专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明公开

KR1020150024336A 액적의 절삭 방법 및 액적 단면의 분석 방법 审中-实审
标题翻译： DROPLET切割方法和DROPLET交叉分段分析方法
公开(公告)号：KR1020150024336A
公开(公告)日：2015-03-06
申请号：KR1020147035425
申请日：2013-06-12
申请人： 닛토덴코 가부시키가이샤
发明人： 마에노요헤이 , 가토미츠로 , 하라구치미카
IPC分类号： G01N1/06 , G01N1/28 , H01J37/31
CPC分类号： G01N1/286 , B26D7/08 , G01N1/04 , G01N1/42 , G01N2001/2873 , H01J37/32321 , H01J2237/31749 , Y10T83/041 , G01N1/06 , G01N1/28 , H01J37/31
摘要： 액적을 용이하게 절삭해서 단면을 노출시킬 수 있는 액적의 절삭 방법을 제공한다. 또한, 그러한 절삭 방법에 의해 절삭되어 노출된 단면을 분석하는 액적 단면의 분석 방법을 제공한다. 본 발명의 액적의 절삭 방법은, 액적을 절삭해서 단면을 노출시키는 방법이며, 복수의 카본 나노 튜브를 구비하는 카본 나노 튜브 집합체의 표면에 액적을 적재하고, 그 액적이 고화되는 온도 이하의 냉각 온도로 냉각하고, 그 액적을 절삭한다. 본 발명의 액적 단면의 분석 방법은, 본 발명의 액적의 절삭 방법에 의해 절삭되어 노출된 단면을 분석한다.

52. 发明专利

JP6405003B2 男性用電動シェーバ审中-公开
公开(公告)号：JP6405003B2
公开(公告)日：2018-10-17
申请号：JP2017130584
申请日：2017-07-03
申请人：ブラウンゲーエムベーハー
发明人：レナータバーガート , ソニヤジョルジェスク , ゲルドラスチンスキ , ダイアナカッペス , ヤンクリスチャンラングスドルフ
IPC分类号： B26B19/42
CPC分类号： B26B19/3873 , B26B19/382 , B26B19/388 , Y10T83/041

53. 发明专利

JP2014102147A Slicing device, slicing method and cell observation method of biological specimen 有权
标题翻译：切片装置，切片方法和生物样本细胞观察方法
公开(公告)号：JP2014102147A
公开(公告)日：2014-06-05
申请号：JP2012254175
申请日：2012-11-20
申请人： Dastech Inc , 株式会社ダステック , Tsukasa Matsumoto , 司松元
发明人： YOSHIDA SHUNJI , TAKAHASHI NOBUYUKI , MATSUMOTO TSUKASA
IPC分类号： G01N1/06 , C12Q1/02 , G01N1/28 , G01N1/30
CPC分类号： G01N1/06 , G01N1/42 , Y10T83/041 , Y10T83/283
摘要： PROBLEM TO BE SOLVED: To hold a cell in a live state and slice a work piece of a biological specimen.SOLUTION: A slicing device for slicing a work piece W of a biological specimen comprises: a substrate 4 on which a work piece W is placed: means for freezing and fixing the work piece W on the substrate 4; and a blade 1 for slicing the work piece W freezed and fixed on the substrate 4 by rotation in a fixed rotation direction r. The shape of the tip 11 of the blade 1 is a curve in which a distance from a rotating shaft C is monotonously increased from an end being the nearest point Pmin having a distance Rmin shortest from the rotating shaft C to the other end being the farthest point Pmax having a distance Rmax longest from the rotating shaft C. The farthest point Pmax is behind positioned in the rotation direction r from the nearest point Pmin, and the curve is convex on the opposite side of the rotating shaft C to a straight line Q connecting the nearest point Pmin and the farthest point Pmax.
摘要翻译：要解决的问题：将细胞保持在活状态并切片生物样品的工件。解决方案：用于切片生物样品的工件W的切片装置包括：基板4，工件W在其上放置：将工件W冷冻固定在基板4上的装置; 以及刀片1，用于通过沿固定旋转方向r旋转将工件W冷冻固定在基板4上。叶片1的尖端11的形状是从旋转轴C的距离从距离旋转轴C最短距离最远的距离Rmin最近的最近点Pmin的端部单调增加到最远的一端的曲线点Pmax距离旋转轴C最远的距离Rmax。最远点Pmax从最近点Pmin开始位于旋转方向r的后方，曲线在旋转轴C的相反侧成直线Q 连接最近点Pmin和最远点Pmax。

54. 发明专利

JP2014002123A Method for cutting droplet and method for analyzing cross section of droplet 审中-公开
标题翻译：切割液滴的方法和分析水滴交叉部分的方法
公开(公告)号：JP2014002123A
公开(公告)日：2014-01-09
申请号：JP2012139454
申请日：2012-06-21
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MAENO YOHEI
IPC分类号： G01N1/28
CPC分类号： G01N1/286 , B26D7/08 , G01N1/04 , G01N1/42 , G01N2001/2873 , H01J37/32321 , H01J2237/31749 , Y10T83/041
摘要： PROBLEM TO BE SOLVED: To provide a method for cutting a droplet, capable of easily cutting a droplet to expose a cross section thereof, and a method for analyzing the exposed cross section of the droplet cut by the method for cutting.SOLUTION: A droplet is placed on a surface of a carbon nanotube aggregate having a plurality of carbon nanotubes, and cooled to a cooling temperature at which the droplet solidifies, or lower. Then the droplet is cut. A method for analyzing a cross section of the droplet analyzes the cross section cut and exposed by the above cutting method of a droplet.
摘要翻译：要解决的问题：提供一种用于切割液滴的方法，其能够容易地切割液滴以暴露其横截面，以及用于分析通过切割方法切割的液滴的暴露横截面的方法。解决方案：液滴放置在具有多个碳纳米管的碳纳米管集合体的表面上，并冷却至液滴固化的冷却温度以下。然后液滴被切割。用于分析液滴的横截面的方法分析通过上述切割方法切割并暴露的液滴的截面。

55. 发明专利

JP3887394B2 Cleaving processing system and method of a brittle material 有权
公开(公告)号：JP3887394B2
公开(公告)日：2007-02-28
申请号：JP2005249928
申请日：2005-08-30
申请人：株式会社東芝 , 芝浦メカトロニクス株式会社
发明人：田慎二中 , 正和林 , 作進矢
IPC分类号： C03B33/09 , B28D5/00
CPC分类号： C03B33/093 , C03B33/033 , Y10T83/041 , Y10T225/12 , Y10T225/304 , Y10T225/321

56. 发明专利

JP2005252178A Method of and apparatus for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法和装置
公开(公告)号：JP2005252178A
公开(公告)日：2005-09-15
申请号：JP2004064222
申请日：2004-03-08
申请人： Toshiba Corp , 株式会社東芝
发明人： SHIMIZU NORIKO , KUROSAWA TETSUYA , TAKU SHINYA
IPC分类号： H01L21/301 , B28D5/00 , H01L21/78
CPC分类号： B28D5/0011 , B23K26/364 , B23K26/40 , B23K2201/40 , B23K2203/50 , H01L21/304 , H01L21/78 , Y10T83/041 , Y10T225/30
摘要： PROBLEM TO BE SOLVED: To provide a method of and an apparatus for manufacturing semiconductor devices which enhance the manufacturing yield and also reduce the time required for dividing process. SOLUTION: Regions that become the starting points for cleavage consisting of at least either a plurality of grooves 12-1, 12-2, 12-3, ... or through holes are formed on pelletizing lines or dicing lines along cleavage faces of a wafer 10 in which semiconductor elements are formed, and a liquid substance is poured into the regions that become the starting points for cleavage. An external factor that physically changes the liquid substance is applied to make the change, and by utilizing the change, the wafer 10 is cleaved to divide it into individual semiconductor chips 13-1, 13-2, 13-3, .... Since the wafer 10 can be cleaved collectively, without applying external forces, the dividing method enhances the manufacturing yield and reduces the time required for the dividing process. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种提高制造成品率并减少分割处理所需时间的半导体装置的制造方法和装置。解决方案：成为切割起点的区域由至少多个槽12-1,12-2,12-3，...或通孔中的至少一个形成，在切割线或切割线上沿切割形成其中形成有半导体元件的晶片10的表面，并且将液体物质注入到成为切割起点的区域中。施加物理地改变液体物质的外部因素以改变，并且通过利用该变化，晶片10被切割以将其分成单独的半导体芯片13-1,13-2,13-3，.... 由于可以在不施加外力的情况下集中地切割晶片10，所以分割方法提高了制造成品率，并且缩短了分割处理所需的时间。版权所有（C）2005，JPO＆NCIPI

57. 发明公开

KR1020110036834A 접착성 라벨 컷팅 장치 및 방법 无效
标题翻译：用于切割粘合标签的装置和方法
公开(公告)号：KR1020110036834A
公开(公告)日：2011-04-11
申请号：KR1020117003225
申请日：2009-07-14
申请人： 애브리 데니슨 코포레이션
发明人： 그린알란 , 베노잇데니스린
IPC分类号： B26D7/10 , B26F1/38 , B31D1/02
CPC分类号： B26D7/10 , B26D1/365 , B26D7/00 , B26D7/0006 , B26D7/08 , B26F1/384 , B26F1/44 , B26F2001/4427 , B31D1/021 , B31D1/026 , B32B37/08 , B32B38/0004 , B32B38/10 , B32B2309/105 , G09F2003/0267 , Y10T83/041 , Y10T83/0443 , Y10T83/0448 , Y10T83/263 , Y10T83/283 , Y10T156/1994
摘要： 라이너가 있는 감압성 접착성 라벨 스톡의 라이너가 얇은 또는 아주 얇은 라이너일 수 있는 라벨을 형성하기 위해 페이스스톡 및 접착제를 포함하고, 선택적으로 라이너를 포함하는 다이 컷팅 라벨 스톡을 위한 방법 및 장치가 제공된다.
摘要翻译：提供了一种用于模切标签原料的方法和装置，其包括面材，粘合剂和任选的衬垫，以形成标签，其中衬里压敏粘合剂标签原料的衬垫可以是薄的或超薄衬垫。

58. 发明公开

KR1020070105358A 봉을 전단하기 위한 전단장치를 포함하는 성형기계 无效
标题翻译：成型机包括用于剪切棒的剪切装置
公开(公告)号：KR1020070105358A
公开(公告)日：2007-10-30
申请号：KR1020077020960
申请日：2006-02-13
申请人： 하테부르 움포름마쉬넨 아크티엔게젤샤프트
发明人： 수터,마이클 , 스테멜린,파스칼
IPC分类号： B21K27/06 , B23D15/04
CPC分类号： B21K27/06 , B23D15/00 , B23D35/001 , Y10T83/04 , Y10T83/041 , Y10T83/412 , Y10T83/8769 , Y10T83/9447
摘要： The invention relates to a forming machine comprising a shearing device for shearing a bar (2, 20). Said shearing device comprises a fixed blade (11) with a passage (111) for permitting the insertion of the bar to be sheared (2, 20) and a shearing part (12) that can be displaced forwards and backwards in relation to the fixed blade (11). The shearing part (12) comprises a first shear blade (121), which is used to shear a bar section that projects from the fixed blade (11) when the shearing part (12) is displaced forwards and a second shear blade (122), which is used to shear a bar section (201) that projects from the fixed blade (11) when the shear part (12) is displaced backwards. In addition, the forming machine comprises a disposal point (8), to which the second shear blade (122) transports all the bar sections (201) it has sheared as scrap sections. As the second shear blade (122) exclusively shears scrap sections (201), empty points in the forming stations and the associated disadvantages can be avoided.
摘要翻译：本发明涉及一种成型机，其包括用于剪切杆（2,20）的剪切装置。所述剪切装置包括具有通道（111）的固定刀片（11），用于允许待剪切的杆（2,20）的插入和剪切部分（12），该剪切部分可相对于固定的刀片（11）。剪切部分（12）包括第一剪切刀片（121），当剪切部件（12）向前移位时，剪切刀片（121）用于剪切从固定刀片（11）突出的杆部分，以及第二剪切刀片（122），其用于当剪切部分（12）向后移位时剪切从固定刀片（11）突出的杆部分（201）。此外，成型机包括处理点（8），第二剪切刀片（122）将其剪切的所有条形部分（201）作为废料部分输送到该处理点。随着第二剪切刀片（122）专门剪切废料部分（201），可以避免成型站中的空位和相关的缺点。

59. 发明公开

KR1020060105480A 보호 테이프 절단 방법 및 이를 이용한 장치 无效
标题翻译：保护胶带切割方法和使用该方法的装置
公开(公告)号：KR1020060105480A
公开(公告)日：2006-10-11
申请号：KR1020060027775
申请日：2006-03-28
申请人： 닛토덴코 가부시키가이샤
发明人： 모리노리오 , 야마모또마사유끼
IPC分类号： B26F1/38 , B29C63/02 , H01L21/00
CPC分类号： B32B38/0004 , B26D7/10 , B26F1/3846 , B32B2457/14 , Y10T83/041 , Y10T156/1052 , Y10T156/108 , Y10T156/12 , Y10T156/1343 , Y10T156/1348
摘要： 제1 온도 제어 수단에 의해 커터날 냉각 수단을 조작하여 커터날에 내뿜는 냉각 공기의 온도나 유량 및 전열 히터에 의한 커터날의 가열을 조정하여 커터날을 상온 이하로 유지하면서 보호 테이프를 절단한다.
웨이퍼 반송 기구, 정렬 스테이지, 척 테이블, 보호 테이프, 공급 보빈

60. 发明公开

KR1020090116660A 제어된 전단 영역을 이용한 박막 층 전이 기법 有权
标题翻译：使用控制剪切区域的薄膜的层转移
公开(公告)号：KR1020090116660A
公开(公告)日：2009-11-11
申请号：KR1020090039968
申请日：2009-05-07
申请人： 실리콘 제너시스 코포레이션
发明人： 프랑수아제이.헨리
IPC分类号： H01L31/04
CPC分类号： H01L31/1804 , B26F3/004 , B26F3/16 , H01L21/76254 , H01L31/18 , Y10T83/041 , Y10T83/283
摘要： PURPOSE: A layer transfer of films utilizing controlled shear region is provided to improve productivity while reducing system energy consumption by removing an implantation process to form a cleave beginning region together with a peripheral area. CONSTITUTION: In a layer transfer of films utilizing controlled shear region, a surface region(1702) and peripheral area(1704) are formed on a substrate(1700). A cleave region(1706) is under the surface region, and the cleave area is a virtual plane and a layer which is under the surface at a predetermined depth d. A film is cleaved at the cleave area from the substrate, and a part of the peripheral area is associated with a certain pattern area of the surface region. A heat source with energy with a certain level is applied to the surface vertically.
摘要翻译：目的：提供利用受控剪切区域的膜的层转移，以通过去除植入工艺以与外围区域一起形成切割开始区域来降低系统能量消耗，从而提高生产率。构成：在利用受控剪切区域的膜的层转移中，在衬底（1700）上形成表面区域（1702）和外围区域（1704）。劈裂区域（1706）在表面区域下方，并且解理区域是虚拟平面，并且在预定深度d处的表面下方的层。在基板的切割区域处切割膜，并且周边区域的一部分与表面区域的某一图案区域相关联。具有一定水平能量的热源垂直施加在表面上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式