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81. 发明申请

WO2009075920A2 NON-DESTRUCTIVE COMPONENT SEPARATION USING INFRARED RADIANT ENERGY 审中-公开
标题翻译：使用红外辐射能量的非破坏性组件分离
公开(公告)号：WO2009075920A2
公开(公告)日：2009-06-18
申请号：PCT/US2008/076602
申请日：2008-09-17
申请人： BABCOCK & WILCOX TECHNICAL SERVICES Y-12, LLC , SIMANDL, Ronald, F. , RUSSELL, Steven, W. , HOLT, Jerrid, S. , BROWN, John, D.
发明人： SIMANDL, Ronald, F. , RUSSELL, Steven, W. , HOLT, Jerrid, S. , BROWN, John, D.
IPC分类号： G21K5/00
CPC分类号： B26F3/06 , B26F3/16 , B29C65/48 , B29C65/76 , B29C66/91216 , B29C66/91221 , C09J5/00 , C09J2205/302 , Y10T29/49821 , Y10T156/1158 , Y10T156/1917 , B29C65/00
摘要： A method for separating a first component and a second component from one another at an adhesive bond interface between the first component and second component. Typically the method involves irradiating the first component with infrared radiation from a source that radiates substantially only short wavelengths until the adhesive bond is destabilized, and then separating the first component and the second component from one another. In some embodiments an assembly of components to be debonded is placed inside an enclosure and the assembly is illuminated from an IR source that is external to the enclosure. In some embodiments an assembly of components to be debonded is simultaneously irradiated by a multi-planar array of IR sources. Often the IR radiation is unidirectional. In some embodiments the IR radiation is narrow-band short wavelength infrared radiation.
摘要翻译：一种用于在第一部件和第二部件之间的粘合剂接合界面处彼此分离第一部件和第二部件的方法。通常，该方法包括用来自辐射基本上只有短波长的源的红外辐射照射第一组分，直到粘合剂粘合不稳定，然后将第一组分和第二组分彼此分离。在一些实施例中，要脱离的部件的组件放置在外壳内，并且组件从外壳外部的IR源照射。在一些实施例中，待分离的部件的组件被IR平面阵列的IR源同时照射。 IR辐射通常是单向的。在一些实施例中，IR辐射是窄带短波长红外辐射。

82. 发明申请

WO2006098138A1 光学用粘着剤、粘着型光学フィルム、画像表示装置および粘着型光学フィルムの剥離方法审中-公开
标题翻译：用于光学应用的压敏粘合剂，压敏粘合剂光学膜，图像显示装置和用于粘合压敏粘合剂光学膜的方法
公开(公告)号：WO2006098138A1
公开(公告)日：2006-09-21
申请号：PCT/JP2006/303593
申请日：2006-02-27
申请人：日東電工株式会社 , 清水享 , 細川敏嗣 , 佐竹正之
发明人：清水享 , 細川敏嗣 , 佐竹正之
IPC分类号： G02B5/30 , C09J7/02 , C09J133/06 , G02F1/1335 , G02F1/13363 , G09F9/00
CPC分类号： C09J133/066 , C09J7/385 , G02B5/3025 , G02B5/3083 , G02F2202/28 , Y10T156/11 , Y10T156/1158 , Y10T156/1917 , Y10T428/28
摘要： A pressure-sensitive adhesive agent for optical use which comprises a base polymer having a functional group (F) and a coupling agent having a benzylester moiety being represented by the following general formula (1): (1) wherein A 1 and A 2 are functional groups being different from each other and either of A 1 and A 2 exhibits reactivity or interaction with the above functional group (F) of the base polymer, R 1 is an alkylene group having 1 to 12 carbon atoms and optionally having a substituent and/or a phenylene group, and R 2 and R 3 are a hydrogen atom or an alkyl group having 1 to 12 carbon atoms and they may be the same or different from each other. The above pressure-sensitive adhesive agent can be suitably used for a pressure-sensitive adhesive optical film or the like and is excellent in both durability and releasability.
摘要翻译：一种光学用压敏粘合剂，其包含具有官能团（F）的基础聚合物和具有苄基酯部分的偶联剂由以下通式（1）表示：（1）其中A < / SUP>和A <2>是彼此不同的官能团，A 1和A 2中的任一个表现出与上述的反应性或相互作用基础聚合物的官能团（F）R 1是具有1至12个碳原子并且任选具有取代基和/或亚苯基的亚烷基，R 2 O >和R 3是氢原子或具有1至12个碳原子的烷基，它们可以相同或不同。上述压敏粘合剂可以适用于粘合型光学薄膜等，并且耐久性和脱模性均优异。

83. 发明申请

WO2004006296A3 LAMINATE BODY AND CORRESPONDING METHODS AND APPARATUS 审中-公开
标题翻译：层压体和相应的方法和装置
公开(公告)号：WO2004006296A3
公开(公告)日：2005-04-07
申请号：PCT/US0317236
申请日：2003-06-02
申请人： 3M INNOVATIVE PROPERTIES CO , NODA KAZUKI , IWASAWA MASARU
发明人： NODA KAZUKI , IWASAWA MASARU
IPC分类号： B32B7/06 , B32B43/00 , C09K3/00 , H01L21/00 , H01L21/20 , H01L21/304 , H01L21/68
CPC分类号： B32B43/006 , B32B2457/14 , H01L21/2007 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/68381 , H01L2221/6839 , Y10S156/93 , Y10T156/1111 , Y10T156/1158 , Y10T156/1917 , Y10T156/1944
摘要： Provided is a laminated body (1) comprising a substrate (2) to be ground and a support (5), where the substrate (2) is ground to a very small thickness and can then be separated from the support (5) without damaging the substrate (2). One embodiment of the present invention is a laminated body (1) comprising a substrate (2) to be ground, a joining layer (3) in contact with the substrate (2) to be ground, a photothermal conversion layer (4) comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support (5). After grinding the substrate surface which is opposite that in contact with the joining layer (3), the laminated body (1) is irradiated through the light transmitting support (5) and the photothermal conversion layer (4) decomposes to separate the substrate (2) and the light transmitting support (5).
摘要翻译：提供了一种层叠体（1），其包括待研磨的基底（2）和支撑体（5），其中基底（2）被研磨成非常小的厚度，然后可以与支撑体（5）分离而不损伤基板（2）。本发明的一个实施方案是一种层叠体（1），其包括待研磨的基底（2），与待研磨的基底（2）接触的接合层（3），光热转换层（4）光吸收剂和可热分解树脂，以及透光支撑件（5）。在研磨与接合层（3）接触相反的基板表面之后，层叠体（1）通过透光性支撑体（5）照射，光热转换层（4）分解，分离基板（2））和透光支撑件（5）。

84. 发明公开

EP3307538A1 ON DEMAND RADIATION INDUCED CONSTRUCTIVE AND DECONSTRUCTIVE CHEMICAL REACTIONS 审中-公开
标题翻译：需求辐射诱导建立和表征化学反应
公开(公告)号：EP3307538A1
公开(公告)日：2018-04-18
申请号：EP16812214.1
申请日：2016-06-14
申请人： Immunolight, LLC.
发明人： FATHI, Zakaryae , PACANOVSKI, John , BOURKE, Frederic, A., Jr.
IPC分类号： B32B7/06 , B05D5/10 , B32B7/10 , B32B7/12 , B32B27/18 , B32B27/32
CPC分类号： C08J11/10 , B29B17/02 , B29B2017/0203 , B32B7/04 , B32B7/06 , B32B7/10 , B32B27/18 , B32B27/32 , B32B38/00 , B32B38/10 , B32B43/006 , B32B2037/1253 , B32B2310/0831 , B32B2310/085 , B32B2310/0887 , C08J2321/00 , Y02W30/622 , Y10T156/1158 , Y10T156/1917
摘要： A method is provided for decomposition of a polymeric article, wherein the polymeric article contains a polymer and one or more energy modulation agents, by applying an applied energy to the polymeric article, wherein the one or more energy modulation agents convert the applied energy into an emitted energy sufficient to cause bond destruction within the polymer.

85. 发明授权

EP2230683B1 Vorrichtung und Verfahren zum Ablösen eines Wafers von einem Träger 有权
标题翻译：装置和方法用于从载体分离的晶片
公开(公告)号：EP2230683B1
公开(公告)日：2016-03-16
申请号：EP09003874.6
申请日：2009-03-18
申请人： EV Group GmbH
发明人： Thallner, Erich
IPC分类号： H01L21/67 , B32B43/00
CPC分类号： B32B43/006 , H01L21/67092 , Y10S156/93 , Y10S156/931 , Y10S156/932 , Y10S156/941 , Y10S156/943 , Y10T156/1111 , Y10T156/19 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1967

86. 发明公开

EP2913654A1 SUBSTRATE RECOVERY DEVICE 有权
标题翻译： SUBSTRATRÜCKGEWINNUNGSVORRICHTUNG
公开(公告)号：EP2913654A1
公开(公告)日：2015-09-02
申请号：EP13849192.3
申请日：2013-10-04
申请人： Olympus Corporation
发明人： MORIMOTO, Nobuhiko
IPC分类号： G01N1/28 , G01N33/48 , G02B21/32 , G02B21/36
CPC分类号： G01N1/04 , B32B41/00 , B32B43/006 , B32B2310/0831 , G01N1/08 , G01N1/312 , G01N21/6456 , G01N2201/025 , G02B21/365 , Y10T156/1158 , Y10T156/1179 , Y10T156/19 , Y10T156/1917 , Y10T156/1983
摘要： The present invention provides a substrate collecting device (1) that includes a stage (3) on which a sheet (11) is placed with a plurality of substrates (2) facing downward, an acquiring section (4) which carries out a predetermined operation on some of the substrates (2), which are disposed at predetermined positions, from above the stage (3) thereby to cause the substrates (2) to come off from the sheet (11) and fall, an observation section (5) and a collecting section (7) disposed below the stage (3), and a moving mechanism (8), which integrally moves the observation section (5) and the collecting section (7) in a horizontal direction. The moving mechanism (8) is capable of positioning the observation section (5) and the collecting section (7) at two positions at which the observation section (5) or the collecting section (7) is positioned substantially vertically below a predetermined position.
摘要翻译：本发明提供了一种基板收集装置（1），其包括在其上放置有面向下的多个基板（2）的片材（11）的台（3），执行预定操作的获取部分（4）在从台架（3）的上方配置在预定位置的一些基板（2）上，从而使基板（2）从板材（11）脱落并落下，观察部（5）和设置在所述台架（3）的下方的收纳部（7）和使所述观察部（5）和所述收集部（7）沿水平方向一体移动的移动机构（8）。移动机构（8）能够将观察部分（5）和收集部分（7）定位在观察部分（5）或收集部分（7）基本垂直地位于预定位置的两个位置处。

87. 发明授权

EP2663739B1 PROCÉDÉ DE DÉSOLIDARISATION PAR INDUCTION D'UNE PIÈCE MÉCANIQUE MAGNÉTIQUE COLLÉE À UNE PIÈCE MÉCANIQUE. 有权
标题翻译：方法切割TOGETHER不对磁机械部件通过感应
公开(公告)号：EP2663739B1
公开(公告)日：2015-06-03
申请号：EP12702590.6
申请日：2012-01-06
申请人： Snecma
发明人： VARIN, Franck, Bernard, Léon
IPC分类号： F01D5/00
CPC分类号： B32B38/10 , B29C65/48 , B29C65/483 , B29C65/76 , B29C66/12461 , B29C66/301 , B29C66/53 , B29C66/532 , B29C66/721 , B29C66/742 , B29C73/34 , B29C2035/0811 , B29L2031/082 , F01D5/005 , F01D5/147 , F04D29/324 , F05D2240/303 , H05B6/105 , H05B6/14 , Y02T50/672 , Y10T156/1153 , Y10T156/1158 , Y10T156/1911 , Y10T156/1917

88. 发明公开

EP2499204A4 THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATALYTIC NANOPARTICLES 有权
标题翻译：热塑性涂层和它们之间的距离使用带有催化纳米粒子的结合界面
公开(公告)号：EP2499204A4
公开(公告)日：2013-12-25
申请号：EP10830395
申请日：2010-10-13
申请人： EMPIRE TECHNOLOGY DEV LLC
发明人： SJONG ANGELE
IPC分类号： C09D5/20 , C08J7/04 , C08J7/12 , C08J11/00 , C08K3/08 , C08K3/22 , C08K9/08 , C08L23/10 , C08L71/00 , C08L101/12 , C09D5/00 , C09D7/12 , C09D123/10
CPC分类号： B32B43/006 , B32B38/10 , C08J7/042 , C08J7/045 , C08J7/123 , C08K3/22 , C08K9/08 , C08L23/10 , C09D5/008 , C09D5/20 , C09D7/1225 , C09D7/1266 , C09D7/62 , C09D7/67 , C09D123/10 , Y10T156/1121 , Y10T156/1126 , Y10T156/1153 , Y10T156/1158 , Y10T156/1911 , Y10T156/1917 , Y10T156/1922 , Y10T156/1928 , Y10T428/25 , Y10T428/31504 , Y10T428/31678 , Y10T428/31938 , C08L2666/02
摘要： An article may be fabricated by coupling a thermoplastic to a bonding interface layer, and applying a coating layer to the surface of the bonding interface layer. A bonding interface layer may comprise catalytic nanoparticles embedded within and/or encapsulated by one or more radiatively unstable polymers. Application of ionizing radiation to the article may release a catalyst at the bonding interface. Application of heat and/or stress to the article may enhance catalytic degradation of the remaining bonding interface and uncoupling of the thermoplastic from the coating layer. Embodiments of methods, compositions, articles and/or systems may be disclosed.

89. 发明公开

EP2663739A1 PROCÉDÉ DE DÉSOLIDARISATION PAR INDUCTION D'UNE PIÈCE MÉCANIQUE MAGNÉTIQUE COLLÉE À UNE PIÈCE MÉCANIQUE. 有权
标题翻译：方法切割TOGETHER不对磁机械部件通过感应
公开(公告)号：EP2663739A1
公开(公告)日：2013-11-20
申请号：EP12702590.6
申请日：2012-01-06
申请人： Snecma
发明人： VARIN, Franck, Bernard, Léon
IPC分类号： F01D5/00
CPC分类号： B32B38/10 , B29C65/48 , B29C65/483 , B29C65/76 , B29C66/12461 , B29C66/301 , B29C66/53 , B29C66/532 , B29C66/721 , B29C66/742 , B29C73/34 , B29C2035/0811 , B29L2031/082 , F01D5/005 , F01D5/147 , F04D29/324 , F05D2240/303 , H05B6/105 , H05B6/14 , Y02T50/672 , Y10T156/1153 , Y10T156/1158 , Y10T156/1911 , Y10T156/1917
摘要： A method for disconnecting a first mechanical part from a second magnetic mechanical part, the first mechanical part being adhered to the second magnetic mechanical part by an adhesive film along a connecting area. In the method, a magnetic field is generated at least within the connecting area so as to generate, by induction, eddy currents in the second magnetic mechanical part, to soften the adhesive film and enable disconnection of the first and second mechanical parts.

90. 发明公开

EP2660851A1 Vorrichtung und Verfahren zum Ablösen eines Wafers von einem Träger 审中-公开
标题翻译： Vorrichtung und Verfahren zumAblöseneines Wafers von einemTräger
公开(公告)号：EP2660851A1
公开(公告)日：2013-11-06
申请号：EP13176985.3
申请日：2009-03-18
申请人： EV Group GmbH
发明人： Thallner, Erich
IPC分类号： H01L21/00 , H01L21/67 , B32B43/00
CPC分类号： B32B43/006 , H01L21/67092 , Y10S156/93 , Y10S156/931 , Y10S156/932 , Y10S156/941 , Y10S156/943 , Y10T156/1111 , Y10T156/19 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1967
摘要： Die Erfindung betrifft eine 1. Vorrichtung zum Lösen einer Verbindungsschicht (3) eines aus einem Träger (1) und einem Wafer (4) bestehenden Träger-Wafer-Verbundes (21) an einem Seitenrand (23) der Verbindungsschicht (3) mit
- einer Löseeinrichtung (16) zur Ausbildung eines Tauchbads zur Aufnahme des Träger-Wafer-Verbundes (21) mit:
a) einer Arbeitskammer (28), in der in einer Löseposition des Träger-Wafer-Verbundes (21) zumindest ein Umfangssektor des Seitenrandes (23) aufnehmbar ist und
b) Mitteln zum Einleiten eines Lösungsmittels zum Auflösen der Verbindungsschicht (3) an dem Seitenrand (23) des Träger-Wafer-Verbundes (21) und

- einer Rotationseinrichtung (5, 5w) zur Rotation des Träger-Wafer-Verbundes (21) in der Löseposition.
Weiterhin betrifft die Erfindung ein korrespondierendes Verfahren.
摘要翻译：该装置具有释放装置（16），其被配置为形成用于接收晶片载体网络（21）的浸没池。设置在晶片载体网络的释放位置的工作室（28）被配置为接收侧边缘（23）的外围扇区。引入溶剂以将粘合层（3）溶解在支撑晶片的侧边缘上。旋转装置（5,5W）构造成用于在释放位置中使载体晶片复合材料旋转。包括用于从载体剥离晶片的方法的独立权利要求。

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