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71. 发明申请

US20230051550A1 Adhesive, Bonded Body, and Method for Producing Press-Bonded Body 有权
公开(公告)号：US20230051550A1
公开(公告)日：2023-02-16
申请号：US17788658
申请日：2020-12-15
申请人： Valqua, Ltd. , National Institute of Advanced Industrial Science and Technology
发明人： Yoshihiro Setoguchi , Naoki Watanabe , Takafumi Aizawa
IPC分类号： C09J127/12
摘要： An embodiment of the present invention relates to an adhesive, a bonded body or a method for producing a press-bonded body. The adhesive includes a fluoroelastomer and is for bonding base materials in the presence of carbon dioxide in a liquid state, a gas-liquid mixture state, or a nearly liquid state. The bonded body is such that two or more base materials are bonded to each other with the adhesive. The method for producing a press-bonded body includes a step 1 in which two or more base materials are press-bonded in the presence of the adhesive including a fluoroelastomer and carbon dioxide in a liquid state, a gas-liquid mixture state, or a nearly liquid state.

72. 发明授权

US11512411B2 PTFE sheet and method for mounting die 有权
公开(公告)号：US11512411B2
公开(公告)日：2022-11-29
申请号：US16767602
申请日：2018-11-28
申请人： SHINKAWA LTD. , VALQUA, LTD.
发明人： Osamu Watanabe , Tomonori Nakamura , Yoshihito Hagiwara , Yuji Kanai
IPC分类号： H01L23/00 , D01F6/12
摘要： A PTFE sheet in which PTFE fibers having a diameter of 1 μm or less are spun, the PTFE sheet having a Gurley value in the range of 1 s/100 cc/in2 to 3 s/100 cc/in2 and a shrinkage factor in a direction orthogonal to a sheet winding direction of no more than 10% when heated to 300° C. The PTFE sheet makes a die adsorbable via a tool, which is for heating the die when the die is mounted on a mounting body, by being sandwiched between the die and the tool, and suppresses the adhesion, to an adsorption surface of the tool or to the die, of an adhesion member for fixing the die to the mounted body. Through this configuration, a PTFE sheet capable of stabilizing vacuum adsorption and improving maintainability and a method for mounting a die are provided.

73. 发明授权

US11231108B2 Composite seal member 有权
公开(公告)号：US11231108B2
公开(公告)日：2022-01-25
申请号：US16479016
申请日：2018-01-24
申请人： Valqua, Ltd.
发明人： Sangho Kim , Michi Kuroda , Nobuhiro Yoshida , Ippei Nakagawa
IPC分类号： F16J15/10
摘要： Provided is a composite seal member that can maintain performance such as vacuum seal performance, plasma resistance, and corrosive gas resistance over a long period. The composite seal member is mounted in a seal groove provided in a body surface of a first member, and establishes a sealed state between the first member and a second member when the second member is moved closer toward the first member. The composite seal member includes a first seal member disposed on the side of a first side wall of the seal groove and made of an elastic member, and a second seal member disposed on the side of a second side wall of the seal groove and made of a material that is harder than the first seal member. The second seal member has at least a second side wall abutment surface that extends generally in parallel with and makes surface contact with the second side wall of the seal groove, and a seal abutment surface that extends generally in parallel with a seal surface of the second member, and that makes surface contact with the seal surface of the second member in the sealed state.

75. 发明授权

US11069651B2 Method of mounting die 有权
公开(公告)号：US11069651B2
公开(公告)日：2021-07-20
申请号：US16305393
申请日：2017-05-30
申请人： SHINKAWA LTD. , VALQUA, LTD.
发明人： Osamu Watanabe , Tomonori Nakamura , Yoshihito Hagiwara , Yuji Kanai
IPC分类号： H01L21/00 , H01L23/00 , H01L21/683
摘要： A method of mounting a die includes: preparing a die having a bump formation surface on which a plurality of bump electrodes are formed; disposing a vacuum suction tool having a suction surface above the die such that the suction surface faces toward the bump formation surface; sandwiching a porous sheet between the suction surface and the bump formation surface and suctioning the die by the vacuum suction tool; and mounting the die that has been suctioned by the vacuum suction tool in a bonding region of a substrate with an adhesive material interposed therebetween, the porous sheet having a thickness equal to or greater than the protrusion height of the bump electrodes on the bump formation surface. Stabilization and ease of maintenance of vacuum suction can thereby be improved.

76. 外观设计

USD923159S1 Seal member for use in semiconductor production apparatus 有权
公开(公告)号：USD923159S1
公开(公告)日：2021-06-22
申请号：US29714192
申请日：2019-11-21
申请人： Valqua, Ltd.
设计人： Yong-Gu Kang , Nobuhiro Yoshida

77. 外观设计

USD923158S1 Seal members for use in semiconductor production apparatus 有权
公开(公告)号：USD923158S1
公开(公告)日：2021-06-22
申请号：US29714184
申请日：2019-11-21
申请人： Valqua, Ltd.
设计人： Yong-Gu Kang , Nobuhiro Yoshida

78. 外观设计

USD922545S1 Seal member for use in semiconductor production apparatus 有权
公开(公告)号：USD922545S1
公开(公告)日：2021-06-15
申请号：US29714181
申请日：2019-11-21
申请人： Valqua, Ltd.
设计人： Yong-Gu Kang , Nobuhiro Yoshida

79. 外观设计

USD909323S1 Seal member for use in semiconductor production apparatus 有权
公开(公告)号：USD909323S1
公开(公告)日：2021-02-02
申请号：US35507485
申请日：2019-04-01
申请人： VALQUA, LTD.
设计人： Nobuhiro Yoshida , Ippei Nakagawa

80. 发明申请

US20210025497A1 SUPPORT MEMBER 有权
公开(公告)号：US20210025497A1
公开(公告)日：2021-01-28
申请号：US16934322
申请日：2020-07-21
申请人： VALQUA, LTD.
发明人： Kazuaki TSUJI , Takafumi SAKURAI
IPC分类号： F16J15/46 , F16J15/06 , F16J15/54 , F16J15/26
摘要： Provided is a support member attachable to a groove formed in an annular shape in a transport base, and the support member is to be attached to the groove for supporting an object to be transported. The support member includes: a held portion to be held in the groove; and a support portion formed in an annular shape for supporting the object to be transported at a position separated from the transport base with the held portion held in the groove. The held portion is pivotable in the groove to cause the support portion to incline with respect to the transport base.

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