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61. 发明申请

US20140269797A1 SYSTEM FOR COOLING ELECTRONIC COMPONENTS 有权
标题翻译：冷却电子元件系统
公开(公告)号：US20140269797A1
公开(公告)日：2014-09-18
申请号：US13798266
申请日：2013-03-13
申请人： CHRISTIE DIGITAL SYSTEMS CANADA INC.
发明人： Michael BISHOP , Mirko STEVANOVIC
IPC分类号： H05K7/20 , H01S3/04
CPC分类号： H05K7/20354 , F25B25/005 , F25D19/00 , H01L23/473 , H01L2924/0002 , H01S3/0404 , H01S3/0407 , H05K7/202 , H01L2924/00
摘要： A system for cooling electronic components is provided, the system comprising: a first electronic component having a first operating temperature; a second electronic component having a second operating temperature greater than the first operating temperature; a vapour compression loop configured to cool the first electronic component to the first operating temperature; a pumped cooling loop configured to cool the second electronic component to the second operating temperature; and a heat exchanger between the vapour compression loop and the pumped cooling loop, the heat exchanger configured to transfer heat from the pumped cooling loop to the vapour compression loop before the second electronic component is cooled and after the first electronic component is cooled.
摘要翻译：提供一种用于冷却电子部件的系统，该系统包括：具有第一工作温度的第一电子部件; 第二电子部件，其具有大于第一工作温度的第二工作温度; 蒸汽压缩回路，被配置为将所述第一电子部件冷却至所述第一工作温度; 泵送冷却回路，其构造成将所述第二电子部件冷却至所述第二工作温度; 以及在所述蒸汽压缩回路和所述泵送冷却回路之间的热交换器，所述热交换器被配置为在所述第二电子部件被冷却之前以及在所述第一电子部件被冷却之后将热量从所述泵送的冷却回路传递到所述蒸气压缩回路。

62. 发明申请

US20130239597A1 VAPOR CYCLE CONVECTIVE COOLING OF ELECTRONICS 有权
标题翻译：电子蒸汽循环对流冷却
公开(公告)号：US20130239597A1
公开(公告)日：2013-09-19
申请号：US13418461
申请日：2012-03-13
申请人： Andre Mitchell
发明人： Andre Mitchell
IPC分类号： F25D31/00 , F25D17/06 , F28D15/00 , F25B1/00
CPC分类号： H05K7/20254 , F25B1/00 , F25B17/06 , F25B25/005 , F25B31/006 , F25B39/04 , H05K7/20318 , H05K7/20354 , H05K7/20509
摘要： A cold plate device and method for cooling electronic systems is provided including a generally flat thermally conductive body having a cooling channel within the thermally conductive body. A first cooling fluid travels through the cooling channel to remove heat from the conductive body. A vapor compression cycle system is coupled to the thermally conductive body such that the first cooling fluid removes heat from a second cooling fluid in a portion of the vapor compression cycle system.
摘要翻译：提供一种用于冷却电子系统的冷板装置和方法，其包括在导热体内具有冷却通道的大致平坦的导热体。第一冷却流体穿过冷却通道以从导电体移除热量。蒸汽压缩循环系统耦合到导热体，使得第一冷却流体在蒸气压缩循环系统的一部分中从第二冷却流体去除热量。

63. 发明申请

US20120255711A1 THERMAL ACCUMULATOR AND METHOD OF USE 有权
标题翻译：热累积器及其使用方法
公开(公告)号：US20120255711A1
公开(公告)日：2012-10-11
申请号：US13081644
申请日：2011-04-07
申请人： Michael J. Andres
发明人： Michael J. Andres
IPC分类号： F28D15/00 , F04B49/00
CPC分类号： B64D13/06 , B64D2013/0614 , B64D2013/0659 , B64D2013/0674 , F25B1/053 , F25B1/06 , F25B1/08 , F25B9/065 , F25B19/02 , F25B2341/001 , F25B2345/001 , F25B2345/002 , F25B2345/003 , F25B2345/004 , H05K7/20354 , Y02T50/56
摘要： A thermal management system for a vehicle includes a tank, a heat exchanger, a pump, and a valve located on a conduit. The heat exchanger is located downstream of the tank, the pump is located between the tank and the heat exchanger, and the valve is located downstream of the heat exchanger. The heat exchanger places the coolant in a heat exchange relationship with a heat load from the vehicle such that the coolant vaporizes. The valve regulates pressure within the heat exchanger and controls exhaustion of the vaporized coolant from the vehicle. Water, used as a coolant, can be replenished in flight by condensing a portion of the heat exchanger exhaust or condensing water as part of the environmental control system function or by condensing a portion of the engine exhaust.
摘要翻译：用于车辆的热管理系统包括罐，热交换器，泵和位于管道上的阀。热交换器位于罐的下游，泵位于罐和热交换器之间，阀位于热交换器的下游。热交换器使冷却剂与来自车辆的热负荷处于热交换关系，使得冷却剂蒸发。该阀调节热交换器内的压力并控制来自车辆的蒸发的冷却剂的耗尽。用作冷却剂的水可以在飞行中通过冷凝一部分热交换器排气或冷凝水作为环境控制系统功能的一部分或通过冷凝发动机排气的一部分来补充。

64. 发明授权

US08240165B2 Liquid cooling circuits and method for electrical cabinets, drawers, bays, modules, circuit boards and electrical components using quick-disconnect fittings for interfacing to a host cooling source 有权
标题翻译：用于电气柜，抽屉，托架，模块，电路板和电气部件的液体冷却回路和方法，使用快速断开接头与主机冷却源接口
公开(公告)号：US08240165B2
公开(公告)日：2012-08-14
申请号：US12178792
申请日：2008-07-24
申请人： Shlomo Novotny
发明人： Shlomo Novotny
IPC分类号： F25D23/12 , H05K5/00 , F28D1/06 , F28D15/00 , F28F7/00 , F28F27/02
CPC分类号： H05K7/20354 , F28D15/00 , F28F9/0246 , F28F9/0258
摘要： A system and method for cooling heat generating components including an electronics cooling circuit loop having a liquid heat exchanger separable from a main liquid cooling circuit manifold by quick-disconnect fittings. This supports the use of different liquids in the electronics subsystem cooling circuit loop and in the main liquid manifold of the master cooling circuit. Also included are two phase loops and an optional compressor.
摘要翻译：一种用于冷却发热部件的系统和方法，包括具有液体热交换器的电子冷却回路回路，所述液体热交换器通过快速断开配件与主液体冷却回路歧管分开。这支持在电子系统冷却回路环路和主冷却回路的主液体歧管中使用不同的液体。还包括两相回路和可选的压缩机。

65. 发明申请

US20100134981A1 Heat sink assembly having interdigitated cooling fins 有权
标题翻译：散热器组件具有交错散热片
公开(公告)号：US20100134981A1
公开(公告)日：2010-06-03
申请号：US12315381
申请日：2008-12-03
申请人： Mark L. Whittum , Christopher W. Helmke
发明人： Mark L. Whittum , Christopher W. Helmke
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20354 , H05K7/20372
摘要： A heat sink assembly including a first heat sink sub-assembly in thermal contact with a first heat source and including spaced apart columns of spaced horizontal fins extending outwardly from the first heat source, and a second heat sink sub-assembly in thermal contact with a second heat source and including spaced apart rows of space vertical fins extending outwardly from the second heat source, wherein the spaced apart columns of spaced horizontal and the spaced apart rows of spaced vertical fins are arranged in an interdigitated manner.
摘要翻译：一种散热器组件，包括与第一热源热接触的第一散热器子组件，并且包括从第一热源向外延伸的间隔开的水平翅片的间隔开的列，以及与第一散热器子组件热接触的第二散热器子组件第二热源并且包括从第二热源向外延伸的间隔开的空间垂直翅片排，其中间隔开的水平排列的间隔开的列和间隔开的间隔开的垂直翅片排以交错方式布置。

66. 发明申请

US20070163274A1 Method & arrangement for cooling a substrate, particularly a semiconductor 有权
标题翻译：用于冷却衬底，特别是半导体的方法和装置
公开(公告)号：US20070163274A1
公开(公告)日：2007-07-19
申请号：US10599261
申请日：2005-03-17
申请人： Walter Angels , Wolfgang Laufer , Siegfried Seidler
发明人： Walter Angels , Wolfgang Laufer , Siegfried Seidler
IPC分类号： F25D25/00
CPC分类号： H05K7/20354 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： In this method, a refrigerant (52) is compressed (32) in a refrigerating circuit, then condensed by cooling in a condenser (44), then expanded in a throttle valve (62) and delivered in the expanded state, in the form of wet vapor (52), to an evaporator (60) that is in thermally conductive contact with a substrate (12) to be cooled. The cooling process thus operates similarly to a liquid cooling process, but with a higher mean logarithmic heat transfer temperature difference, which allows lower temperatures of the substrate (12) to be achieved and makes possible a better heat transition coefficient, since the refrigerant is present as wet vapor. A corresponding arrangement is likewise described.
摘要翻译：在这种方法中，制冷剂（52）在制冷回路中被压缩（32），然后通过在冷凝器（44）中冷却而冷凝，然后在节流阀（62）中膨胀并以膨胀状态递送，形式为湿蒸汽（52）连接到与待冷却的基板（12）导热接触的蒸发器（60）。因此，冷却过程类似于液体冷却过程而工作，但是具有更高的平均对数传热温度差，这允许实现基板（12）的较低温度，并且由于存在制冷剂，所以可以获得更好的热转变系数作为湿蒸气。同样描述相应的布置。

67. 发明授权

US06519963B2 Semiconductor equipment and refrigerator 失效
标题翻译：半导体设备和冰箱
公开(公告)号：US06519963B2
公开(公告)日：2003-02-18
申请号：US09465272
申请日：1999-12-17
申请人： Shigenobu Maeda
发明人： Shigenobu Maeda
IPC分类号： F25D2312
CPC分类号： H05K7/20354 , F25B2600/07 , F25D11/02 , F25D25/025 , F25D29/00 , F25D2400/08 , F25D2400/36 , F25D2700/06 , H01L2924/0002 , H01L2924/00
摘要： A freezer (106) is provided with a connector (120) and connected to a semiconductor equipment (10). The connector (120) may include a connector for power supply (120a), a connector for data communication (120b) and a connector for analog signal (120c). Therefore, the semiconductor equipment (10) can transmit data and signal to the outside while being cooled in the freezer (106). With this constitution, a semiconductor equipment housed in a cooling system for high-speed operation and a refrigerator for cooling the semiconductor equipment are provided.
摘要翻译：冷冻器（106）设置有连接器（120）并连接到半导体设备（10）。连接器（120）可以包括用于电源的连接器（120a），用于数据通信的连接器（120b）和用于模拟信号的连接器（120c）。因此，半导体设备（10）可以在冷冻室（106）中被冷却的同时向外部发送数据和信号。利用该结构，设置容纳在用于高速运行的冷却系统中的半导体设备和用于冷却半导体设备的冰箱。

68. 发明授权

US06490877B2 Multi-load refrigeration system with multiple parallel evaporators 失效
公开(公告)号：US06490877B2
公开(公告)日：2002-12-10
申请号：US10073232
申请日：2002-02-13
申请人： Cullen E. Bash , Abdlmonem H Beitelmal , Ratnesh Sharma
发明人： Cullen E. Bash , Abdlmonem H Beitelmal , Ratnesh Sharma
IPC分类号： F25B500
CPC分类号： H05K7/20354 , F25B5/02 , F25B49/025 , F25B2341/0651 , F25B2341/0661 , F25B2341/0662 , F25B2600/025 , F25B2600/21 , F25B2700/21151 , F25B2700/2117 , G06F1/20 , G06F1/206 , H01L23/473 , H01L2924/0002 , Y02B30/72 , H01L2924/00
摘要： System and method for reducing temperature variation among heat dissipating components in a multi-component computer system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable speed compressor or a constant speed compressor is utilized to control the flow of refrigerant through the refrigeration system. The temperature variation among components is reduced by independently metering the mass flow rate of the refrigerant flowing into each component to compensate for the amount of heat load on each component. In this respect, the mass flow rate of the refrigerant entering into each of the evaporators is metered by valves located upstream from each of the evaporators. In another respect, the mass flow rate is metered by the above-described valves and a main valve provided on a secondary refrigerant line.

69. 发明申请

US20020100286A1 SEMICONDUCTOR EQUIPMENT AND REFRIGERATOR 失效
标题翻译：半导体设备和制冷机
公开(公告)号：US20020100286A1
公开(公告)日：2002-08-01
申请号：US09465272
申请日：1999-12-17
发明人： SHIGENOBU MAEDA
IPC分类号： G01K013/00 , F25B001/00 , F25B019/00
CPC分类号： H05K7/20354 , F25B2600/07 , F25D11/02 , F25D25/025 , F25D29/00 , F25D2400/08 , F25D2400/36 , F25D2700/06 , H01L2924/0002 , H01L2924/00
摘要： A freezer (106) is provided with a connector (120) and connected to a semiconductor equipment (10). The connector (120) may include a connector for power supply (120a), a connector for data communication (120b) and a connector for analog signal (120c). Therefore, the semiconductor equipment (10) can transmit data and signal to the outside while being cooled in the freezer (106). With this constitution, a semiconductor equipment housed in a cooling system for high-speed operation and a refrigerator for cooling the semiconductor equipment are provided.
摘要翻译：冷冻器（106）设置有连接器（120）并连接到半导体设备（10）。连接器（120）可以包括用于电源的连接器（120a），用于数据通信的连接器（120b）和用于模拟信号的连接器（120c）。因此，半导体设备（10）可以在冷冻室（106）中被冷却的同时向外部发送数据和信号。利用该结构，设置容纳在用于高速运行的冷却系统中的半导体设备和用于冷却半导体设备的冰箱。

70. 发明授权

US6052285A Electronic card with blind mate heat pipes 失效
标题翻译：电子卡与盲配热管
公开(公告)号：US6052285A
公开(公告)日：2000-04-18
申请号：US172555
申请日：1998-10-14
申请人： Vince P. Hileman
发明人： Vince P. Hileman
IPC分类号： H05K7/20
CPC分类号： H05K7/20354
摘要： An electronic assembly that includes a heat pipe that extends from an electronic card. The heat pipe has a condenser end that can be inserted into an elastic thermally conductive port of a manifold. The manifold may be part of a cooling system that removes heat from the condenser end of the heat pipe. The port may include a metal filled elastomeric material. The elastic characteristic of the material may accommodate for tolerances in the system and insure contact between the material and the heat pipe. The metal filler provides a thermal path from the heat pipe to the manifold. The elastic port allows the heat pipe to be coupled to the manifold without any fasteners.
摘要翻译：一种电子组件，包括从电子卡延伸的热管。热管具有可以插入歧管的弹性导热端口的冷凝器端。歧管可以是从热管冷凝器端排出热量的冷却系统的一部分。端口可以包括金属填充的弹性体材料。材料的弹性特性可适应系统的公差，并确保材料与热管之间的接触。金属填料提供从热管到歧管的热路径。弹性端口允许热管在没有任何紧固件的情况下联接到歧管。

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