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    • 54. 发明申请
    • METHOD FOR DEPOSITING FINE-GRAINED ALUMINA COATINGS ON CUTTING TOOLS
    • 在切割工具上沉积细粒度的氧化铝涂层的方法
    • WO99027155A1
    • 1999-06-03
    • PCT/SE1998/002140
    • 1998-11-26
    • B23B27/14B23P15/28C23C16/12C23C16/40C23C16/503C23C16/513C23C16/515C23C16/50
    • C23C16/515C23C16/403
    • The present invention relates to a method for depositing refractory alumina (Al2O3) thin layers on cutting tools made of cemented carbide, cermet, ceramics or high speed steel. The invented method is a Plasma Activated Chemical Vapor Deposition (PACVD) process in which the plasma is produced by applying a bipolar pulsed DC voltage across two electrodes to which the tool substrates to be coated are fixtured and electrically connected. In contrast to prior art methods, built-up electrical charge on non-conducting surfaces is suppressed and hence, no arcing occurs on said surfaces. This will permit stable, long-term processing. With the invented method, high-quality coatings consisting of either single phase gamma -Al2O3 or of a mixture of gamma - and alpha -Al2O3 phases can be deposited on cutting tools at deposition temperatures as low as 500 DEG C. When coated cemented carbide tools according to the invention are used in the machining of steel or cast iron, several important improvements to prior art produced Al2O3- coated tools have been observed.
    • 本发明涉及一种在由硬质合金,金属陶瓷,陶瓷或高速钢制成的切削工具上沉积难熔氧化铝(Al2O3)薄层的方法。 本发明的方法是等离子体活化化学气相沉积(PACVD)工艺,其中通过在两个电极上施加双极性脉冲DC电压来产生等离子体,待涂覆的工具衬底固定到其上并电连接。 与现有技术的方法相比,在非导电表面上的积聚电荷被抑制,因此在所述表面上不发生电弧。 这将允许稳定的长期处理。 采用本发明的方法,可以在低至500℃的沉积温度下将单相γ-Al2O3或γ-α-Al2O3相的混合物组成的高品质涂层沉积在切削工具上。当涂覆硬质合金刀具 根据本发明用于钢或铸铁的加工中,已经观察到对现有技术生产的Al 2 O 3涂层工具的若干重要改进。
    • 60. 发明专利
    • Thin film forming method using atomic layer deposition method
    • 薄膜形成方法使用原子层沉积法
    • JP2008174842A
    • 2008-07-31
    • JP2008068427
    • 2008-03-17
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • KIN EIKANPARK YOUNG-WOOKLIM JAE-SOONCHOI SUNG-JELEE SANG-IN
    • C23C16/12C23C16/44C23C16/34C23C16/40H01L21/205H01L21/285H01L21/316
    • PROBLEM TO BE SOLVED: To provide a thin film forming method capable of producing a stoichiometrically excellent film by inhibiting formation of undesirable impurities in an atomic layer deposition method.
      SOLUTION: The thin film forming method using the atomic layer deposition method includes the steps of: injecting a first reactant containing a metallic element and a ligand in a reaction chamber and chemisorbing the first reactant on a substrate; purging the reaction chamber by an inert gas to remove the physisorbed first reactant; injecting a second reactant not containing a hydroxyl group in the reaction chamber so that oxygen of the second reactant and the metallic element are bound together by a chemical reaction of the first and second reactants, and the chemisorbed first reactant becomes a metal-oxygen atomic layer by separating the ligand from the first reactant; purging the reaction chamber by the inert gas to remove the physisorbed second reactant; and injecting a third reactant in the reaction chamber so that oxygen which is a constituting element of the third reactant and the metallic element are bound together by a chemical reaction of the remainder of the chemisorbed first reactant and the third reactant, and consequently forming a metal-oxide film in an atomic layer by making the remainder of the chemisorbed first reactant a metal-oxygen atomic layer by separating the ligand from the first reactant, with the generation of hydroxyl group held in an suppressed state.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 待解决的问题:提供能够通过在原子层沉积法中抑制不期望的杂质的形成而产生化学计量优异的薄膜的薄膜形成方法。 解决方案:使用原子层沉积方法的薄膜形成方法包括以下步骤:在反应室中注入含有金属元素和配体的第一反应物,并在基底上化学吸收第一反应物; 通过惰性气体吹扫反应室以除去物理吸附的第一反应物; 在反应室中注入不含羟基的第二反应物,使得第二反应物和金属元素的氧通过第一和第二反应物的化学反应而结合在一起,并且化学吸附的第一反应物变成金属 - 氧原子层 通过将配体与第一反应物分离; 通过惰性气体吹扫反应室以除去物理吸附的第二反应物; 以及在反应室中注入第三反应物,使得作为第三反应物的构成元素的氧和金属元素通过化学吸附的第一反应物和第三反应物的其余部分的化学反应而结合在一起,并因此形成金属 通过将配体与第一反应物分离,使化学吸附的第一反应物的其余部分成为金属 - 氧原子层,产生羟基保持在抑制状态,从而在原子层中形成氧化物膜。 版权所有(C)2008,JPO&INPIT