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    • 3. 发明申请
    • DATA TRANSMITTING APPARATUS, DATA RECEIVING APPARATUS, COMMUNICATION SYSTEM, ERROR DETECTION METHOD AND PROGRAM
    • 数据发送装置,数据接收装置,通信系统,错误检测方法和程序
    • WO2006098498A1
    • 2006-09-21
    • PCT/JP2006/305753
    • 2006-03-16
    • NEC ELECTRONICS CORPORATIONHATAGUCHI, Takeshi
    • HATAGUCHI, Takeshi
    • H04L1/08
    • H04L1/08
    • The fact that erroneous data has been received is sensed easily even if the data has been received at an erroneous timing on the receiving side. A data transmitting apparatus includes a digital computation circuit for subjecting digital data to be transmitted to n (where n is an integer of 2 or greater) different exclusive-OR computations, an authentication-data add-on circuit for gathering the n items of computed data into one set of data, and a data transmitting circuit for transmitting the set of data to a data receiving apparatus. A data receiving apparatus includes a digital reverse computation circuit for subjecting the n items of computed data, which have been received via a data receiving circuit, to respective ones of computations (exclusive-OR computations) that are the reverse of the digital computations on the transmitting side, and an authentication-data detecting circuit for detecting error in the receive data based upon degree of agreement among the n items of receive data obtained by the reverse computations.
    • 即使已经在接收侧的错误定时接收到数据,也容易感测到已经接收到错误数据的事实。 数据发送装置包括数字计算电路,用于将数字数据发送到n(其中n是2或更大的整数)不同的异或运算;认证数据附加电路,用于收集计算出的n个项目 数据转换为一组数据,以及数据发送电路,用于将数据集发送到数据接收装置。 一种数据接收装置,包括一个数字反向计算电路,用于将已经经由数据接收电路接收到的n个计算数据项目对应于与数字计算相反的计算(异或运算) 以及认证数据检测电路,用于根据通过反向计算获得的n个接收数据之间的一致度来检测接收数据中的错误。
    • 7. 发明申请
    • MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    • 半导体基板的制造方法和半导体器件的制造方法
    • WO2008029607A1
    • 2008-03-13
    • PCT/JP2007/066075
    • 2007-08-13
    • NEC Electronics CorporationKATOU, Hiroaki
    • KATOU, Hiroaki
    • H01L21/762H01L21/322
    • H01L21/76256H01L21/02052H01L21/3226
    • To provide a manufacturing method of a semiconductor substrate and a manufacturing method of a semiconductor device, which prevent reduction in breakdown voltage of a gate oxide film of a device formed in a semiconductor substrate to improve a reliability of the gate oxide film. A manufacturing method of a semiconductor substrate according to the present invention includes: exposing a silicon surface of an active layer substrate 1 made of single-crystal silicon, to which a semiconductor device is formed; forming an oxide film on a support substrate 2 made of single-crystal silicon; and bonding the silicon surface of the active layer substrate 1 to the oxide film formed on the support substrate 2. The silicon surface of the active layer substrate 1 is exposed by removing a spontaneous oxidation film 7 formed on the surface.
    • 为了提供半导体衬底的制造方法和半导体器件的制造方法,其防止形成在半导体衬底中的器件的栅极氧化膜的击穿电压降低,以提高栅氧化膜的可靠性。 根据本发明的半导体衬底的制造方法包括:暴露由形成有半导体器件的单晶硅制成的有源层衬底1的硅表面; 在由单晶硅制成的支撑基板2上形成氧化膜; 并将有源层衬底1的硅表面粘合到形成在支撑衬底2上的氧化膜上。通过去除形成在表面上的自发氧化膜7,有源层衬底1的硅表面被暴露。
    • 8. 发明申请
    • OPTICAL MODULE
    • 光学模块
    • WO2007023713A1
    • 2007-03-01
    • PCT/JP2006/316066
    • 2006-08-09
    • NEC ELECTRONICS CORPORATIONTAKETOMI, KowashiHATAKEYAMA, ItirouSASAKI, Junichi
    • TAKETOMI, KowashiHATAKEYAMA, ItirouSASAKI, Junichi
    • G02B6/42G02B6/00
    • G02B6/4201G02B6/4243G02B6/4269G02B6/4279
    • The present invention enables the reduction in module manufacturing cost and size and the significant increase in reliability and mass productivity. The optical module 200 of the present invention includes the peripheral IC 214 to be electrically connected to the substrate 106, the photoelectric device 212 having the circuit surfaces 212d1 and 212e1 that serve as at least one of a light receiving portion for receiving an optical signal and a light emitting portion for emitting an optical signal, and the optical fiber 202 that extends substantially parallel to the substrate 106 and is optically connected to the photoelectric device 212. The photoelectric device 212 is placed in such a way that the circuit surfaces 212d1 and 212e1 are substantially perpendicular to the extending direction of the optical fiber 202. The body of the photoelectric device 212 is covered with the film having the line 212b for electrically connecting the circuit surfaces 212d1 and 212e1 with the optical module terminal 210 over the area from the circuit surfaces 212d1 and 212e1 to the peripheral IC 214.
    • 本发明能够降低模块制造成本和尺寸,并且显着提高可靠性和批量生产率。 本发明的光学模块200包括电连接到基板106的外围IC 214,具有用作接收光信号的光接收部分中的至少一个的电路面212d1和212e1的光电装置212以及 用于发射光信号的发光部分和基本上平行于基板106延伸并与光电装置212光学连接的光纤202.光电装置212以这样的方式放置,使得电路面212d1和212e1 基本上垂直于光纤202的延伸方向。光电器件212的主体被具有线212b的膜覆盖,用于将电路表面212d1和212e1与光学模块端子210电连接在电路的区域上 表面212d1和212e1连接到外围IC 214。