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71. 发明授权

US3986919A Splice station for a heat seal film splicer 失效
标题翻译：热密封膜片分离器
公开(公告)号：US3986919A
公开(公告)日：1976-10-19
申请号：US576946
申请日：1975-05-12
申请人： Peter Andrews
发明人： Peter Andrews
IPC分类号： G03D15/04 , B31F5/00 , G03F1/00
CPC分类号： G03D15/043
摘要： A heat seal film splicer having a reciprocating heated splice head movable along a guide track between a first position wherein the splice head is adapted to cooperate with the guide track to cut off a length of heat activated splice tape and to apply heat and pressure to a splice and a second position away from the first position is provided with a means for thermally decoupling the splice head from the guide track when the splice head is in its second position.

72. 发明授权

US3980153A Motor vehicle oil drop pan apparatus device for indirectly saving lives and accidents on a highway 失效
公开(公告)号：US3980153A
公开(公告)日：1976-09-14
申请号：US467719
申请日：1974-05-07
申请人： Peter Andrews
发明人： Peter Andrews
IPC分类号： F16N31/00 , B62D25/20
CPC分类号： F16N31/006
摘要： At least an entirely upstanding walled receptacle apparatus device which has an entirely upstanding and surrounding walled receptacle that is removably secured in one embodiment or is hooked onto and also removably secured to at least one cross member or to at least one portion of a motor vehicle of the race car, automobile or car, truck, bus and boat type, and accordingly having at least one portion of oil or fluid drippings retained therein. The apparatus device is also for specific use in a boat type of non-highway used motor vehicle to prevent at least one portion of the inland waters from being oil polluted. The apparatus receptacle portion, in one of its embodiments, having and retaining therein at least one separate material for at least retaining one portion of the oil or fluid which drips therein from at least one portion of at least one of the above disclosed motor vehicles. The oil or fluid dripping being captured and generally retained in at least one portion of the receptacle portion of the apparatus and/or at least one portion of a separate material which is retained in the receptacle portion of the apparatus. The oil or fluid generally leaks or drips from, and even into the boat type of disclosed motor vehicles which have a defective oil or fluid gasket, seal and the like. The apparatus device substantially prevents the captured or dripped in fluid drippings from being spilled, ejected or dumped substantially out of a separate material retained in the apparatus' receptacle or substantially out of a separate nestable receptable subcombination which is retained on the apparatus' receptacle and onto, for example, a roadway's, race track's, highway's (car, truck and bus) travelling surface. Thereby, "summer icing" of the disclosed traveled surfaces and "viscous hydroplaning" of the motor vehicle's tires thereon, is substantially prevented, and especially when the motor vehicle's are abruptly started, stopped, curving or curving in and out at a high rate or speed or even merely travelling at a very high rate of speed.

73. 发明授权

US08138000B2 Methods for forming semiconductor light emitting devices and submounts 有权
标题翻译：用于形成半导体发光器件和底座的方法
公开(公告)号：US08138000B2
公开(公告)日：2012-03-20
申请号：US12397555
申请日：2009-03-04
申请人： Bernd Keller , James Ibbetson , Peter Andrews , Gerald H. Negley , Norbert Hiller
发明人： Bernd Keller , James Ibbetson , Peter Andrews , Gerald H. Negley , Norbert Hiller
IPC分类号： H01L21/00
CPC分类号： H01L33/507 , H01L25/167 , H01L2224/48091 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member and methods for forming the same are also provided.
摘要翻译：半导体发光器件的基座包括其中具有腔室的半导体衬底，其配置为接收发光器件。第一接合焊盘定位在空腔中以耦合到容纳在空腔中的发光器件的第一节点。第二接合焊盘定位在空腔中以耦合到定位在其中的发光器件的第二节点。还提供了包括固体波长转换元件的发光器件及其形成方法。

74. 发明授权

US07940069B2 System for testing semiconductors 有权
标题翻译：半导体测试系统
公开(公告)号：US07940069B2
公开(公告)日：2011-05-10
申请号：US12653574
申请日：2009-12-15
申请人： Peter Andrews , David Hess
发明人： Peter Andrews , David Hess
IPC分类号： G01R31/02
CPC分类号： G01R31/2891
摘要： A testing system that includes an plural imaging devices capturing plural video sequences from a single optical path and concurrently displaying the video sequences for effectively positioning a probe for testing a semiconductor wafer.
摘要翻译：一种测试系统，包括从单个光路捕获多个视频序列的多个成像装置并且同时显示用于有效地定位用于测试半导体晶片的探针的视频序列。

75. 发明申请

US20080099770A1 Integrated heat spreaders for light emitting devices (LEDs) and related assemblies 有权
标题翻译：用于发光器件（LED）和相关组件的集成散热器
公开(公告)号：US20080099770A1
公开(公告)日：2008-05-01
申请号：US11590480
申请日：2006-10-31
申请人： Nicholas W. Mendendorp , Peter Andrews
发明人： Nicholas W. Mendendorp , Peter Andrews
IPC分类号： H01L33/00
CPC分类号： H05K1/0206 , H01L33/62 , H01L33/64 , H01L33/647 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01019 , H01L2924/01025 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/1815 , H01L2924/3011 , H05K2201/09781 , H05K2201/10106 , H05K2203/049 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device (LED) assembly may include an electrically insulating substrate and a thermally conductive layer on a surface of the insulating substrate. A light emitting device may be on the thermally conductive layer so that the thermally conductive layer is between the light emitting device and the electrically insulating substrate. Moreover, the thermally conductive layer may extend beyond an edge of the light emitting device in at least one direction a distance greater than half of a width of the light emitting device.
摘要翻译：发光器件（LED）组件可以包括在绝缘衬底的表面上的电绝缘衬底和导热层。发光器件可以在导热层上，使得导热层位于发光器件和电绝缘衬底之间。此外，导热层可以在比发光器件的宽度的一半的距离的至少一个方向上延伸超过发光器件的边缘。

76. 发明授权

US07326583B2 Methods for packaging of a semiconductor light emitting device 有权
标题翻译：包装半导体发光器件的方法
公开(公告)号：US07326583B2
公开(公告)日：2008-02-05
申请号：US11044779
申请日：2005-01-27
申请人： Peter Andrews , Thomas G. Coleman , James Ibbetson , Michael Leung , Gerald H. Negley , Eric Tarsa
发明人： Peter Andrews , Thomas G. Coleman , James Ibbetson , Michael Leung , Gerald H. Negley , Eric Tarsa
IPC分类号： H01L21/00
CPC分类号： H01L33/58 , H01L33/52
摘要： Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.
摘要翻译：将半导体发光器件封装在具有位于其下侧和上侧壁之间的护城河的反射器中的方法，所述上壁和下侧壁限定反射腔，包括将密封剂材料分配到包括其中的发光器件的反射腔中以覆盖并且在反射腔中形成密封材料的凸弯月面，其从护城河的边缘延伸而不接触反射器的上侧壁。反射腔中的密封材料固化。还提供了用于其的封装的半导体发光器件和反射器。

77. 发明授权

US07279346B2 Method for packaging a light emitting device by one dispense then cure step followed by another 有权
标题翻译：通过一次分配来包装发光装置的方法然后固化步骤，然后是另一个
公开(公告)号：US07279346B2
公开(公告)日：2007-10-09
申请号：US11044126
申请日：2005-01-27
申请人： Peter Andrews , Thomas G. Coleman , James Ibbetson , Michael Leung , Gerald H. Negley , Eric Tarsa
发明人： Peter Andrews , Thomas G. Coleman , James Ibbetson , Michael Leung , Gerald H. Negley , Eric Tarsa
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/52 , H01L33/60 , H01L2924/181 , H01L2924/00012
摘要： Methods of packaging a semiconductor light emitting device positioned in a reflective cavity are provided. A first quantity of encapsulant material is dispensed into the reflective cavity including the light emitting device therein and the first quantity of encapsulant in the reflective cavity is cured. A second quantity of encapsulant material is dispensed onto the cured first quantity of encapsulant material. A lens is positioned in the reflective cavity on the dispensed second quantity of encapsulant material. The dispensed second quantity of encapsulant material is cured to attach the lens in the reflective cavity.
摘要翻译：提供了封装位于反射腔中的半导体发光器件的方法。第一量的密封剂材料被分配到包括其中的发光器件的反射腔中，并且反射腔中的第一量的密封剂被固化。将第二数量的密封剂材料分配到固化的第一量的密封剂材料上。透镜位于所分配的第二数量的密封剂材料的反射腔中。所分配的第二数量的密封剂材料被固化以将透镜附着在反射腔中。

78. 发明申请

US20070228387A1 Uniform emission LED package 有权
标题翻译：均匀排放LED封装
公开(公告)号：US20070228387A1
公开(公告)日：2007-10-04
申请号：US11398214
申请日：2006-04-04
申请人： Gerald Negley , Michael Leung , Maryanne Becerra , Eric Tarsa , Peter Andrews
发明人： Gerald Negley , Michael Leung , Maryanne Becerra , Eric Tarsa , Peter Andrews
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/54 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/58 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2924/00
摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.
摘要翻译：一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。表面包含基质密封剂并覆盖LED。靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。然后固化基质密封剂。

79. 发明申请

US20070034323A1 Systems for assembling components on submounts and methods therefor 有权
标题翻译：用于组装子系统组件的系统及其方法
公开(公告)号：US20070034323A1
公开(公告)日：2007-02-15
申请号：US11585515
申请日：2006-10-24
申请人： Norbert Hiller , Peter Andrews , David Slater , Gerald Negley
发明人： Norbert Hiller , Peter Andrews , David Slater , Gerald Negley
IPC分类号： B32B37/00
CPC分类号： H01L21/67144 , H01L21/67132 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T156/1089 , Y10T156/1097 , Y10T156/1707 , Y10T156/1712 , Y10T156/1734 , Y10T156/1744 , Y10T156/1911 , Y10T156/1978
摘要： A component assembly system is provided that includes a longitudinally elongated tape carrier, a longitudinally elongated submount carrier, and an assembly machine. A plurality of components may be attached to the tape carrier. The assembly machine is adapted to receiving the tape carrier, with the components attached thereto, and to receive the submount carrier. The assembly machine is further adapted to bring the tape carrier in close proximity to the submount carrier, and to attach the components to the submounts on the submount carrier.
摘要翻译：提供了一种部件组装系统，其包括纵向细长的带状载体，纵向细长的底座载体和组装机。多个部件可以附接到带载体。组装机适于接收带载体的带状载体，并接收底座载体。装配机还适于使带载体紧靠于底座托架，并将部件附接到副安装架托架上的底座上。

80. 发明申请

US20060266766A1 Fluid-dispensing apparatus with controlled tear-off and methods of using the same 有权
标题翻译：具有控制撕裂的流体分配装置及其使用方法
公开(公告)号：US20060266766A1
公开(公告)日：2006-11-30
申请号：US11138704
申请日：2005-05-26
申请人： Peter Andrews
发明人： Peter Andrews
IPC分类号： B67D5/30
CPC分类号： B05C11/1034
摘要： Fluid-dispensing apparatus include a fluid-dispensing needle. A gas discharge member is positioned proximate a dispensing end of the needle that is configured to direct a gas towards a fluid tear-off position below the dispensing end of the needle. A controller controls discharge of the gas by the gas discharge member to control dispensing of fluid from the needle. The dispensing control may control an amount of fluid dispensed from the needle and/or tailing off of fluid dispensed from the needle. The amount of fluid dispensed from the needle may be a microliter range volume of a viscous fluid.
摘要翻译：流体分配装置包括流体分配针。气体排出构件定位在针的分配端附近，其配置成将气体引导到针的分配端下方的流体撕开位置。控制器通过气体排出构件控制气体的排出，以控制从针头排出的流体。分配控制可以控制从针中分配的流体的量和/或从针头分配的流体的拖尾。从针头分配的流体的量可以是粘性流体的微升范围体积。

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