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    • 61. 发明申请
    • MATERIAL COMPUESTO MULTIFUNCIONAL CON INTERCAPA VISCOELÁSTICA
    • 多功能复合材料,包括粘弹性层间隔层
    • WO2012089884A1
    • 2012-07-05
    • PCT/ES2011/070906
    • 2011-12-27
    • AIRBUS OPERATIONS, S.L.GUINALDO FERNÁNDEZ, EnriqueBLANCO VARELA, Tamara
    • GUINALDO FERNÁNDEZ, EnriqueBLANCO VARELA, Tamara
    • B32B27/00
    • B64C1/40B32B5/022B32B5/024B32B5/12B32B5/26B32B7/02B32B7/045B32B7/12B32B2260/023B32B2260/046B32B2262/101B32B2262/106B32B2307/102B32B2307/202B32B2307/558B32B2605/18Y10T428/24851Y10T428/24995Y10T428/249951
    • Estructura de material compuesto (1), que comprende una primera capa (10) continua del material compuesto (1), una segunda capa (20) capa de material visco-elástico, y una tercera capa (30) continua de protección contra impactos. La primera capa (10) está formada por componentes estructurales en forma de matriz (11) y de fibras (12). La segunda capa (20) de material visco-elástico está agregada sobre la primera capa (10), pudiendo ser dicha segunda capa (20) continua o discontinua. En el caso de ser discontinua, unos huecos (25), en forma de barras, círculos o cuadrados, se distribuyen en el seno de la segunda capa (20). Opcionalmente se disponen refuerzos (13) de nano-tubos o nano-fibras de carbono en cualquiera de las dos primeras capas (10, 20). La tercera capa (30) de material de protección contra impactos está agregada en forma continua sobre la segunda capa (20), siendo dicha tercera capa (30) la más exterior del material compuesto (1). Además, esta tercera capa (30) es conductora de corriente eléctrica. El material compuesto (1) tiene propiedades aptas para la amortiguación acústica, la resistencia al impacto y la conductividad eléctrica
    • 本发明涉及复合材料的结构,其包括复合材料(1)的连续第一层(10),粘弹性材料的第二层(20)和连续冲击保护第三层(30)。 第一层(10)由基体(11)和纤维(12)形式的结构部件形成。 粘弹性材料的第二层(20)被添加在第一层(10)的顶部上,并且所述第二层可以是连续的或不连续的。 如果使用非连续的第二层,则细长的圆形或方形空腔(25)被布置在所述层(20)的内部。 任选地,包含碳纳米纤维或纳米管的增强件(13)设置在第一和第二层(10,20)中的任一个中。 冲击保护材料的第三层(30)以连续的方式添加到第二层(20)的顶部,所述第三层(30)形成复合材料(1)的最外层。 此外,第三层(30)是导电的。 复合材料(1)具有噪声衰减,抗冲击性和导电性。
    • 66. 发明申请
    • METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRE BOARD
    • 制造多层印刷线路板的方法
    • WO1992022192A1
    • 1992-12-10
    • PCT/EP1992001133
    • 1992-05-19
    • AKZO N.V.MIDDELMAN, ErikZUURING, Pieter, Hendrik
    • AKZO N.V.
    • H05K03/46
    • H05K3/4655B32B37/12B32B2457/08H05K1/0366H05K3/386H05K3/4652H05K2201/0195H05K2201/0287H05K2203/0759Y10S428/901Y10T29/49126Y10T29/49146Y10T29/49158Y10T428/24917Y10T428/249951Y10T428/249994
    • A process for manufacturing a multilayer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate (8) based on a UD-reinforced synthetic material, provided on either side with traces (7), is combined with and bonded to a back-up substrate (9), wherein during the laminating process the back-up substrate (9) is added to the basic substrate, the back-up substrate (9) comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer (15), and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces (7) of the basic substrate (8), and the space between these traces is filled with the adhesive material, so bonding the basic substrate (8) and the back-up substrate (9).
    • 一种制造多层印刷线路板的方法,也被称为多层,其包括至少两个电绝缘基底,其中至少三个表面设有导电迹线或层,其中通过压力层压, 基于在两侧设置有迹线(7)的UD增强合成材料的固化的基底基板(8)与支撑基板(9)结合并结合到支撑基板(9)上,其中在层压工艺期间,支撑基板 (9)被添加到基本基板中,所述支撑基板(9)包括至少在面向基础基板的导电迹线的一侧上设置的UD增强的固化芯层,其具有仍然可塑性(可流动的)粘合剂层 (15),并且这样的压力施加在层压板上,以使支撑衬底的固化芯层与基底衬底(8)的导电迹线(7)接触或实际上接触,并且t 这些迹线之间的空间填充有粘合剂材料,从而粘结基底(8)和支撑基片(9)。
    • 68. 发明申请
    • STRUCTURAL ADHESIVE AND BONDING APPLICATION THEREOF
    • 结构粘合和粘结应用
    • WO2013070415A1
    • 2013-05-16
    • PCT/US2012/060975
    • 2012-10-19
    • CYTEC TECHNOLOGY CORP.
    • SANG, Junjie, JeffreyKOHLI, Dalip, KumarSHAH, Kunal, Gaurang
    • C08G59/42C08G59/50C09J163/00
    • C09J163/00B32B7/12B32B27/18B32B27/38B32B2250/03B32B2264/0207B32B2270/00B32B2405/00C08G59/4253C08G59/50C08G59/5026C08G59/5073C08K3/36C08L63/00C08L81/06Y10T428/24995Y10T428/249951Y10T428/249952Y10T428/254Y10T428/31515Y10T428/31522C08L51/04C08L101/00
    • A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200°F (93 °C). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler as a rheology/thixotropy modifying component. The weight ratio of part (A) to part (B) is within the range of 3:2 to 10:2. In another embodiment, the structural adhesive composition is based on a one-part system which includes the components of the resinous part (A) in the two-part system mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine. The one-part system is curable within the temperature range of 140-300°F (60-150°C). The paste adhesive disclosed herein has film-like properties and is particularly useful in rapid-assembly aerospace structure bonding applications.
    • 适用于金属和航空航天结构材料的高强度粘合的结构粘合剂组合物。 在一个实施方案中,基于两部分系统的结构粘合剂组合物,其可在或低于200°F(93℃)下固化。 两部分系统由树脂部分(A)和催化剂部分(B)组成,可以在室温下分开储存,直到准备使用。 树脂部分(A)包括至少两种具有不同官能度的功能性多官能环氧树脂,其中二官能,三官能和四官能环氧树脂,某些增韧组分和无机填料颗粒作为流变学/触变性改良组分。 增韧组分包括具有不同粒度的核 - 壳橡胶颗粒和弹性体聚合物和聚醚砜聚合物中的至少一种。 催化剂部分(B)包括作为固化剂的脂族或环状胺化合物和作为流变/触变性改性成分的无机填料。 部分(A)与部分(B)的重量比在3:2至10:2的范围内。 在另一个实施方案中,结构粘合剂组合物基于一部分系统,其包括与潜伏胺固化剂混合的两部分体系中的树脂部分(A)的组分。 单组分体系可以进一步包括咪唑和/或脂族胺。 单组分系统可在140-300°F(60-150°C)的温度范围内固化。 本文公开的糊状粘合剂具有膜状特性,并且在快速组装航空航天结构粘合应用中特别有用。