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81. 发明授权

US08826611B2 Structural glazing spacer 有权
标题翻译：结构玻璃间隔
公开(公告)号：US08826611B2
公开(公告)日：2014-09-09
申请号：US13337048
申请日：2011-12-23
申请人： Thomas A. Veilleux , James N. Gordon , Stewart B. Dittmeier
发明人： Thomas A. Veilleux , James N. Gordon , Stewart B. Dittmeier
IPC分类号： E06B3/00 , C03C27/04 , E06B3/56 , C09J7/02 , E06B3/54
CPC分类号： B32B37/1284 , B32B5/18 , B32B7/12 , B32B37/02 , B32B37/144 , B32B37/223 , B32B38/00 , B32B38/0008 , B32B38/0036 , B32B2038/0056 , B32B2305/022 , B32B2305/77 , B32B2307/748 , B32B2310/0409 , B32B2310/0831 , B32B2311/00 , B32B2315/08 , B32B2327/18 , B32B2375/00 , B32B2383/00 , B32B2398/00 , B32B2419/00 , C03C27/048 , C09J7/26 , C09J7/40 , E06B3/5427 , E06B3/56 , Y10T428/249983
摘要： A method of preparing a window module includes providing a metal frame having a first major surface, applying a structural glazing tape to the first major surface of the metal frame, and positioning a glass panel overtop the structural glazing tape. The structural glazing tape includes a polymer foam tape having first and second major surfaces, an adhesive layer overlying the first major surface for bonding the structural glazing tape to the structural frame, and a release layer overlying the second major surface. The method further includes filling a channel defined by the glass panel, the metal frame, and the structural glazing tape with a curable sealant, and curing the sealant to bond the glass panel and the metal frame together.
摘要翻译：一种制备窗户模块的方法包括提供具有第一主表面的金属框架，将金属框架的第一主表面施加结构玻璃带，并将玻璃面板定位在结构上光带上方。结构玻璃带包括具有第一和第二主表面的聚合物泡沫带，覆盖在第一主表面上用于将结构玻璃胶带粘结到结构框架上的粘合剂层和覆盖在第二主表面上的剥离层。该方法还包括用可固化密封剂填充由玻璃面板，金属框架和结构玻璃胶带限定的通道，并固化密封剂以将玻璃面板和金属框架结合在一起。

82. 发明授权

US08652606B2 Composite structures having composite-to-metal joints and method for making the same 有权
公开(公告)号：US08652606B2
公开(公告)日：2014-02-18
申请号：US12857835
申请日：2010-08-17
申请人： Kenneth Harlan Griess , Gary E. Georgeson
发明人： Kenneth Harlan Griess , Gary E. Georgeson
IPC分类号： B32B3/14 , B32B3/18
CPC分类号： B32B7/14 , B29C65/48 , B29C66/1248 , B29C66/43 , B29C66/71 , B29C66/721 , B29C66/7212 , B29C66/72141 , B29C66/72143 , B29C66/723 , B29C66/72321 , B29C66/742 , B29C70/86 , B29K2703/06 , B29L2031/30 , B29L2031/3002 , B29L2031/3076 , B32B3/06 , B32B3/14 , B32B3/18 , B32B5/26 , B32B5/28 , B32B7/12 , B32B15/01 , B32B15/14 , B32B37/02 , B32B2250/05 , B32B2250/20 , B32B2260/023 , B32B2260/046 , B32B2262/106 , B32B2305/076 , B32B2305/77 , B32B2307/714 , B32B2605/18 , B64C1/061 , C22C14/00 , Y02T50/43 , Y10T156/10 , Y10T428/19 , Y10T428/192 , Y10T428/195 , Y10T428/24752 , B29K2307/04 , B29K2309/08 , B29K2063/00
摘要： A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.

83. 发明申请

US20140044928A1 COMPOSITE AND METHODS OF MAKING AND USING THE SAME 有权
标题翻译：复合材料及其制备方法和使用方法
公开(公告)号：US20140044928A1
公开(公告)日：2014-02-13
申请号：US14054195
申请日：2013-10-15
申请人： Empire Technology Development LLC
发明人： Takahisa Kusuura
IPC分类号： B32B3/20 , B32B7/02
CPC分类号： D06M15/564 , B29C70/28 , B29D99/0089 , B29L2031/776 , B32B3/20 , B32B7/02 , B32B9/047 , B32B27/06 , B32B27/12 , B32B27/40 , B32B37/12 , B32B37/144 , B32B38/00 , B32B38/0008 , B32B2038/0056 , B32B2038/0088 , B32B2250/03 , B32B2305/77 , B32B2307/54 , B32B2307/718 , B32B2310/08 , B32B2398/00 , B32B2419/00 , Y10T428/24008 , Y10T428/24744 , Y10T428/2481 , Y10T428/24975 , Y10T428/249921 , Y10T442/3854 , Y10T442/674
摘要： Disclosed herein are composites as well as methods of making these composites. The composite may, for example, be used as light-weight, high-strength structural members and wall panels. In some embodiments, the composites can be prepared from a light-weight assembly using simple procedures. Also disclosed herein are assemblies for preparing the composites.
摘要翻译：本文公开了复合材料以及制备这些复合材料的方法。复合材料可以例如用作轻质，高强度的结构构件和墙板。在一些实施方案中，复合材料可以使用简单的方法由轻量组合物制备。本文还公开了用于制备复合材料的组件。

84. 发明申请

US20120114973A1 THERMAL PROCESSING AND CONSOLIDATION SYSTEM AND METHOD 有权
标题翻译：热处理和综合系统及方法
公开(公告)号：US20120114973A1
公开(公告)日：2012-05-10
申请号：US13290867
申请日：2011-11-07
申请人： Ronald M. JACOBSEN , Antonin PELC , Calvin D. BAMFORD, JR. , Terrance William COOKE , Victor Wayne CROSTON , Russell Carver WARRICK
发明人： Ronald M. JACOBSEN , Antonin PELC , Calvin D. BAMFORD, JR. , Terrance William COOKE , Victor Wayne CROSTON , Russell Carver WARRICK
IPC分类号： B32B27/00 , B32B15/00 , B32B15/04 , B32B15/01 , B32B18/00 , B32B5/02 , B32B15/02 , B29C35/02 , B32B17/02
CPC分类号： B29C70/00 , B29C31/006 , B29C35/02 , B29C35/0227 , B29C70/443 , B32B1/00 , B32B5/26 , B32B5/28 , B32B37/06 , B32B37/10 , B32B37/14 , B32B2250/20 , B32B2260/023 , B32B2260/046 , B32B2262/02 , B32B2262/101 , B32B2262/103 , B32B2262/105 , B32B2262/106 , B32B2305/076 , B32B2305/18 , B32B2305/77 , B32B2307/416 , B32B2605/08 , B32B2605/18 , B65B5/04 , Y10T29/49801 , Y10T29/53096 , Y10T29/53313 , Y10T428/12493 , Y10T428/12986 , Y10T428/239 , Y10T428/24992 , Y10T428/249921 , Y10T428/31678
摘要： A thermal processing and consolidation system is provided that includes an upper chamber assembly lower chamber assembly, layup and demolding station, transfer assembly, automatic or permanent coupling system, and controller. The upper and lower chamber assemblies are coupled to form an enclosed plenum operable to maintain a pressurized environment about a tool. The layup and demolding station receives the tool and facilitates the layup, bagging and sealing of unprocessed components at the tool. A transfer assembly accurately positions the tool on the lower chamber assembly in alignment with the upper chamber assembly. An automatic or permanent coupling system provides services to the tool and the enclosed plenum. A controller directs services to be supplied to the enclosed plenum and tool in accordance with a set of process parameters. This set of process parameters allows an individual set of unprocessed components to be thermally processed and consolidated.
摘要翻译：提供了一种热处理和固结系统，其包括上室组件下室组件，铺层和脱模站，传输组件，自动或永久耦合系统以及控制器。上室和下室组件联接以形成可操作以围绕工具保持加压环境的封闭的通风室。上料和脱模台接收工具，便于在工具上的未加工部件的上铺，装袋和密封。传送组件将工具精确地定位在下室组件上与上室组件对准。自动或永久连接系统为工具和封闭的通风室提供服务。控制器根据一组过程参数指示提供给封闭的通风室和工具的服务。该组过程参数允许单独的一组未处理组件进行热处理和加固。

85. 发明申请

US20100147431A1 POORLY AIR-PERMEABLE RUBBER LAMINATE COMPOSED OF POORLY AIR-PERMEABLE RESIN AND RUBBER COMPOSITION, AND METHOD FOR PRODUCTION THEREOF 有权
标题翻译：由不良透气性树脂和橡胶组合物组成的不良气体渗透性橡胶层及其制造方法
公开(公告)号：US20100147431A1
公开(公告)日：2010-06-17
申请号：US12088607
申请日：2006-09-29
申请人： Naoyuki Morooka
发明人： Naoyuki Morooka
IPC分类号： B60C5/14 , B32B27/28 , B32B1/08 , B32B37/02
CPC分类号： B60C5/14 , B29C47/0019 , B29C47/0021 , B29C47/065 , B29D30/0681 , B29D2030/0682 , B29L2030/008 , B32B1/08 , B32B25/08 , B32B27/08 , B32B27/30 , B32B27/34 , B32B37/025 , B32B2038/0076 , B32B2305/77 , B32B2307/7242 , B32B2307/748 , B60C1/0008 , Y10T428/1379 , Y10T428/265
摘要： A method for producing a laminate (E) of a low air permeable resin/rubber composition comprising: laminating a laminate (D) of a low air permeable resin (A) layer having an air permeation coefficient of 1.0×10−12 cc·cm/cm2·sec·cmHg or less and an average thickness d (μm) of 0.05
摘要翻译：一种低透气性树脂/橡胶组合物的层压体（E）的制造方法，其特征在于，具有层叠空气透过系数为1.0×10〜12cc·cm的低透气性树脂（A）层的层叠体（D）平均厚度d（μm）为0.05

86. 发明申请

US20060196599A1 Method of processing composite green sheet 失效
公开(公告)号：US20060196599A1
公开(公告)日：2006-09-07
申请号：US11361678
申请日：2006-02-24
申请人： Hisashi Satou
发明人： Hisashi Satou
IPC分类号： B32B38/04 , B32B37/26
CPC分类号： B23K26/18 , B23K26/382 , B23K26/40 , B23K2103/172 , B23K2103/30 , B23K2103/42 , B23K2103/50 , B32B38/04 , B32B2305/77 , B32B2310/0843 , B32B2315/02 , H05K1/0306 , H05K1/092 , H05K3/0029 , H05K3/007 , H05K3/4629 , H05K2201/0116 , H05K2203/0156 , Y10T83/0443 , Y10T83/0453 , Y10T83/0481 , Y10T156/1056 , Y10T156/1057
摘要： A composite green sheet which comprises a green sheet including an inorganic powder and an organic binder, and a conductive layer formed thereon is prepared; the composite green sheet is then placed on a supporting surface of a base member containing a liquid; and the composite green sheet is irradiated with a laser light so as to form a through hole according to need, and thereby to evaporate the liquid contained in the base member so that waste remaining on the inner wall surface of the through hole is cleaned and removed. As a result, the conductive layer is exposed at the inner wall of the through hole penetrating the conductive layer.

87. 发明申请

US20050161147A1 Burning equipment for green sheet of plasma display panel and method of burning the same 失效
标题翻译：等离子显示面板绿板燃烧设备及其燃烧方法
公开(公告)号：US20050161147A1
公开(公告)日：2005-07-28
申请号：US11050825
申请日：2005-01-27
申请人： Sang Kong , Jin Choi
发明人： Sang Kong , Jin Choi
IPC分类号： H01J9/02 , B32B37/00 , B32B37/06 , C03B29/00 , H01J11/22 , H01J11/24 , H01J11/34 , H01J11/36 , H01J11/38 , H01J11/42 , H01J11/44 , B32B31/00
CPC分类号： B32B37/0007 , B32B37/06 , B32B2038/168 , B32B2305/77 , Y10T156/1744
摘要： An apparatus for burning green sheets of a plasma display panel comprises a feeding part that feeds a green sheet to a plasma display panel substrate, a heat and pressure roller that heats and compresses the green sheet and the plasma display panel substrate from above the plasma display panel substrate, and a heating module that applies heat to a contact portion between the green sheet and the plasma display panel substrate. The heat and pressure roller applies heat and pressure to the green sheet to bring the green sheet into intimate contact with the plasma display panel substrate and to remove residual solvent from the green sheet.
摘要翻译：用于燃烧等离子体显示面板的生片的装置包括将生片供给到等离子体显示面板基板的供给部，从等离子体显示器的上方对生片和等离子体显示面板基板进行加热压缩的热压辊面板基板和对生片和等离子体显示面板基板之间的接触部分施加热量的加热模块。热压辊向生片施加热和压力，使生片与等离子体显示面板基板紧密接触，并从生片中除去残留的溶剂。

88. 发明申请

US20030203175A1 Greensheet carriers and processing thereof 失效
标题翻译：格林板载体及其加工
公开(公告)号：US20030203175A1
公开(公告)日：2003-10-30
申请号：US10411906
申请日：2003-04-11
申请人： International Business Machines Corporation
发明人： John U. Knickerbocker , Govindarajan Natarajan
IPC分类号： B32B003/00 , B32B009/00 , B32B003/02
CPC分类号： B32B18/00 , B32B37/22 , B32B38/04 , B32B2038/042 , B32B2305/38 , B32B2305/77 , C04B2237/341 , C04B2237/343 , C04B2237/366 , C04B2237/38 , C04B2237/50 , C04B2237/56 , C04B2237/561 , C04B2237/567 , C04B2237/62 , C04B2237/66 , C04B2237/68 , C04B2237/702 , C04B2237/704 , H01L21/4857 , H05K1/0306 , H05K3/00 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2203/0169 , Y10T156/1052 , Y10T156/1057 , Y10T156/108 , Y10T428/161 , Y10T428/23 , Y10T428/24793 , Y10T428/24926
摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that that the frame and greensheet side are substantially coplanar.
摘要翻译：处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工毛坯和粘合框架，并从加工的毛坯上移除框架。毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架一个其他图案化的毛坯和粘合框架，并且层压绿叶片。在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。框架与毛坯的接合可以通过层压或通过粘合剂或其它方式进行。优选地，框架具有小于毛坯厚度的厚度。框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。框架可以施加到毛坯的一侧，并被压入毛坯一侧，使得框架和毛坯侧面基本上是共面的。

89. 发明授权

US06607620B2 Greensheet carriers and processing thereof 失效
标题翻译：格林板载体及其加工
公开(公告)号：US06607620B2
公开(公告)日：2003-08-19
申请号：US09757071
申请日：2001-01-08
申请人： John U. Knickerbocker , Govindarajan Natarajan
发明人： John U. Knickerbocker , Govindarajan Natarajan
IPC分类号： B32B3118
CPC分类号： B32B18/00 , B32B37/22 , B32B38/04 , B32B2038/042 , B32B2305/38 , B32B2305/77 , C04B2237/341 , C04B2237/343 , C04B2237/366 , C04B2237/38 , C04B2237/50 , C04B2237/56 , C04B2237/561 , C04B2237/567 , C04B2237/62 , C04B2237/66 , C04B2237/68 , C04B2237/702 , C04B2237/704 , H01L21/4857 , H05K1/0306 , H05K3/00 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2203/0169 , Y10T156/1052 , Y10T156/1057 , Y10T156/108 , Y10T428/161 , Y10T428/23 , Y10T428/24793 , Y10T428/24926
摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that the frame and greensheet side are substantially coplanar.
摘要翻译：处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工毛坯和粘合框架，并从加工的毛坯上移除框架。毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架一个其他图案化的毛坯和粘合框架，并且层压绿叶片。在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。框架与毛坯的接合可以通过层压或通过粘合剂或其他方式进行。优选地，框架具有小于毛坯厚度的厚度。框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。框架可以施加到毛坯的一侧，并且被压入毛坯一侧，使得框架和毛坯面基本上共面。

90. 发明申请

US20030096085A1 GREENSHEET CARRIERS AND PROCESSING THEREOF 失效
标题翻译：绿色植物及其加工
公开(公告)号：US20030096085A1
公开(公告)日：2003-05-22
申请号：US09757071
申请日：2001-01-08
申请人： International Business Machines Corporation
发明人： John U. Knickerbocker , Govindarajan Natarajan
IPC分类号： B32B023/02
CPC分类号： B32B18/00 , B32B37/22 , B32B38/04 , B32B2038/042 , B32B2305/38 , B32B2305/77 , C04B2237/341 , C04B2237/343 , C04B2237/366 , C04B2237/38 , C04B2237/50 , C04B2237/56 , C04B2237/561 , C04B2237/567 , C04B2237/62 , C04B2237/66 , C04B2237/68 , C04B2237/702 , C04B2237/704 , H01L21/4857 , H05K1/0306 , H05K3/00 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2203/0169 , Y10T156/1052 , Y10T156/1057 , Y10T156/108 , Y10T428/161 , Y10T428/23 , Y10T428/24793 , Y10T428/24926
摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that that the frame and greensheet side are substantially coplanar.
摘要翻译：处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工毛坯和粘合框架，并从加工的毛坯上移除框架。毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架一个其他图案化的毛坯和粘合框架，并且层压绿叶片。在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。框架与毛坯的接合可以通过层压或通过粘合剂或其他方式进行。优选地，框架具有小于毛坯厚度的厚度。框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。框架可以施加到毛坯的一侧，并被压入毛坯一侧，使得框架和毛坯侧面基本上是共面的。

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