像处理子系统; 和输入/输出子系统; 和系统控制子系统。在说明性实施例中，微计算平台实现数字图像处理子系统，输入/输出子系统和系统控制子系统。微计算平台包括微处理器，存储器架构和响应于系统内产生触发事件的多层模块化软件架构。触发事件可由自动对象检测器或手动触发开关产生。

56. 发明申请

US20100054223A1 Physical Layer Data Unit Format 有权
标题翻译：物理层数据单元格式
公开(公告)号：US20100054223A1
公开(公告)日：2010-03-04
申请号：US12548205
申请日：2009-08-26
申请人： Hongyuan Zhang , Rohit U. Nabar , Manyuan Shen , Songping Wu , Hui-Ling Lou , Yong Liu
发明人： Hongyuan Zhang , Rohit U. Nabar , Manyuan Shen , Songping Wu , Hui-Ling Lou , Yong Liu
IPC分类号： H04W4/00
CPC分类号： H04W16/28 , H04L25/03343 , H04L27/2613 , H04L2025/03426 , H04L2025/03789 , H04L2025/03815
摘要： In a wireless communication system wherein communication devices exchange information utilizing data units that conform to a first format, a beamforming training (BFT) data unit that conforms to a second format is transmitted, wherein a length of the BFT data unit is shorter than lengths supported by the first format, wherein the BFT data unit is for transmitting PHY beamforming training information. Information to indicate the BFT data unit conforms to the second format is transmitted to a receiving device. The BFT data unit is generated according to the second format, wherein the BFT data unit includes BFT information elements. The BFT data unit is then transmitted to the receiving device.
摘要翻译：在其中通信设备利用符合第一格式的数据单元交换信息的无线通信系统中，发送符合第二格式的波束形成训练（BFT）数据单元，其中所述BFT数据单元的长度短于所支持的长度通过第一格式，其中BFT数据单元用于发送PHY波束形成训练信息。用于指示符合第二格式的BFT数据单元的信息被发送到接收设备。 BFT数据单元根据第二格式生成，其中BFT数据单元包括BFT信息元素。然后将BFT数据单元发送到接收设备。

57. 发明授权

US07656848B2 Routing system and method in scatternet 有权
标题翻译：网络中的路由系统和方法
公开(公告)号：US07656848B2
公开(公告)日：2010-02-02
申请号：US10888024
申请日：2004-07-12
申请人： Jong-hun Park , Yong Liu , Myung-jong Lee
发明人： Jong-hun Park , Yong Liu , Myung-jong Lee
IPC分类号： H04J3/24
CPC分类号： H04W40/246 , H04L45/04 , H04W40/30 , H04W40/32
摘要： A routing requesting method to transmit data to a device of a different piconets in a scatternet including at least two piconets which have a master device and at least one slave device controlled by the master device. A source device generates as a single packet an information inquiring a first radio resource used in each device of the piconet and an information requesting the routing. The source device broadcasts the packet to adjacent devices. The adjacent device, which receives the generated packet, sends the packet to a destination device by repeating the above process. The destination device assigns itself the master device, generates a RREP message including a clock information, and sends the generated RREP message to an adjacent device. The source device becomes aware of devices along the route using the information contained in the RREP message.
摘要翻译：一种路由请求方法，用于向散域网中的不同微微网的设备发送数据，所述微网包括至少两个具有由主设备控制的主设备和至少一个从设备的微微网。源设备生成询问在微微网的每个设备中使用的第一无线电资源的信息和请求路由的信息作为单个分组。源设备将数据包广播到相邻设备。接收生成的分组的相邻设备通过重复上述过程将分组发送到目的地设备。目的设备自己分配主设备，生成包括时钟信息的RREP消息，并将生成的RREP消息发送给相邻设备。源设备使用包含在RREP消息中的信息来了解沿着路由的设备。

58. 发明申请

US20090315162A1 Micro-Modules with Molded Passive Components, Systems Using the Same, and Methods of Making the Same 审中-公开
标题翻译：具有成型被动元件的微型模块，使用其的系统及其制造方法
公开(公告)号：US20090315162A1
公开(公告)日：2009-12-24
申请号：US12143675
申请日：2008-06-20
申请人： Yong Liu , Yumin Liu , Terry Johnson , Doug Hawks
发明人： Yong Liu , Yumin Liu , Terry Johnson , Doug Hawks
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/3107 , H01L21/56 , H01L21/563 , H01L23/49589 , H01L23/498 , H01L23/49861 , H01L23/5222 , H01L2224/73203 , H01L2924/01079 , H01L2924/13091 , H01L2924/19041
摘要： Semiconductor die packages, methods of making said packages, and systems using said packages are disclosed. An exemplary package comprises at least one semiconductor die disposed on one surface of a leadframe and electrically coupled to at least one conductive region of the leadframe, and at least one passive electrical component disposed on the other surface of a leadframe and electrically coupled to at least one conductive region of the leadframe. Molding material is disposed over the at least one passive electrical component to provide a molded passive component.
摘要翻译：公开了半导体管芯封装，制造所述封装的方法和使用所述封装的系统。示例性封装包括设置在引线框架的一个表面上并电耦合到引线框架的至少一个导电区域的至少一个半导体管芯，以及设置在引线框架的另一个表面上的至少一个无源电气元件，引线框架的一个导电区域。成型材料设置在至少一个无源电气部件上，以提供模制的无源部件。

59. 发明申请

US20090278241A1 SEMICONDUCTOR DIE PACKAGE INCLUDING DIE STACKED ON PREMOLDED SUBSTRATE INCLUDING DIE 审中-公开
标题翻译：半导体芯片封装，包括在包括DIE的封装基板上堆叠的DIE
公开(公告)号：US20090278241A1
公开(公告)日：2009-11-12
申请号：US12117547
申请日：2008-05-08
申请人： Yong Liu , Yumin Liu , Duane Sorlie
发明人： Yong Liu , Yumin Liu , Duane Sorlie
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49562 , H01L23/49548 , H01L23/49575 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/49111 , H01L2224/49171 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor die package. The semiconductor includes a premolded substrate. The premolded substrate includes (i) a leadframe structure, (ii) a first semiconductor die comprising a first die surface and a second die surface, attached to the leadframe structure, and (iii) a molding material covering at least a portion of the leadframe structure and the first semiconductor die. The premolded substrate includes a first premolded substrate surface and a second premolded substrate surface. A second semiconductor die is stacked on the second premolded substrate surface of the premolded substrate. A housing material is on at least a portion of the second semiconductor die and the second premolded substrate surface of the premolded substrate. One of the first semiconductor die and the second semiconductor die includes a transistor while the other includes an integrated circuit.
摘要翻译：半导体管芯封装。半导体包括预成型基板。预成型衬底包括（i）引线框架结构，（ii）第一半导体管芯，其包括附接到引线框架结构的第一管芯表面和第二管芯表面，以及（iii）覆盖引线框架的至少一部分的成型材料结构和第一半导体管芯。预成型衬底包括第一预成型衬底表面和第二预成型衬底表面。第二半导体管芯被堆叠在预成型衬底的第二预成型衬底表面上。壳体材料位于第二半导体管芯的至少一部分和预成型衬底的第二预成形衬底表面上。第一半导体管芯和第二半导体管芯中的一个包括晶体管，而另一个包括集成电路。

60. 发明授权

US07611064B2 Digital image capture and processing system having automatic illumination measurement and control capabilities realized using a photodetector operating independently of the image sensing array, and an image-processing based illumination metering program for automatically adjusting the illumination duration of the system during object illumination and imaging operations 有权
标题翻译：具有自动照明测量和控制功能的数字图像捕获和处理系统，其使用独立于图像感测阵列的光电检测器实现，以及基于图像处理的照明计量程序，用于在对象照明和成像操作期间自动调整系统的照明持续时间
公开(公告)号：US07611064B2
公开(公告)日：2009-11-03
申请号：US11607115
申请日：2006-11-30
申请人： Xiaoxun Zhu , Yong Liu , Ka Man Au , Rui Hou , Hongpeng Yu , Xi Tao , Liang Liu , Wenhua Zhang , Anatoly Kotlarsky
发明人： Xiaoxun Zhu , Yong Liu , Ka Man Au , Rui Hou , Hongpeng Yu , Xi Tao , Liang Liu , Wenhua Zhang , Anatoly Kotlarsky
IPC分类号： G06K7/10
CPC分类号： G06F9/44526 , G06K7/10712 , G06K7/10732 , G06K7/10831 , G06K7/10851 , G06K7/10881 , G06K7/14 , G06K2207/1012
摘要： A digital-imaging based code symbol reading system comprising an image sensing array with a field of view (FOV), an illumination subsystem with an LED illumination array, an automatic illumination measurement subsystem, an illumination control subsystem, and programmed imager processor supporting an image-processing based illumination metering program. The automatic illumination measurement subsystem, employing a photodetector operating independently from the image sensing array, is used to automatically measure the illumination level at a particular region of the FOV and determine the illumination duration necessary to achieve a desired spatial intensity in the detected digital image. The illumination metering program automatically analyzes and measures, in real-time, the spatial intensity distribution of the digital image and determines whether or not a corrected illumination duration is required or desired when detecting the next or subsequent digital images, during the current or subsequent object illumination and imaging cycle. The previously determined illumination duration is over-written with the corrected illumination duration, which is used to drive the illumination subsystem and form and detect subsequent digital images of the illuminated object.
摘要翻译：一种基于数字成像的代码符号读取系统，包括具有视场（FOV）的图像感测阵列，具有LED照明阵列的照明子系统，自动照明测量子系统，照明控制子系统和支持图像的编程成像器处理器基于加工的照明计量程序。使用独立于图像感测阵列操作的光电检测器的自动照明测量子系统用于自动测量FOV的特定区域处的照明水平，并确定在检测到的数字图像中实现所需空间强度所需的照明持续时间。照明测光程序实时自动分析和测量数字图像的空间强度分布，并确定在当前或后续对象中检测下一个或后续数字图像时是否需要或期望校正的照明持续时间照明和成像周期。先前确定的照明持续时间被用修正的照明持续时间重写，该照明持续时间用于驱动照明子系统并形成和检测照射对象的后续数字图像。

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