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    • 55. 发明申请
    • A CONTINUOUSLY VARIABLE TRANSMISSION AND METHOD FOR CONTROLLING THE SAME
    • 一种连续可变的传输方法及其控制方法
    • WO2016145627A1
    • 2016-09-22
    • PCT/CN2015/074456
    • 2015-03-18
    • GM GLOBAL TECHNOLOGY OPERATIONS LLC
    • DUAN, ChengwuHUANG, Ying
    • F16H9/12F16H61/66
    • F16H9/125F16H9/12F16H61/66272F16H2061/66277
    • A continuously variable transmission (CVT) (14) includes a drive pulley (18), a driven pulley (20), and an endless rotatable device (22) coupled between the drive and driven pulleys (18, 20). The drive pulley (18) and the driven pulley (20) each include pulley teeth (19T, 21T), and the endless rotatable device (22) includes device teeth (22T). A controller (50) can control the operation of the CVT and can execute the following instructions: (a) receiving a torque request while the device teeth (22T) are mating with the pulley teeth (19T, 21T); (b) determining whether the torque request direction is opposite to the input torque direction; (c) determining whether a current clamping force applied by an actuator (28, 30) to the drive pulley (18) is sufficient to change the direction of the torque transmitted by the drive pulley (18); and (d) commanding the actuator (28; 30) to increase the current clamping force when the current clamping force is not sufficient to change the direction of the torque transmitted by the drive pulley (18).
    • 无级变速器(CVT)(14)包括驱动滑轮(18),从动滑轮(20)和联接在驱动和从动滑轮(18,20)之间的环形可旋转装置(22)。 驱动滑轮(18)和从动滑轮(20)各自包括滑轮齿(19T,21T),而环形旋转装置(22)包括装置齿(22T)。 控制器(50)可以控制CVT的操作,并可以执行以下指令:(a)当设备齿轮(22T)与滑轮齿(19T,21T)配合时接收扭矩请求; (b)确定转矩请求方向是否与输入转矩方向相反; (c)确定由致动器(28,30)施加到驱动滑轮(18)的当前夹紧力是否足以改变由驱动滑轮(18)传递的扭矩的方向; 以及(d)当所述电流夹紧力不足以改变由所述驱动滑轮(18)传递的扭矩的方向时,命令所述致动器(28; 30)增大所述夹紧力。
    • 57. 发明申请
    • SYSTEMS AND METHODS FOR ASSIGNING RESPONSIBILITY DURING TRAFFIC INCIDENTS
    • 在交通事故期间负责责任的系统和方法
    • WO2016138640A1
    • 2016-09-09
    • PCT/CN2015/073614
    • 2015-03-04
    • GM GLOBAL TECHNOLOGY OPERATIONS LLCZHANG, Wende
    • ZHANG, WendeDU, JiangDAI, XiaowenWANG, Peggy
    • G08G1/01G07C5/00B62D41/00
    • G08G1/0137B62D41/00G07C5/00G07C5/008G07C5/085G08G1/01G08G1/0112G08G1/0116G08G1/056
    • Systems and methods analyze inputs (110,120) from one or more sources, internal or external to a vehicle, to allocate responsibility of a vehicle during a traffic incident. The system (100) includes a controller (200) for implementing a computer-readable storage device comprising a set of predetermined fault rules that cause a processor (260) of the storage device to perform operations. The system (100) analyzes the inputs (110,120), using the processor (260), according to the predetermined fault rules. In one embodiment, the system (100) includes a processor (260) and a computer-readable storage device comprising instructions that cause the processor (260) to perform operations for providing context-based assistance to a vehicle user. The operations include, in part, the system (100) parsing information received from the inputs (110,120) that can be processed to allocate responsibility among individuals operating vehicles (10,20) involved in the incident.
    • 系统和方法分析来自车辆内部或外部的一个或多个来源的输入(110,120),以在交通事故期间分配车辆的责任。 系统(100)包括用于实现计算机可读存储设备的控制器(200),该计算机可读存储设备包括使得存储设备的处理器(260)执行操作的一组预定故障规则。 系统(100)根据预定的故障规则使用处理器(260)分析输入(110,120)。 在一个实施例中,系统(100)包括处理器(260)和计算机可读存储设备,其包括使处理器(260)执行用于向车辆用户提供基于上下文的帮助的操作的指令。 这些操作部分地包括系统(100)解析从输入(110,120)接收到的信息,该信息可被处理以在事件中涉及的个人操作车辆(10,20)之间分配责任。
    • 58. 发明申请
    • SYSTEMS AND METHODS FOR REINFORCED ADHESIVE BONDING
    • 用于增强粘合粘结的系统和方法
    • WO2015154347A1
    • 2015-10-15
    • PCT/CN2014/083103
    • 2014-07-28
    • GM GLOBAL TECHNOLOGY OPERATIONS LLCYANG, Xin
    • YANG, XinLI, YongqiangCARLSON, Blair E.WANG, Jeff
    • B32B7/12
    • B32B7/12B23K1/0008B23K1/20B23K35/0233B32B3/266B32B5/028B32B15/08B32B27/08B32B27/32B32B27/365B32B37/06B32B37/12B32B2255/06B32B2255/26B32B2262/103B32B2307/54B32B2307/542B32B2605/08H05K3/323H05K3/368H05K2203/041
    • The present disclosure relates to a bonding system (100) comprising an adhesive (200), comprising thermoplastic material, in contact with a first contact surface (115) and a second contact surface (125), and a plurality of solder particles (300) positioned in the adhesive (200) in contact with the first contact surface (115). Also, the present disclosure relates to a bonding method to produce a solder-reinforced adhesive bond joining a first substrate (110) and a second substrate (120), comprising applying, on a first contact surface (115) of the first substrate (110), an adhesive (200) comprising thermoplastic material, positioning, at least partially into the adhesive (200), each of a plurality of particles (300), such that each of the plurality of solder balls (300) contacts the first contact surface (115), connecting, to a portion of the adhesive (200) opposite the first contact surface (115), a second contact surface (125) of the second substrate (120), and applying heat to the first contact surface (115) such that each of the plurality of solder particles (300) reaches a solder bonding temperature.
    • 本公开涉及一种粘合系统(100),其包括与第一接触表面(115)和第二接触表面(125)接触的包含热塑性材料的粘合剂(200)和多个焊料颗粒(300) 定位在与第一接触表面(115)接触的粘合剂(200)中。 此外,本公开涉及一种用于生产连接第一基板(110)和第二基板(120)的焊料增强粘合剂粘结的接合方法,包括在第一基板(110)的第一接触表面(115) ),包括热塑性材料的粘合剂(200),至少部分地位于粘合剂(200)中,多个颗粒(300)中的每一个,使得多个焊球(300)中的每一个接触第一接触表面 (115)连接到与第一接触表面(115)相对的粘合剂(200)的一部分,第二基底(120)的第二接触表面(125),并且向第一接触表面(115)施加热量, 使得多个焊料颗粒(300)中的每一个达到焊接接合温度。
    • 59. 发明申请
    • SYSTEMS AND METHODS FOR REINFORCED ADHESIVE BONDING
    • 用于增强粘合剂的系统和方法
    • WO2015154271A1
    • 2015-10-15
    • PCT/CN2014/075034
    • 2014-04-10
    • GM GLOBAL TECHNOLOGY OPERATIONS LLCYANG, Xin
    • YANG, XinWANG, Jeff
    • C09J5/00
    • B23K31/02B23K2201/006B29C65/48B32B3/08B32B3/30B32B7/12B32B15/043B32B15/08B32B15/18B32B15/20B32B27/08B32B37/12B32B2264/105B32B2307/50B32B2307/54B32B2307/542B32B2605/00
    • A bonding system (100) comprises a first substrate (110) having a first contact surface (115) comprising a plurality of protuberances (130), a second substrate (120) having a second contact surface (125), an adhesive (200) in contact with the first contact surface (115) and the second contact surface (125), and a plurality of solder balls (300) positioned in the adhesive between the first contact surface (115) and the second contact surface (125). A bonding method to produce a solder-reinforced adhesive bond joining a first substrate (110) and second substrate (120), comprises applying an adhesive (200) on a first contact surface (115), of the first substrate (110), including a plurality of protuberances (130), positioning, at least partially into the adhesive (200), each a plurality of solder balls (300), and connecting, to a portion of the adhesive (200) opposite the first contact surface(115), a second contact surface (125).
    • 接合系统(100)包括具有包括多个突起(130)的第一接触表面(115)的第一基底(110),具有第二接触表面(125)的第二基底(120),粘合剂(200) 与所述第一接触表面(115)和所述第二接触表面(125)接触的多个焊球(300)和位于所述第一接触表面(115)和所述第二接触表面(125)之间的粘合剂中的多个焊球(300)。 一种用于产生连接第一基板(110)和第二基板(120)的焊料增强粘合剂粘合剂的接合方法,包括在第一基板(110)的第一接触表面(115)上施加粘合剂(200),包括 多个突起(130),至少部分地定位到所述粘合剂(200)中,每个多个焊球(300),并且连接到与所述第一接触表面(115)相对的所述粘合剂(200)的一部分, ,第二接触表面(125)。
    • 60. 发明申请
    • SYSTEMS AND METHODS FOR REINFORCED ADHESIVE BONDING
    • 用于增强粘合粘结的系统和方法
    • WO2015154236A1
    • 2015-10-15
    • PCT/CN2014/074945
    • 2014-04-09
    • GM GLOBAL TECHNOLOGY OPERATIONS LLCYANG, Xin
    • YANG, XinWANG, Jeff
    • H05K3/38
    • B32B7/12B23K1/0008B23K1/20B23K35/0233B32B3/266B32B5/028B32B15/08B32B27/08B32B27/32B32B27/365B32B37/06B32B37/12B32B2255/06B32B2255/26B32B2262/103B32B2307/54B32B2307/542B32B2605/08H05K3/323H05K3/368H05K2203/041
    • A bonding system (100), which comprises: a first substrate (110), a second substrate (120), an adhesive (200), in contact with a first contact surface (115) and a second contact surface (125), and a plurality of solder balls (300) positioned in the adhesive (200) in contact with the first contact surface (115). A bonding method to produce a solder-reinforced adhesive bond joining a first substrate (110) and a second substrate (120), which comprises: applying, on a first contact surface (115 ) of the first substrate (110 ), an adhesive (200), positioning, at least partially into the adhesive (200), each of a plurality of solder balls (300), such that each of the plurality of solder balls (300) contacts the first contact surface (115), connecting, to a portion of the adhesive (200) opposite the first contact surface (115 ), a second contact surface (125) of the second substrate (120), and applying heat to the first contact surface (115) such that each of the plurality of solder balls (300) reaches a solder-ball bonding temperature.
    • 一种接合系统(100),包括:第一基板(110),第二基板(120),与第一接触表面(115)和第二接触表面(125)接触的粘合剂(200),以及 定位在与第一接触表面(115)接触的粘合剂(200)中的多个焊球(300)。 一种用于产生连接第一衬底(110)和第二衬底(120)的焊料增强粘合剂结合的接合方法,其包括:在所述第一衬底(110)的第一接触表面(115)上施加粘合剂 200),至少部分地将多个焊球(300)中的每一个定位到粘合剂(200)中,使得多个焊球(300)中的每一个接触第一接触表面(115),连接到 与第一接触表面(115)相对的粘合剂(200)的一部分,第二基底(120)的第二接触表面(125),并且向第一接触表面(115)施加热量,使得多个 焊球(300)达到焊球接合温度。