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    • 53. 发明授权
    • Method and apparatus for defect analysis of semiconductor integrated circuit
    • 半导体集成电路缺陷分析方法与装置
    • US06828815B2
    • 2004-12-07
    • US10779905
    • 2004-02-17
    • Masahiro IshidaTakahiro YamaguchiYoshihiro Hashimoto
    • Masahiro IshidaTakahiro YamaguchiYoshihiro Hashimoto
    • G01R3126
    • G01R31/3004G01R31/3181
    • A fault analysis method and apparatus which is able to improve the reliability of fault analysis of semiconductor integrated circuit. In case of supplying a test pattern sequence having a plurality of test patterns to the semiconductor IC, an analysis point whose electric potential changes according to the change of supplied test pattern is placed corresponding to the test pattern sequence. Then, a transient power supply current generated on the semiconductor IC according to the change of the test pattern is measured and determined whether the measured transient power supply current is abnormal or not. A defection point is presumed based on the test pattern sequence where the transient power supply current is abnormal, and the analysis point placed corresponding to the test pattern sequence.
    • 一种能够提高半导体集成电路故障分析可靠性的故障分析方法和装置。 在向半导体IC提供具有多个测试图案的测试图案序列的情况下,根据所提供的测试图案的变化对其电位变化的分析点与测试图案序列相对应。 然后,测量根据测试图案的变化在半导体IC上产生的瞬态电源电流,并确定测量的瞬态电源电流是否异常。 基于瞬态电源电流异常的测试图案序列推测出缺点,并且对应于测试图案序列放置分析点。