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51. 发明申请

WO02052909A3 FLEXIBLE PRINTED CIRCUIT BOARD 审中-公开
标题翻译：柔性印刷电路板
公开(公告)号：WO02052909A3
公开(公告)日：2003-10-09
申请号：PCT/US0143249
申请日：2001-11-20
申请人： EMCORE CORP
发明人： ANDERSON GENE R , ARMENDARIZ MARCELINO G , BRYAN ROBERT P , CARSON RICHARD F , DUCKETT EDWIN B III , MCCORMICK FREDERICK B , PETERSON DAVID W , PETERSON GARY D , REYSEN BILL H
IPC分类号： G02B6/26 , G02B6/36 , G02B6/38 , G02B6/42 , H05K1/18
CPC分类号： H05K1/189 , G02B6/266 , G02B6/3885 , G02B6/4204 , G02B6/4206 , G02B6/4207 , G02B6/421 , G02B6/4212 , G02B6/4219 , G02B6/4221 , G02B6/4227 , G02B6/4239 , G02B6/4249 , G02B6/4253 , G02B6/4269 , G02B6/4277 , G02B6/4281 , G02B6/4283 , G02B6/4286 , H01L2224/48137 , H01L2924/3025 , H01L2924/00
摘要： This invention relates to a flexible printed circuit board (102) that is used in connection with an optical transmitter, receiver or transceiver module (100). In one embodiment, the flexible printed circuit board (102) has flexible metal layers in between flexible insulating layers, and the circuit board (102) comprises: (1) a main body region (306) orientated in a first direction having at least one electrical or optoelectronic device (308); (2) a plurality of electrical contact pads integrated into the main body region (306), where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region (304) extending from one end of the main body region (306); and (4) a head region (302)extending from one end of the buckle region (304), and where the head region (302) is orientated so that is at an angle relative to the direction of the main body region (306). The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip (108) may be adapted to the head region (302) of the flexible printed circuit board (102). In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board (102), and a window is formed in the head region (302) of the flexible printed circuit board (102). Optoelectronic devices (106) are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board (102).
摘要翻译：本发明涉及一种与光发射器，接收器或收发器模块（100）结合使用的柔性印刷电路板（102）。在一个实施例中，柔性印刷电路板（102）在柔性绝缘层之间具有柔性金属层，并且电路板（102）包括：（1）沿第一方向定向的主体区域（306），其具有至少一个电子或光电子器件（308）; （2）集成到主体区域（306）中的多个电接触焊盘，其中电接触焊盘用于将柔性印刷电路板连接到外部环境; （3）从主体区域（306）的一端延伸的带扣区域（304）; 和（4）从所述带扣区域（304）的一端延伸的头部区域（302），并且所述头部区域（302）被定向成相对于所述主体区域（306）的方向成一角度，。电接触焊盘可以是球栅阵列，焊球或焊盘阵列，并且它们用于将电路板连接到外部环境。驱动器或放大器芯片（108）可适用于柔性印刷电路板（102）的头部区域（302）。在另一个实施例中，散热器沿着柔性印刷电路板（102）的头部区域的表面通过，窗口形成在柔性印刷电路板（102）的头部区域（302）中。光电子器件（106）以这样的方式适于头吊具，使得它们可通过柔性印刷电路板（102）中的窗口接近。

52. 发明申请

WO03021300A2 OPTICAL ATTENUATING UNDERCHIP ENCAPSULANT 审中-公开
标题翻译：光学衰减软件包
公开(公告)号：WO03021300A2
公开(公告)日：2003-03-13
申请号：PCT/US0227342
申请日：2002-08-28
申请人： CORONA OPTICAL SYSTEMS INC
发明人： NELSON STEVEN , NOVACEK JANE E , WICKMAN RANDY
IPC分类号： G02B6/38 , G02B6/42 , G02B
CPC分类号： G02B6/4212 , G02B6/3882 , G02B6/4207 , G02B6/4221 , G02B6/4231 , G02B6/4246 , G02B6/4249 , G02B6/4292 , H01L2224/48091 , H01L2924/00014
摘要： A method and apparatus are provided for providing an electro-optic interface for exchanging information signals. The method includes the steps of disposing an optical array adjacent a first side of an optically transparent substrate, such that a plurality of transmission paths of the optical array pass directly through the substrate, applying an optically transparent underfill between the substrate and adjacent optical array with the plurality of transmission paths of the optical array passing directly through the underfill and coupling a plurality of optical signals of the optical array through the optically transparent underfill and optically transparent substrate between the optical array and an optical connector.
摘要翻译：提供了一种用于提供用于交换信息信号的电光接口的方法和装置。该方法包括以下步骤：在光学透明衬底的第一侧附近设置光学阵列，使得光学阵列的多个传输路径直接通过衬底，在衬底和相邻光学阵列之间施加光学透明的底部填充物，光学阵列的多个传输路径直接穿过底部填充物，并通过光学阵列和光学连接器之间的光学透明底部填充物和光学透明衬底耦合光学阵列的多个光学信号。

53. 发明申请

WO2002075415A2 OPTICAL DEVICE 审中-公开
标题翻译：光学装置
公开(公告)号：WO2002075415A2
公开(公告)日：2002-09-26
申请号：PCT/US2002/005412
申请日：2002-02-20
申请人： AVANTI OPTICS CORPORATION
发明人： CASE, Steven, K. , MOWRY, Gregory, S. , SKUNES, Timothy, A. , GARFIELD, Patrick, J. , MCELREATH, John, T. , KNIGHTON, Craig, D. , LENZ, Gary, A. , WILSON, Mark, L.
IPC分类号： G02B6/42
CPC分类号： G02B6/4236 , G02B6/255 , G02B6/2553 , G02B6/2555 , G02B6/32 , G02B6/362 , G02B6/3636 , G02B6/3652 , G02B6/3838 , G02B6/3873 , G02B6/4207 , G02B6/4221 , G02B6/4224 , G02B6/4225 , G02B6/4226 , G02B6/4227 , G02B6/4228 , G02B6/4231 , G02B6/4232 , G02B6/4238 , G02B6/4239
摘要： An optical device (10) is provided which includes a plurality of optical modules (12A, B). Each optical module (12A, B) includes an optical component (14A, B) fixedly coupled to a relative reference mount (18A, B). The relative reference mount (18A, B) is configured to attach to a substrate (20). A plurality of optical modules (12A, B) mount on the substrate (20) to form the optical device (10).
摘要翻译：提供一种包括多个光学模块（12A，B）的光学装置（10）。每个光学模块（12A，B）包括固定地耦合到相对参考座（18A，B）的光学部件（14A，B）。相对参考座（18A，B）被配置为附接到衬底（20）。多个光学模块（12A，B）安装在基板（20）上以形成光学装置（10）。

54. 发明申请

WO1993011453A1 HIGH SPEED ELECTRO-OPTICAL SIGNAL TRANSLATOR 审中-公开
标题翻译：高速电光信号转换器
公开(公告)号：WO1993011453A1
公开(公告)日：1993-06-10
申请号：PCT/US1992010522
申请日：1992-12-07
申请人： AMOCO CORPORATION
发明人： AMOCO CORPORATION , CHAMBERS, Frank, A. , KAUFMAN, R., Gilbert , SCHMIDT, Melvin, C. , RESSL, Michael, G. , KWASEGROCK, John, G.
IPC分类号： G02B06/42
CPC分类号： G02B6/4224 , G02B6/4201 , G02B6/4207 , G02B6/4216 , G02B6/4221 , G02B6/4226 , G02B6/424 , G02B6/4243 , G02B6/4245 , G02B6/4266 , G02B6/4286
摘要： An electro-optical signal translator, signal translator design features, methods of fabrication, alignment techniques and alignment apparatus that utilize, with the exception of output optical fiber to transmitter module coupling, passive assembly techniques that are compatible with assembly line operations to produce high performance electro-optical signal translators.

55. 发明专利

TWI578042B 光通訊模組組裝裝置有权
简体标题：光通信模块组装设备
公开(公告)号：TWI578042B
公开(公告)日：2017-04-11
申请号：TW102108139
申请日：2013-03-07
申请人：鴻海精密工業股份有限公司 , HON HAI PRECISION INDUSTRY CO., LTD.
发明人：賴志成 , LAI, CHIH CHEN
IPC分类号： G02B6/26
CPC分类号： B05C11/1005 , B05C11/1034 , G02B6/4221 , H05K13/0469 , H05K13/08

56. 发明申请

WO2017008112A1 WAVEGUIDE POSITIONING 审中-公开
标题翻译：波形定位
公开(公告)号：WO2017008112A1
公开(公告)日：2017-01-19
申请号：PCT/AU2016/050608
申请日：2016-07-13
申请人： THE UNIVERSITY OF SYDNEY
发明人： POWELL, Keith , YI, Xiaoke
IPC分类号： G01B11/00 , G02B6/24
CPC分类号： G02B6/24 , G02B6/4221 , G02B6/4227
摘要： A method (100) of determining a position of a waveguide (3), wherein the method comprises: projecting (110) a beam (7) of light towards the waveguide (3) to cast a shadow (9) such that the shadow (9) is detectable by multiple light sensors (13); receiving (120), from the multiple light sensors (13), a signal indicative of a size and position of the shadow (9); and determining (130) the position of the waveguide (3) in at least two dimensions based on the signal, wherein one dimension is along a path of the beam (7).
摘要翻译：一种确定波导（3）的位置的方法（100），其中所述方法包括：向所述波导（3）投射（110）光束（7）以投射阴影（9），使得阴影 9）可由多个光传感器（13）检测; 从多个光传感器（13）接收（120）指示阴影（9）的大小和位置的信号; 以及基于所述信号确定（130）所述波导（3）在至少两个维度中的位置，其中一个维度沿着所述梁（7）的路径。

57. 发明申请

WO2016201387A1 INTEGRATED TARGET WAVEGUIDE DEVICES AND SYSTEMS FOR OPTICAL COUPLING 审中-公开
标题翻译：集成目标波导装置和光耦合系统
公开(公告)号：WO2016201387A1
公开(公告)日：2016-12-15
申请号：PCT/US2016/037106
申请日：2016-06-11
申请人： PACIFIC BIOSCIENCES OF CALIFORNIA, INC.
发明人： WANG, Shang , FOQUET, Mathieu , LUNDQUIST, Paul , RULISON, Aaron , MCDONALD, Mark , HERRMANN, Ariel
IPC分类号： G02B6/26 , G02B6/34
CPC分类号： G02B6/124 , G01N21/03 , G01N21/6452 , G01N21/648 , G01N21/6486 , G01N21/774 , G01N2021/0346 , G02B6/34 , G02B6/4221 , G02B2006/12135
摘要： Integrated target waveguide devices and optical analytical systems comprising such devices are provided. The target devices include an optical coupler that is optically coupled to an integrated waveguide and that is configured to receive optical input from an optical source through free space, particularly through a low numerical aperture interface. The devices and systems are useful in the analysis of highly multiplexed optical reactions in large numbers at high densities, including biochemical reactions, such as nucleic acid sequencing reactions. The devices provide for the efficient and reliable coupling of optical excitation energy from an optical source to the optical reactions. Optical signals emitted from the reactions can thus be measured with high sensitivity and discrimination. The devices and systems are well suited for miniaturization and high throughput.
摘要翻译：提供了包括这种装置的集成目标波导装置和光学分析系统。目标器件包括光学耦合到集成波导的光耦合器，其被配置为从光源通过自由空间，特别是通过低数值孔径接口接收光输入。这些装置和系统可用于高密度高分复用的光学反应，包括生化反应，如核酸测序反应。这些器件提供了从光源到光学反应的光学激发能量的有效和可靠的耦合。因此，可以以高灵敏度和辨别度测量从反应发射的光信号。这些设备和系统非常适合小型化和高吞吐量。

58. 发明申请

WO2016124762A1 MINIATURIZED OCT PACKAGE AND ASSEMBLY THEREOF 审中-公开
标题翻译：微型OCT包装及其组装
公开(公告)号：WO2016124762A1
公开(公告)日：2016-08-11
申请号：PCT/EP2016/052549
申请日：2016-02-05
申请人： MEDLUMICS, S.L.
发明人： LLORET SOLER, Juan , SANCHO DURÁ, Juan , RUBIO GUIVERNAU, José Luis , MARGALLO BALBÁS, Eduardo , LANDLES, William Kennedy , CIFUENTES, Andrés , UNGAR, Blair , ZINOVIEV, Kirill
IPC分类号： G02B6/12 , G01B9/02 , A61B5/00
CPC分类号： G01B9/02051 , A61B5/0066 , A61B2562/0233 , A61B2562/228 , G01B9/02091 , G02B6/2766 , G02B6/29346 , G02B6/30 , G02B6/32 , G02B6/4221 , G02B6/4226 , G02B6/4251 , G02B6/4269 , G02B6/4271 , G02B6/4284 , G02B26/0833
摘要： A chip package includes a housing, one or more electrical connections coupled to an exterior of the housing, a photonic integrated circuit, and a scanning unit. Both the photonic integrated circuit and the scanning unit are disposed within the housing. The photonic integrated circuit has at least one waveguide designed to guide a beam of light. The scanning unit is designed to laterally scan the beam of light across a focal plane outside of the housing. The scanning unit is aligned with the photonic integrated circuit such that the beam of light is coupled between the photonic integrated circuit and the scanning unit.
摘要翻译：芯片封装包括壳体，耦合到壳体的外部的一个或多个电连接，光子集成电路和扫描单元。光子集成电路和扫描单元均设置在壳体内。光子集成电路具有至少一个设计用于引导光束的波导。扫描单元被设计成横向扫描穿过壳体外侧的焦平面的光束。扫描单元与光子集成电路对准，使得光束耦合在光子集成电路和扫描单元之间。

59. 发明申请

WO2015002520A1 수동광정렬을 위한 옵티컬블럭을 구비하는 광모듈 및 그 제조방법 审中-公开
标题翻译：具有被动光学对准的光学块的光学模块及其制造方法
公开(公告)号：WO2015002520A1
公开(公告)日：2015-01-08
申请号：PCT/KR2014/006067
申请日：2014-07-07
申请人： 엘에스엠트론 주식회사
发明人： 이승훈 , 김영호 , 우경녕 , 이익균 , 박건철
IPC分类号： G02B6/13
CPC分类号： G02B6/424 , G02B6/00 , G02B6/32 , G02B6/4204 , G02B6/4221 , G02B6/4227 , G02B6/423 , G02B6/4242 , G02B6/4255 , G02B6/4257 , G02B6/4274 , G02B6/43
摘要： 본 발명은 기기 내에서 보드 대용량 데이터 고속 전송 또는 기기 간 대용량 데이터 고속 전송을 위해 광소자, 광전송부재를 포함하여 모듈화하되, 모듈내부에서 광소자와 광전송부재 간에 광정렬을 완료함으로써 외부 PCB 기판에 실장시 발생될 수 있는 광정렬오차를 제거할 수 있는 광모듈에 관한 것으로, 광전송부재, 광전송부재(100)로 광소자(200), 기판(210), 광소자(200)와 외부회로간의 전극패드(220), 광전송부재장착부가 구비된 옵티컬블럭(300)를 포함하여 이루어지되, 광전송부재장착부는, 광축방향으로 옵티컬블럭상에 광전송효율이 최대가 되는 형성되는 것을 특징으로 하는 광 모듈을 제공한다. 또한, 상기 기판(210)의 일면에 상기 광소자(200)를 마운팅 및 실장하고, 광소자(200)의 광입출사포인트2차원평면상위치를 산출한 후, 기판(210) 위에 광소자(200)를 함입하도록 옵티컬블럭(300)의 모재(母材)를 형성하며, 이후, 모재 상에 전단계에서 산출된 광입출사포인트2차원평면상위치에 광전송부재장착부(310)를 성형하고, 광전송부재장착부(310)에 광전송부재(100)를 장착하는 과정을 갖는 광모듈의 제조방법을 제공한다.
摘要翻译：本发明涉及一种光模块，其中包括用于设备中的大容量数据高速传输的光学元件和光传输部件或装置之间的高容量数据高速传输，并且模块化，以及光学对准光学元件和光传输构件在模块内部完成，从而防止当光学模块安装在外部PCB基板上时可能产生的光学对准误差。光学模块技术领域本发明涉及一种光学模块，包括：光传输部件（100）; 作为光传输部件的光学元件（200）; 衬底（210）; 在所述光学元件（200）和外部电路之间的电极焊盘（220）以及设置有光传输部件安装部的光学块（300），其中，所述光传输部件安装部形成为使得光传输效率在光学块上的光轴方向上最大化。此外，本发明涉及一种光学模块的制造方法，该方法包括以下步骤：将光学元件（200）安装并安装在基板（210）的一个表面上; 计算所述光学元件（200）的光入射/出射点的二维平面上的位置; 形成光学块（300）的基材以将光学元件（200）嵌入在基板（210）上，然后在光的二维平面位置上形成光传输部件安装部（310）前一步计算的事件/出口点; 以及将所述光传输部件（100）安装在所述光传输部件安装部（310）上。

60. 发明申请

WO2014160596A1 OPTOELECTRONIC DEVICE AND METHOD OF ASSEMBLING AN OPTOELECTRONIC DEVICE 审中-公开
标题翻译：光电设备和组装光电器件的方法
公开(公告)号：WO2014160596A1
公开(公告)日：2014-10-02
申请号：PCT/US2014/031400
申请日：2014-03-21
申请人： CCS TECHNOLOGY, INC. , KOSSAT, Rainer Matthias
发明人： KOSSAT, Rainer Matthias
IPC分类号： G02B6/42
CPC分类号： G02B6/4202 , G02B6/362 , G02B6/4214 , G02B6/4221 , G02B6/4238 , G02B6/4239 , G02B6/424
摘要： An optoelectronic device and a method for assembling an optoelectronic device are provided which allow coupling of an optical fiber with less constructional complexity of the design of the optoelectronic device, thus reducing the effort for manufacturing the components of the optoelectronic device. To this end, an optoelectronic substrate (10) is mounted on a mounting surface (2A) of a mounting substrate (2) on edge, i.e. edgewise on one of its sidewalls; a coupling surface (15) of the optoelectronic device being oriented transverse to the mounting surface and thus directly facing the axial direction of the fiber endpiece (40) of an optical fiber. A fiber portion (42) arranged at a distance from the fiber endpiece contacts a glue droplet (25) arranged on or above the mounting surface of the mounting substrate. The optoelectronic device and the assembling method obviate the need for providing any further substrate pieces or substrate-like structural elements only for aligning purposes.
摘要翻译：提供了一种用于组装光电子器件的光电子器件和方法，其允许光纤耦合，具有较小的光电器件设计的结构复杂性，从而减少制造光电子器件的部件的努力。为此，将光电衬底（10）安装在边缘上的安装基板（2）的安装表面（2A）上，即在其一个侧壁上沿边缘安装; 光电子器件的耦合表面（15）横向于安装表面定向，因此直接面向光纤的光纤端部（40）的轴向。布置在与光纤端头一段距离的纤维部分（42）接触布置在安装基板的安装表面上或上方的胶滴（25）。光电子器件和组装方法消除了仅为了对准目的而提供任何另外的衬底片或衬底状结构元件的需要。

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